Clearing out method, revealing device, lithographic apparatus, and device manufacturing method

Patent metadata

Field	Value
Publication number	US-2020152527-A1
Application number	US-201816625861-A
Country	US
Kind code	A1
Filing date	May 28, 2018
Priority date	Jul 5, 2017
Publication date	May 14, 2020
Grant date	—

Abstract

A method for revealing sensor targets on a substrate covered with a layer, the method including: obtaining locations of first areas on the substrate with yielding target portions and of second areas on the substrate with non-yielding target portions; at least partially removing feature regions of the layer covering sensor targets in the second areas to reveal sensor targets in the second areas; measuring a location of the revealed sensor targets in the second areas; determining a location of sensor targets in the first areas based on the measured location of the revealed sensor targets in the second areas; and at least partially removing sensor target regions of the layer covering the sensor targets in the first areas using the determined location of the sensor targets in the first areas.

First claim

1 . A method for revealing sensor targets on a substrate covered with a layer, the method comprising:
obtaining locations of first areas on the substrate with yielding target portions and of second areas on the substrate with non-yielding target portions; at least partially removing feature regions of the layer covering features in the second areas to reveal features in the second areas; measuring a location of the revealed features in the second areas; determining a location of sensor targets in the first areas based on the measured location of the revealed features in the second areas; and at least partially removing sensor target regions of the layer covering the sensor targets in the first areas using the determined location of the sensor targets in the first areas.

2 . The method according to claim 1 , wherein the at least partially removing the feature regions comprises revealing at least two features that are substantially spaced apart.

3 . The method according to claim 1 , wherein the at least partially removing the feature and/or sensor target regions of the layer is carried out by laser ablation.

4 . The method according to claim 1 , further comprising filling at least the removed sensor target regions.

5 . The method according to claim 1 , wherein non-yielding target portions are at least incomplete target portions at an edge of the substrate.

6 . The method according to claim 1 , wherein an area of the feature region is larger than an area of the sensor target region.

7 . A revealing device configured for revealing sensor targets on a substrate covered with a layer, the revealing device comprising:
a layer removal device; a feature location determination device; and a control unit, wherein the control unit is configured to receive and/or store information about first areas on the substrate with yielding target portions and about second areas on the substrate with non-yielding target portions, and wherein the control unit is further configured to: control the layer removal device to at least partially remove feature regions of the layer covering features in the second areas to reveal the-features in the second areas, control the feature location determination device to measure a location of the revealed features in the second areas, determine a location of sensor targets in the first areas based on the measured location of the features in the second areas, and control the layer removal device to remove sensor target regions of the layer covering the sensor targets in the first areas using the determined location of the sensor targets in the first areas.

8 . The revealing device according to claim 7 , wherein the layer removal device comprises a laser.

9 . The revealing device according to claim 7 , wherein the feature location determination device comprises is a camera.

10 . The revealing device according to claim 7 , wherein an area of the feature region is larger than an area of the sensor target region.

11 . The revealing device according to claim 7 , wherein the feature location determination device is further configured to inspect a result of layer removal by the layer removal device.

12 . The revealing device according to claim 7 , further comprising a filling device to at least fill the removed sensor target regions with another material.

13 . A lithographic apparatus comprising a revealing device according to claim 7 .

14 . The lithographic apparatus according to claim 13 , wherein the revealing device is attached to a frame of the lithographic apparatus.

15 . A device manufacturing method wherein use is made of a revealing device according to claim 7 .

16 . A non-transitory computer program product comprising a computer-readable medium having instructions therein, the instructions, upon execution by a computer system, configured to cause the computer system to at least:
obtain a measured location of revealed features in areas on a substrate with non-yielding target portions, wherein at least partial removal of feature regions of a layer covering features in areas on the substrate with non-yielding target portions caused revealing of the revealed features; determine a location of sensor targets in areas on the substrate with yielding target portions based on the measured location of the revealed features; and generate information for causing at least partial removal of sensor target regions of a layer covering the sensor targets in the areas on the substrate with yielding target portions using the determined location of the sensor targets.

17 . The computer program product of claim 16 , wherein the at least partial removal of the feature and/or sensor target regions of the layer is carried out by laser ablation.

18 . The computer program product of claim 16 , wherein the instructions are further configured to generate information for filling at least the removed sensor target regions.

19 . The computer program product of claim 16 , wherein non-yielding target portions are at least incomplete target portions at an edge of the substrate.

20 . The computer program product of claim 16 , wherein an area of the feature region is larger than an area of the sensor target region.

Assignees

• Asml Netherlands Bv

Inventors

• Jeunink Andre Bernardus
• Voronina Victoria
• Druzhinina Tamara
• Peterson Brennan
• Pijnenburg Johannes Adrianus Cornelis Maria

Classifications

• G03F9/7084

  Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels · CPC title

• H01L2223/54426

  Electricity · mapped topic

• H01L23/544

  Electricity · mapped topic

• H01L22/20 Primary

  Electricity · mapped topic

• H01L21/31122

  Electricity · mapped topic