Composite electronic component

Patent metadata

Field	Value
Publication number	US-2020105474-A1
Application number	US-201816197331-A
Country	US
Kind code	A1
Filing date	Nov 20, 2018
Priority date	Sep 28, 2018
Publication date	Apr 2, 2020
Grant date	—

Abstract

A composite electronic component includes: a composite body including a multilayer ceramic capacitor coupled to a ceramic chip, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween are stacked and first and second external electrodes disposed on opposite end portions of the first ceramic body in a length direction, respectively, and the ceramic chip including a second ceramic body including ceramic and first and second terminal electrodes, wherein a ratio of a length of the ceramic chip to a length of the multilayer ceramic capacitor is 0.7 to 1.0, and a ratio of a sum of a length of the first terminal electrode and a length of the second terminal electrode to the length of the ceramic chip is 0.3 to 0.6.

First claim

1 . A composite electronic component comprising:
a composite body comprising a multilayer ceramic capacitor coupled to a ceramic chip, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween are stacked and first and second external electrodes disposed on opposite end portions of the first ceramic body in a length direction, respectively, and the ceramic chip being disposed below the multilayer ceramic capacitor and including a second ceramic body and first and second terminal electrodes disposed on opposite end portions of the second ceramic body, respectively in the length direction, and connected to the first and second external electrodes, respectively, wherein a ratio of a length of the ceramic chip to a length of the multilayer ceramic capacitor is in a range from 0.7 to 1.0, and a ratio of a sum of a length of the first terminal electrode and a length of the second terminal electrode to the length of the ceramic chip is in a range from 0.3 to 0.6.

2 . The composite electronic component of claim 1 , wherein the ratio of the length of the ceramic chip to the length of the multilayer ceramic capacitor is in a range from 0.8 to 0.9.

3 . The composite electronic component of claim 1 , wherein the ratio of the sum of the length of the first terminal electrode and the length of the second terminal electrode to the length of the ceramic chip is in a range from 0.4 to 0.5.

4 . The composite electronic component of claim 1 , wherein a ratio of a width of the ceramic chip to a width of the multilayer ceramic capacitor is in a range from 0.7 to 1.0, and
a ratio of a width of each of the first and second terminal electrodes to the width of the ceramic chip is in a range from 0.7 to 1.0.

5 . The composite electronic component of claim 4 , wherein the ratio of the width of the ceramic chip to the width of the multilayer ceramic capacitor is in a range from 0.8 to 1.0.

6 . The composite electronic component of claim 4 , wherein the ratio of the width of each of the first and second terminal electrodes to the width of the ceramic chip is in a range from 0.8 to 0.9.

7 . The composite electronic component of claim 1 , wherein the internal electrodes in the first ceramic body are stacked perpendicular to a mounting surface of the composite body.

8 . The composite electronic component of claim 1 , wherein the multilayer ceramic capacitor and the ceramic chip are coupled to each other by a conductive adhesive applied to upper surfaces of the first and second terminal electrodes.

9 . The composite electronic component of claim 1 , wherein the multilayer ceramic capacitor has a size of a 0804 size (length×width: 0.8 mm×0.4 mm) or less, and has a thickness of 0.7 mm or less.

10 . A composite electronic component comprising:
a composite body comprising a multilayer ceramic capacitor coupled to a ceramic chip, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween are stacked and first and second external electrodes disposed on opposite end portions of the first ceramic body in a length direction, respectively, and the ceramic chip being disposed below the multilayer ceramic capacitor and including a second ceramic body and first and second terminal electrodes disposed on opposite end portions of the second ceramic body in the length direction, respectively, and connected to the first and second external electrodes, respectively, wherein a ratio of a width of the ceramic chip to a width of the multilayer ceramic capacitor is in a range from 0.7 to 1.0, and a ratio of a width of each of the first and second terminal electrodes to the width of the ceramic chip is in a range from 0.7 to 1.0.

11 . The composite electronic component of claim 10 , wherein the ratio of the width of the ceramic chip to the width of the multilayer ceramic capacitor is in a range from 0.8 to 1.0.

12 . The composite electronic component of claim 10 , wherein the ratio of the width of each of the first and second terminal electrodes to the width of the ceramic chip is in a range from 0.8 to 0.9.

13 . The composite electronic component of claim 10 , wherein the internal electrodes in the first ceramic body are stacked perpendicular to a mounting surface of the composite body.

14 . The composite electronic component of claim 10 , wherein the multilayer ceramic capacitor and the ceramic chip are coupled to each other by conductive adhesives applied to upper surfaces of the first and second terminal electrodes.

15 . The composite electronic component of claim 10 , wherein the multilayer ceramic capacitor has a size of a 0804 size (length×width: 0.8 mm×0.4 mm) or less, and has a thickness of 0.7 mm or less.

16 . A composite electronic component comprising:
a multilayer ceramic capacitor including first internal electrodes connected to a first external electrode and second internal electrodes connected to a second external electrode, the first and second internal electrodes being alternately disposed with dielectric layers interposed therebetween, the dielectric layers forming a first ceramic body such that the first and second external electrodes are disposed on opposite end portions of the first ceramic body in a length direction; and a ceramic chip disposed below the multilayer ceramic capacitor in a thickness direction, the ceramic chip comprising a second ceramic body and first and second terminal electrodes disposed on opposite ends of the second ceramic body in the length direction, the ceramic chip having a length and a width smaller than those of the first ceramic body, wherein a ratio of a width of each of the first and second terminal electrodes to the width of the ceramic chip is in a range from 0.7 to 1.0.

17 . The composite electronic component of claim 16 , wherein a ratio of a width of the ceramic chip to a width of the multilayer ceramic capacitor is in a range from 0.7 to 1.0.

18 . The composite electronic component of claim 16 , wherein a ratio of a length of the ceramic chip to a length of the multilayer ceramic capacitor is in a range from 0.7 to 1.0.

19 . The composite electronic component of claim 16 , wherein a ratio of a sum of a length of the first terminal electrode and a length of the second terminal electrode to the length of the ceramic chip is in a range from 0.3 to 0.6.

Assignees

• Samsung Electro Mech

Inventors

• Son Soo Hwan
• Kim Ho Yoon
• Park Sang Soo
• Shin Woo Chul

Classifications

• H01G4/005

  Electrodes · CPC title

• H01G4/1218

  based on titanium oxides or titanates (H01G4/1245 takes precedence) · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K2201/10636

  Leadless chip, e.g. chip capacitor or resistor · CPC title

• H01G4/228

  Terminals · CPC title