Electronic system comprising a microelectromechanical system and a box encapsulating this microelectromechanical system

Patent metadata

Field	Value
Publication number	US-2019276307-A1
Application number	US-201916293330-A
Country	US
Kind code	A1
Filing date	Mar 5, 2019
Priority date	Mar 7, 2018
Publication date	Sep 12, 2019
Grant date	—

Abstract

The beams are thermally coupled to the sensitive part and are electrically coupled to one another. The system further includes a thermal regulator of the electromechanical microsystem including an electrical circuit including at least two ends connected to the beams, and a circuit controller able to generate an electrical current in the electrical circuit to modify the temperature of the sensitive part.

First claim

1 . An electronic system comprising an electromechanical microsystem and a hermetic box under vacuum encapsulating said electromechanical microsystem;
the box including a fastening plane; the electromechanical microsystem including: a sensitive part; and at least two beams connecting the sensitive part to the fastening plane, each beam being made from an at least partially conductive material; wherein the beams are thermally coupled to the sensitive part and are electrically coupled to one another; and wherein the system further includes a thermal regulator of the electromechanical microsystem including an electrical circuit including at least two ends connected to the beams, and a circuit controller able to generate an electrical current in the electrical circuit to modify the temperature of the sensitive part.

2 . The system according to claim 1 , wherein the thermal regulator further includes an elementary sensor able to measure at least one parameter of the sensitive part varying as a function of the temperature thereof;
the circuit controller being able to generate an electrical current in the electrical circuit as a function of the measurements supplied by the elementary sensor.

3 . The system according to claim 1 , wherein each beam is connected to the fastening plane via a fastening element integrated into said plane at a point of contact;
each end of the electrical circuit being electrically connected to one of the points of contact.

4 . The system according to claim 1 , wherein the fastening plane forms the inner surface of a face of the box.

5 . The system according to claim 1 , wherein the fastening plane is attached to each face of the box and thermally insulated from the latter.

6 . The system according to claim 5 , wherein the fastening plane is open-worked.

7 . The system according to claim 1 , wherein the thermal regulator further includes a Peltier module thermally coupled to the sensitive part.

8 . The system according to claim 1 , wherein each beam and/or the sensitive part are/is made from a silicon-based material.

9 . The system according to claim 1 , further including an insulating layer arranged between the sensitive part and the beams.

10 . The system according to claim 9 , including an intermediate layer in which the sensitive part is etched and a lower layer forming the beams;
the intermediate layer and the lower layer being electrically insulated and thermally coupled, via the insulating layer.

11 . The system according to claim 10 , wherein the lower layer further includes a central substrate in contact with the insulating layer and electrically coupling the beams.

12 . The system according to claim 1 , wherein each beam is a decoupling arm that is deformable in flexion.

13 . The system according to claim 1 , forming a sensor.

14 . The system according to claim 13 , wherein said sensor is an inertial sensor.

15 . The system according to claim 1 , wherein each beam is able to emit heat when an electric current is generated in the electrical circuit.

Assignees

• Thales Sa

Inventors

• Leverrier Bertrand
• Sarno Claude
• Rougeot Claude
• Hodot Romain

Classifications

• B81B7/0096

  by heating · CPC title

• B81B2207/097

  Interconnects arranged on the substrate or the lid, and covered by the package seal · CPC title

• B81B7/0093

  by cooling · CPC title

• B81B7/007

  Interconnections between the MEMS and external electrical signals · CPC title

• B81B7/0087 Primary

  On-device systems and sensors for controlling, regulating or monitoring · CPC title