Heat treatment method and heat treatment apparatus for managing heat treatment of dummy wafer

Patent metadata

Field	Value
Publication number	US-2020144084-A1
Application number	US-201916658232-A
Country	US
Kind code	A1
Filing date	Oct 21, 2019
Priority date	Nov 5, 2018
Publication date	May 7, 2020
Grant date	—

Abstract

Product recipes in which a treatment procedure and treatment conditions of heat treatment of product wafers are specified are created timely. Dummy recipes in which a treatment procedure and treatment conditions of heat treatment of dummy wafers are specified are also created. Each of the product recipes and a corresponding one of the dummy recipes are stored in association with each other. Dummy treatment of a dummy wafer starts when a controller receives an advance notice signal indicating that product wafers will arrive at a heat treatment apparatus. The dummy wafers are stored in a dummy carrier permanently installed on a load port exclusive to the dummy carrier. The dummy treatment is performed in accordance with a dummy recipe associated with a product recipe corresponding to the product wafers scheduled to arrive at the heat treatment apparatus.

First claim

What is claimed is:

1 . A method of managing heat treatment of a dummy wafer, said method comprising the steps of:
(a) receiving an advance notice signal indicating that a product wafer will arrive at a heat treatment apparatus; and (b) starting heat treatment of a dummy wafer in said heat treatment apparatus upon receipt of said advance notice signal.

2 . The method according to claim 1 , wherein
said dummy wafer is transported out of a dummy carrier permanently installed on a load port exclusive to the dummy carrier and provided in said heat treatment apparatus and is heat-treated in said step (b).

3 . The method according to claim 1 , wherein
the heat treatment of said dummy wafer is performed in accordance with a dummy recipe associated with a product recipe in which a procedure and treatment conditions of heat treatment of the product wafer are specified in said step (b).

4 . A heat treatment apparatus for managing heat treatment of a dummy wafer, comprising:
a heat treatment part for heat-treating a dummy wafer; and a controller for causing the heat treatment of said dummy wafer to start upon receipt of an advance notice signal indicating that a product wafer will arrive at said heat treatment apparatus.

5 . The heat treatment apparatus according to claim 4 , further comprising
a load port exclusive to a dummy carrier, wherein said dummy wafer is transported out of a dummy carrier permanently installed on said load port and is transported to said heat treatment part when said advance notice signal is received.

6 . The heat treatment apparatus according to claim 4 , further comprising
a storage part for storing a product recipe in which a procedure and treatment conditions of heat treatment of said product wafer are specified and a dummy recipe in which a procedure and treatment conditions of the heat treatment of said dummy wafer are specified, said product recipe and said dummy recipe being stored in association with each other, wherein the heat treatment of said dummy wafer is performed in accordance with said dummy recipe associated with said product recipe when said advance notice signal is received.

Assignees

• Screen Holdings Co Ltd

Inventors

• Ikeda Shinichi

Classifications

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P72/3411

  involving loading and unloading of wafers · CPC title

• H10P72/3304

  characterised by movements or sequence of movements of transfer devices · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0436 Primary

  mainly by radiation · CPC title