Curable resin composition and electronic component device
US-2025282945-A1 · Sep 11, 2025 · US
containing sulfur
containing sulfur · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/302 |
| Official title | {containing sulfur} |
| Display label | containing sulfur |
| Total patents | 58 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 1 |
| 2017 | 2 |
| 2018 | 8 |
| 2019 | 10 |
| 2020 | 10 |
| 2021 | 9 |
| 2022 | 9 |
| 2023 | 2 |
| 2024 | 2 |
| 2025 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Glycidyl ether group-containing compound, curable resin composition, cured object, and laminate
US-2025277081-A1 · Sep 4, 2025 · US
Semiconductor encapsulation composition and semiconductor package including the same
US-2025259903-A1 · Aug 14, 2025 · US
Polymerizable composition for optical materials and application of same
US-12275813-B2 · Apr 15, 2025 · US
Coating method for cationic electrodeposition coating material
US-11959188-B2 · Apr 16, 2024 · US
Solvent-less ionic liquid epoxy resin
US-11859077-B2 · Jan 2, 2024 · US
Aliphatic epoxy-terminated polysulfide polymer
US-11851531-B2 · Dec 26, 2023 · US
Formaldehyde free microspheres and encapsulation
US-11560447-B2 · Jan 24, 2023 · US
Adhesive compositions
US-2022275253-A1 · Sep 1, 2022 · US
Highly thermally conductive epoxy compound, and composition, material for semiconductor package, molded product, electric and electronic device and semiconductor package including the same
US-11421073-B2 · Aug 23, 2022 · US
Polymerizable composition for optical material and optical material and plastic lens obtainable from same composition
US-11414515-B2 · Aug 16, 2022 · US
In-situ polymerized type thermoplastic prepreg, thermoplastic composite, and methods of manufacturing the same
US-11384211-B2 · Jul 12, 2022 · US
Biodegradable polyester and method for preparing the same
US-2022204752-A1 · Jun 30, 2022 · US
Thermosetting resin composition, prepreg, fiber-reinforced plastic molded body and method for producing same
US-2022153923-A1 · May 19, 2022 · US
Thermosetting resin composition, prepreg, fiber-reinforced plastic molded body and method for producing same
US-11292874-B2 · Apr 5, 2022 · US
Resist underlayer film-forming composition
US-11287741-B2 · Mar 29, 2022 · US
Lactide copolymers and ring-opened lactide copolymers
US-11267936-B2 · Mar 8, 2022 · US
Aliphatic epoxy-terminated polysulfide polymer
US-2021363305-A1 · Nov 25, 2021 · US
Solvent-less ionic liquid epoxy resin
US-2021363341-A1 · Nov 25, 2021 · US
Controlled glass transition polymeric material and method
US-11155673-B2 · Oct 26, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/302?
- CPC C08G59/302 is the Cooperative Patent Classification code for “containing sulfur.”
- How many patents are filed under CPC C08G59/302 (containing sulfur)?
- Our database includes 58 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/302 growing?
- Publication counts under this code: 2 in 2024 vs 4 in 2025 (latest complete years).