Euv light source and apparatus for lithography

US2020004167A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2020004167-A1
Application numberUS-201916415642-A
CountryUS
Kind codeA1
Filing dateMay 17, 2019
Priority dateJun 28, 2018
Publication dateJan 2, 2020
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An extreme ultraviolet (EUV) radiation source apparatus includes a collector and a target droplet generator for generating a tin (Sn) droplet. A debris collection device is disposed over a reflection surface of the collector, and at least one drip hole is located between the debris collection device and the collector. A tin bucket for collecting debris from the debris collection device is located below the at least one drip hole, and a tube or guide rod extends from the drip hole to the tin bucket.

First claim

Opening claim text (preview).

What is claimed is: 1 . An extreme ultraviolet (EUV) radiation source apparatus, comprising: a collector; a target droplet generator for generating a tin (Sn) droplet; a debris collection device disposed over a reflection surface of the collector; at least one drip hole located between the debris collection device and the collector; a tin bucket for collecting debris from the debris collection device located below the at least one drip hole; and a tube or guide rod extending from the drip hole to the tin bucket. 2 . The EUV radiation source apparatus of claim 1 , further comprising a heater connected to the tube or guide rod. 3 . The EUV radiation source apparatus of claim 2 , wherein the heater further comprises a heater controller to control heating of the tube or guide rod. 4 . The EUV radiation source apparatus of claim 2 , wherein the heater comprises heating tape wrapped around the tube. 5 . The EUV radiation source apparatus of claim 2 , wherein the tube is clad and a portion of the heater is embedded in cladding surrounding the tube. 6 . The EUV radiation source apparatus of claim 2 , wherein the guide rod includes a hollow portion and the heater includes a heating element located in the hollow portion of the guide rod. 7 . The EUV radiation source apparatus of claim 1 , wherein the tube or guide rod comprises a thermally conductive metal. 8 . The EUV radiation source apparatus of claim 7 , wherein the thermally conductive metal is selected from the group consisting of aluminum, brass, nickel, steel, tungsten, and zinc. 9 . The EUV radiation source apparatus of claim 1 , comprising: a plurality of drip holes located below a lower circumference of the debris collection device; a plurality of tin buckets, wherein each tin bucket is located below at least one of the drip holes; and a plurality of tubes or guide rods, wherein each tube or guide rod extends from one of the drip holes to one of the tin buckets. 10 . The EUV radiation source apparatus of claim 9 , comprising a plurality of heaters, wherein each heater is connected to one of the tubes or guide rods. 11 . An extreme ultraviolet (EUV) radiation source apparatus, comprising: an ellipsoidal EUV reflector; a target droplet generator; a frustoconical-shaped debris collection mechanism disposed over the ellipsoidal EUV reflector, wherein the frustoconical-shaped debris collection mechanism comprises a plurality of vanes extending between an upper annular-shaped support frame and a lower annular-shaped support frame; a fluid passage located below the plurality of vanes; a receptacle located below the fluid passage; and a tube or rod extending from the fluid passage to the receptacle. 12 . The EUV radiation source apparatus of claim 11 , further comprising a heater connected to the tube or rod. 13 . The EUV radiation source apparatus of claim 12 , wherein the heater further comprises a heater controller to control heating of the tube or rod. 14 . The EUV radiation source apparatus of claim 12 , wherein the heater comprises heating tape wrapped around the tube. 15 . The EUV radiation source apparatus of claim 12 , wherein the rod includes a hollow portion and the heater includes a heating element located in the hollow portion of the rod. 16 . A method for generating an extreme ultraviolet (EUV) radiation, comprising: irradiating a tin droplet with laser light in an EUV radiation source apparatus, thereby creating the EUV radiation and tin debris; and heating a tube or guide rod between a drip hole and a tin bucket, thereby causing tin debris deposited about the drip hole to flow. 17 . The method according to claim 16 , wherein the heating the tube or guide rod comprises applying electrical resistance heating using a heating element connected to the tube or guide rod. 18 . The method according to claim 17 , wherein the heating element is a heating tape wrapped around the tube. 19 . The method according to claim 17 , wherein the guide rod includes a hollow portion and the heating element is located in the hollow portion. 20 . The method according to claim 17 , further comprising controlling the heating a tube or guide rod using a heater controller connected to the heating element.

Assignees

Inventors

Classifications

  • G03F7/2004Primary

    characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light · CPC title

  • by plasma extreme ultraviolet [EUV] sources · CPC title

  • Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps · CPC title

  • Lamphouse reflector arrangements or collector mirrors, i.e. collecting light from solid angle upstream of the light source · CPC title

  • Electricity · mapped topic

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Frequently asked questions

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What does patent US2020004167A1 cover?
An extreme ultraviolet (EUV) radiation source apparatus includes a collector and a target droplet generator for generating a tin (Sn) droplet. A debris collection device is disposed over a reflection surface of the collector, and at least one drip hole is located between the debris collection device and the collector. A tin bucket for collecting debris from the debris collection device is locat…
Who is the assignee on this patent?
Taiwan Semiconductor Mfg Co Ltd
What technology area does this patent fall under?
Primary CPC classification G03F7/2004. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Jan 02 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).