Window member and manufacturing method thereof
US-2024336031-A1 · Oct 10, 2024 · US
Pressure-sensitive adhesive tape
US2020048506A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020048506-A1 |
| Application number | US-201916503721-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 5, 2019 |
| Priority date | Aug 8, 2018 |
| Publication date | Feb 13, 2020 |
| Grant date | — |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
Provided is a pressure-sensitive adhesive tape capable of preventing an increase in internal pressure when used for, for example, forming a closed space. The pressure-sensitive adhesive tape is a pressure-sensitive adhesive tape, including, in this order: a first pressure-sensitive adhesive layer; an intermediate layer; and a second pressure-sensitive adhesive layer, the pressure-sensitive adhesive tape having at least one through-hole that penetrates through the pressure-sensitive adhesive tape in a plane direction thereof.
First claim
Opening claim text (preview).
What is claimed is: 1 . A pressure-sensitive adhesive tape, comprising, in this order: a first pressure-sensitive adhesive layer; an intermediate layer; and a second pressure-sensitive adhesive layer, the pressure-sensitive adhesive tape having at least one through-hole that penetrates through the pressure-sensitive adhesive tape in a plane direction thereof. 2 . The pressure-sensitive adhesive tape according to claim 1 , wherein the through-hole is arranged so as to penetrate through the pressure-sensitive adhesive tape in a widthwise direction thereof. 3 . The pressure-sensitive adhesive tape according to claim 1 , wherein the intermediate layer comprises a printed layer formed by printing. 4 . The pressure-sensitive adhesive tape according to claim 2 , wherein the intermediate layer comprises a printed layer formed by printing. 5 . The pressure-sensitive adhesive tape according to claim 3 , further comprising a base material layer between the printed layer and the second pressure-sensitive adhesive layer, wherein the printed layer is laminated with the base material layer, and wherein the through-hole is defined by a printed pattern of the printed layer, the first pressure-sensitive adhesive layer, and the base material layer. 6 . The pressure-sensitive adhesive tape according to claim 4 , further comprising a base material layer between the printed layer and the second pressure-sensitive adhesive layer, wherein the printed layer is laminated with the base material layer, and wherein the through-hole is defined by a printed pattern of the printed layer, the first pressure-sensitive adhesive layer, and the base material layer. 7 . The pressure-sensitive adhesive tape according to claim 1 , wherein the intermediate layer has a thickness of from 0.1 μm to 100 μm. 8 . The pressure-sensitive adhesive tape according to claim 1 , wherein the pressure-sensitive adhesive tape has a total thickness of from 1 μm to 500 μm.
Assignees
Inventors
Classifications
based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds · CPC title
- C09J7/38Primary
Pressure-sensitive adhesives [PSA] · CPC title
characterised by a primer layer between the carrier and the adhesive · CPC title
in the primer coating · CPC title
Presence of (meth)acrylic polymer · CPC title
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Frequently asked questions
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- What does patent US2020048506A1 cover?
- Provided is a pressure-sensitive adhesive tape capable of preventing an increase in internal pressure when used for, for example, forming a closed space. The pressure-sensitive adhesive tape is a pressure-sensitive adhesive tape, including, in this order: a first pressure-sensitive adhesive layer; an intermediate layer; and a second pressure-sensitive adhesive layer, the pressure-sensitive adhe…
- Who is the assignee on this patent?
- Nitto Denko Corp
- What technology area does this patent fall under?
- Primary CPC classification C09J7/38. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Feb 13 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).