Rapid curing epoxy repair composition and use thereof
US-2024360306-A1 · Oct 31, 2024 · US
US2019276662A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2019276662-A1 |
| Application number | US-201716344751-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 24, 2017 |
| Priority date | Oct 25, 2016 |
| Publication date | Sep 12, 2019 |
| Grant date | — |
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Solvent free epoxy system that includes: a hardener compound H comprising: a molecular structure (Y1—R1—Y2), wherein R1 is an ionic moiety Y1 is a nucleophilic group and Y2 nucleophilic group; and an ionic moiety A acting as a counter ion to R1; and an epoxy compound E comprising: a molecular structure (Z1R2—Z2), wherein R1 is an ionic moiety, Z1 comprises an epoxide group, and Z2 comprises an epoxide group; and an ionic moiety B acting as a counter ion to R2. In embodiments, the epoxy compound E and/or the hardener H is comprised in a solvent-less ionic liquid. The systems can further include accelerators, crosslinkers, plasticizers, inhibitors, ionic hydrophobic and/or super-hydrophobic compounds, ionic hydrophilic compounds, ionic transitional hydrophobic/hydrophilic compounds, biological active compounds, and/or plasticizer compounds. Polymers made from the disclosed epoxy systems and their methods of used.
Opening claim text (preview).
1 . A low or solvent free epoxy system comprising: a hardener compound H comprising: a molecular structure (Y 1 —R 1 —Y 2 ), wherein R 1 is an ionic moiety Y 1 is a nucleophilic group, and Y 2 nucleophilic group; and an ionic moiety A acting as a counter ion to R 1 ; and an epoxy compound E comprising: a molecular structure (Z 1 —R 2 —Z 2 ), wherein R 2 is an ionic moiety, Z 1 comprises an epoxide group, and Z 2 comprises an epoxide group; and an ionic moiety B acting as a counter ion to R 2 . 2 . The epoxy system of claim 1 , wherein the epoxy compound E is a solvent-less ionic liquid. 3 . The epoxy system of claim 1 , wherein Y 1 and Y 2 comprise a nucleophile independently selected from: a NH 2 group, a SH group, an OH group, a SeH group, and a PH 2 group. 4 . The epoxy system of claim 1 , wherein the hardener compound H is a solvent-less ionic liquid. 5 . (canceled) 6 . (canceled) 7 . The epoxy system of claim 1 , further comprising one or more of an accelerator, a crosslinker, a plasticizer, or an inhibitor. 8 . (canceled) 9 . The epoxy system of claim 1 , further comprising an ionic hydrophobic and/or super-hydrophobic compound. 10 . The epoxy system of claim 9 , wherein the ionic hydrophobic and/or super-hydrophobic compound is released as an ionic liquid upon polymerization of hardener compound H and epoxy compound E to modify the properties of a polymer produced. 11 . (canceled) 12 . The epoxy system of claim 1 , further comprising an ionic hydrophilic compound. 13 . The epoxy system of claim 12 , wherein the ionic hydrophilic compound is released as an ionic liquid upon polymerization of hardener compound H and epoxy compound E to modify the properties of a polymer produced. 14 . The epoxy system of claim 1 , further comprising an ionic transitional hydrophobic/hydrophilic compound. 15 . The epoxy system of claim 14 , wherein the ionic transitional hydrophobic/hydrophilic compound is released as an ionic liquid upon polymerization of hardener compound H and epoxy compound E to modify the properties of a polymer produced. 16 . (canceled) 17 . The epoxy system of claim 1 , further comprising a biological active (BAIL, Biological Active Ionic Liquid) compound. 18 . The epoxy system of claim 17 , wherein biological active (BAIL, Biological Active Ionic Liquid) compound is released as an ionic liquid upon polymerization of hardener compound H and epoxy compound E to modify the properties of a polymer produced. 19 . (canceled) 20 . The epoxy system of claim 1 , further comprising a plasticizer compound. 21 . The epoxy system of claim 20 , wherein the plasticizer compound is released as an ionic liquid upon polymerization of hardener compound H and epoxy compound E to modify the properties of a polymer produced. 22 . (canceled) 23 . The epoxy system of claim 20 , wherein the plasticizer compound has a low to zero volatility. 24 . The epoxy system of claim 1 , wherein a polymer produced upon polymerization of hardener compound H and epoxy compound E comprises self-healing properties due to the presence of stable electrical charges along to the polymeric chains that drive the healing process through electrostatic attraction. 25 . The epoxy system of claim 1 , wherein a polymer produced upon polymerization of hardener compound H and epoxy compound E forms a highly and regular porous system. 26 . The epoxy system of claim 25 , wherein the polymer produced is a filtration membrane, a solid electrolyte, or an exchange membrane. 27 . A polymer produced by the polymerization of the epoxide system of any one of claim 1 . 28 . The polymer of claim 27 , wherein the polymer comprises a solid electrolyte. 29 . An electronic component comprising the polymer of claim 28 . 30 . The electronic component of claim 29 , wherein electronic component is a component of a battery, a capacitor, a piezoelectric material and/or an electro-actuator.
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