Dispensing Nozzle Design and Dispensing Method Thereof

Patent metadata

Field	Value
Publication number	US-2020004153-A1
Application number	US-201816124579-A
Country	US
Kind code	A1
Filing date	Sep 7, 2018
Priority date	Jun 28, 2018
Publication date	Jan 2, 2020
Grant date	—

Abstract

An apparatus for dispensing fluid includes a fluid source; a nozzle having an inner layer and an outer layer, the inner layer defining a bore in fluid communication with the fluid source; and a plurality of pins each moveable to be in physical contact with the outer layer, wherein the plurality of pins is operable to apply a force towards the outer layer to adjust a cross-section of the bore.

First claim

What is claimed is:

1 . An apparatus for dispensing fluid, comprising:
a fluid source; a nozzle having an inner layer and an outer layer, the inner layer defining a bore in fluid communication with the fluid source; and a plurality of pins each moveable to be in physical contact with the outer layer, wherein the plurality of pins is operable to apply a force towards the outer layer to adjust a cross-section of the bore.

2 . The apparatus of claim 1 , wherein each of the plurality of pins is moveable in a direction perpendicular to a longitudinal axis of the bore.

3 . The apparatus of claim 1 , wherein each of the plurality of pins is movable by applying a gaseous pressure.

4 . The apparatus of claim 1 , wherein the inner and outer layers are made of elastic material.

5 . The apparatus of claim 4 , wherein the elastic material of the inner layer is more rigid than that of the outer layer.

6 . The apparatus of claim 1 , wherein the inner and outer layers form a cavity that can be inflated by pumping in gas.

7 . The apparatus of claim 1 , wherein the cross-section of the bore is adjustable to vary in shapes.

8 . The apparatus of claim 7 , wherein the shapes are selected from triangle, rectangle, square, circle, oval, and polygon.

9 . The apparatus of claim 1 , wherein the cross-section of the bore is adjustable to vary in cross-sectional areas along a longitudinal axis of the bore.

10 . The apparatus of claim 1 , further comprising:
a gas outlet nozzle in a proximity region of an orifice of the nozzle, wherein the gas outlet nozzle is operable to increase an ambient pressure in the proximity region.

11 . The apparatus of claim 1 , further comprising:
a moveable arm attached to the nozzle, the moveable arm being operable to move the nozzle horizontally and vertically.

12 . The apparatus of claim 1 , further comprising:
a rotatable platform to hold and rotate a substrate to coat with the fluid dispensed from the nozzle.

13 . An apparatus for semiconductor manufacturing, comprising:
a wafer chuck; a dispensing outlet positioned above the wafer chuck, wherein the dispensing outlet includes at least two orifices, each orifice having a different cross-sectional shape; a delivery conduit coupled to a fluid source, wherein the delivery conduit is operable to couple with one of the at least two orifices for fluid communication; and a gas sprayer in a proximity region of the at least two orifices, wherein the gas sprayer is operable to spray a gas to increase an ambient pressure in the proximity region.

14 . The apparatus of claim 13 , wherein each orifice is controlled by an adjustable flow control valve.

15 . The apparatus of claim 13 , wherein each orifice has a corresponding inlet adapter to mechanically latch to the delivery conduit.

16 . The apparatus of claim 15 , further comprising:
a movable mechanism attached to the delivery conduit, the movable mechanism is operable to move the delivery conduit with reference to the dispensing outlet.

17 . The apparatus of claim 13 , wherein the at least two orifices include at least one orifice with a triangular cross-section.

18 . The apparatus of claim 13 , wherein the gas sprayer is operable to vary a flow rate of the gas during a dispensing operation.

19 . A method of dispensing fluid, comprising:
providing a substrate; positioning a nozzle above the substrate; determining a cross-sectional shape of the nozzle; configuring the nozzle to have the determined cross-sectional shape; and applying a fluid to the substrate through the nozzle with the determined cross-sectional shape.

20 . The method of claim 19 , further comprising:
determining a different cross-sectional shape of the nozzle; and configuring the nozzle to have the determined different cross-sectional shape during the applying of the fluid to the substrate.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Cheng wei chang
• Liao Chi-Hung

Classifications

• H10P76/204

  of organic photoresist masks · CPC title

• G03F7/16

  Coating processes; Apparatus therefor (applying coatings to base materials in general B05; applying photosensitive compositions to base for photographic purposes G03C1/74) · CPC title

• G03F7/162 Primary

  Coating on a rotating support, e.g. using a whirler or a spinner · CPC title

• B05B1/005

  Nozzles or other outlets specially adapted for discharging one or more gases · CPC title

• H01L21/0273

  Electricity · mapped topic