Component Carrier With Only Partially Filled Thermal Through-Hole

Patent metadata

Field	Value
Publication number	US-2019357364-A1
Application number	US-201815981996-A
Country	US
Kind code	A1
Filing date	May 17, 2018
Priority date	May 17, 2018
Publication date	Nov 21, 2019
Grant date	—

Abstract

A component carrier includes at least one electrically conductive layer structure and at least one electrically insulating layer structure, a through-hole extending through the at least one electrically insulating layer structure, and highly thermally conductive material filling only part of the through-hole so that a recess is formed which is not filled with the highly thermally conductive material and which extends at least from an outer face of the at least one electrically insulating layer structure into the through-hole. Where a diameter, B, of the recess at a level of the outer face of the at least one electrically insulating layer structure and a width, A, of a web of the highly thermally conductive material at the level of the outer face of the at least one electrically insulating layer structure fulfill the conditions B>A and A>B/20.

First claim

1 . A component carrier, wherein the component carrier comprises:
at least one electrically conductive layer structure and at least one electrically insulating layer structure; a through-hole extending through the at least one electrically insulating layer structure; highly thermally conductive material filling only part of the through-hole so that a recess is formed which is not filled with the highly thermally conductive material and which extends at least from an outer face of the at least one electrically insulating layer structure into the through-hole; wherein a diameter, B, of the recess at a level of the outer face of the at least one electrically insulating layer structure and a width, A, of a web of the highly thermally conductive material at the level of the outer face of the at least one electrically insulating layer structure fulfill the condition B>A.

2 . The component carrier according to claim 1 , comprising one of the features:
wherein A>B/20; wherein a ratio between a vertical height, D, and a maximum horizontal thickness, C, of the through-hole is in a range between 1 and 15; wherein the through-hole is substantially circular cylindrically; wherein a thickness of the at least one electrically insulating layer structure through which the through-hole extends is larger than 400 μm; wherein a value of the thermal conductivity of the highly thermally conductive material is at least 50 W/mK; wherein the highly thermally conductive material comprises or consists of copper; wherein the highly thermally conductive material comprises or consists of electrically insulating material.

3 . The component carrier according to claim 1 , wherein a further recess is formed in the highly thermally conductive material opposing the recess, wherein the further recess is not filled with the highly thermally conductive material and extends at least from another outer face of the at least one electrically insulating layer structure into the through-hole.

4 . The component carrier according to claim 3 , wherein a diameter, E, of the further recess at a level of the other outer face of the at least one electrically insulating layer structure and a width, F, of another web of the highly thermally conductive material at the level of the other outer face of the at least one electrically insulating layer structure fulfill the conditions E>F and F>E/20.

5 . The component carrier according to claim 4 , wherein B substantially equals E and/or A substantially equals F.

6 . The component carrier according to claim 3 , wherein the highly thermally conductive material together with the recess and with the further recess form a symmetric structure with respect to a horizontal plane extending through a center of the at least one electrically insulating layer structure through which the through-hole extends.

7 . The component carrier according to claim 3 , wherein a cross section of the highly thermally conductive material together with the recess and the further recess along a vertical plane is a substantially H-shaped structure.

8 . The component carrier according to claim 3 , wherein a ratio between a vertical distance, G, between an innermost end of the recess and an innermost end of the further recess on the one hand and a height, D, of the through-hole on the other hand is in a range between 30% and 95%.

9 . The component carrier according to claim 1 , wherein at least one of the group consisting of the recess and the further recess is filled with a dielectric material.

10 . The component carrier according to claim 1 , comprising at least one further electrically insulating layer structure connected to an exterior surface of at least one of the at least one electrically insulating layer structure, the at least one electrically conductive layer structure, and further highly thermally conductive material, wherein the at least one further electrically insulating layer structure fills at least one of the recess and the further recess.

11 . The component carrier according to claim 10 , wherein an area of a main surface of the at least one further electrically insulating layer structure facing at least one of the recess and the further recess is larger by 0.1% to 500%, than a hypothetic area of said main surface in the absence of the recess or the further recess.

12 . The component carrier according to claim 1 , comprising one of the following features:
comprising at least one further electrically insulating layer structure connected to an exterior surface of at least one of the at least one electrically insulating layer structure, the at least one electrically conductive layer structure, and further highly thermally conductive material, wherein the at least one further electrically insulating layer structure is planar; wherein a maximum horizontal thickness, C, of the through-hole is at least 100 μm; wherein a maximum depth of at least one of the recess and the further recess is at least 100 μm.

13 . The component carrier according to claim 1 , wherein the highly thermally conductive material has a further web at the level of the outer face of the at least one electrically insulating layer structure, wherein the further web is arranged opposing the web in a horizontal direction so that the recess is located between the web and the further web.

14 . The component carrier according to claim 13 , wherein the further web has a width, I, at the level of the outer face of the at least one electrically insulating layer structure fulfilling the conditions B>I and I>B/20.

15 . The component carrier according to claim 13 , wherein the web and the further web are arranged symmetric with respect to a vertical plane extending through a central axis of the through-hole.

16 . The component carrier according to claim 1 , wherein the highly thermally conductive material in the through-hole is continuously connected via the web with further highly thermally conductive material covering at least part of a main surface of the at least one electrically insulating layer structure, wherein the further highly thermally conductive material is shaped as a layer which is interrupted by the recess.

17 . The component carrier according to claim 3 , wherein the recess is connected with the further recess, wherein at least one of the recess and the further recess is at least partially filled with electrically conductive material.

18 . The component carrier according to claim 1 , comprising at least one of the following features:
the at least one electrically conductive layer structure comprises at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten, any of the mentioned materials being optionally coated with supra-conductive material such as graphene; the at least one electrically insulating layer structure comprises at least one of the group consisting of resin, reinforced or non-reinforced resin, epoxy resin or Bismaleimide-Triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based Build-Up Film, polytetrafluoroethylene, a ceramic, and a metal oxide; the component carrier comprises at least one embedded and/or at least one surface mounted component, wherein the at least one component is selected from a group consisting of an electronic component, an electrically non-conductive and/or electrically conductive inlay, a heat transfer unit, an energy harvesting unit, an active electronic component, a passive electronic component, an electronic ch

Assignees

• At & S Austria Tech & Systemtechnik Ag

Inventors

• Lutschounig Ferdinand
• Liebfahrt Sabine
• Grober Gernot
• Matt Florian

Classifications

• H05K3/423

  characterised by electroplating method · CPC title

• H05K1/0206 Primary

  by printed thermal vias · CPC title

• H05K3/429 Primary

  Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers · CPC title

• H05K1/116

  Lands, clearance holes or other lay-out details concerning the surrounding of a via · CPC title

• H05K1/112

  directly combined with via connections · CPC title