Parallel seam welding leadless ceramic package

Patent metadata

Field	Value
Publication number	US-2019259692-A1
Application number	US-201716314543-A
Country	US
Kind code	A1
Filing date	Aug 28, 2017
Priority date	Jun 30, 2016
Publication date	Aug 22, 2019
Grant date	—

Abstract

The application discloses a parallel seam welding leadless ceramic package, including a ceramic, a sealing ring and a metal cover plate; a back surface of the ceramic is provided with a back grounding metal pattern, and the back grounding metal pattern is provided with several outwardly protruding grounding terminals, a RF signal transmission pad is disposed between every two adjacent grounding terminals, the front grounding metal pattern and the back grounding metal pattern are interconnected by the internal and/or external metallized interconnection holes, the front grounding line and the back grounding metal pattern is interconnected by the internal or external metallized interconnection holes, and the RF signal transmission lines are interconnected to the RF signal transmission pad by a separated external and/or external metallized interconnection hole.

First claim

What is claimed is:

1 . A parallel seam welding leadless ceramic package, comprising: a ceramic ( 1 ), a sealing ring ( 2 ) and a metal cover plate;
wherein the ceramic ( 1 ) is a container structure with an opening at an upper end, the metal cover plate seals the opening of the upper end of the ceramic ( 1 ) via the sealing ring ( 2 ), wherein an upper surface of the ceramic ( 1 ) comprising a first layer, a second layer, and a third layer that are consecutive with heights gradually decreasing from the outside to the inside, the second layer is provided thereon with a plurality of RF signal transmission lines ( 4 ), and both sides of each of the RF signal transmission lines ( 4 ) are respectively provided with grounding lines ( 5 ), the grounding lines ( 5 ) are located on the first layer ( 6 ) and the second layer ( 3 ), and the grounding lines on the first layer and the second layer are interconnected by internal and/or external metallized interconnection holes, the third layer ( 7 ) is provided thereon with a front grounding metal pattern ( 8 ), a back surface of the ceramic ( 1 ) is provided with a back grounding metal pattern ( 9 ), and the back grounding metal pattern ( 9 ) is provided with several outwardly protruding grounding terminals ( 10 ), a RF signal transmission pad ( 11 ) is disposed between every two adjacent grounding terminals ( 10 ), the front grounding metal pattern ( 8 ) and the back grounding metal pattern ( 9 ) are interconnected by the internal and/or external metallized interconnection holes ( 12 ), the front grounding line ( 5 ) and the back grounding metal pattern ( 9 ) are interconnected by the internal or external metallized interconnection holes, and the RF signal transmission lines ( 4 ) are interconnected to the RF signal transmission pad ( 11 ) by separate external metallized interconnection holes or a combination of external metallized interconnection holes and internal metallized interconnection holes ( 12 ).

2 . The parallel seam welding leadless ceramic package of claim 1 , wherein the RF signal transmission lines ( 4 ) are located on the second layer ( 3 ) and configured to extend along the second layer ( 3 ) and pass through the ceramic ( 1 ) to an outside of the ceramic ( 1 ), and the plurality of RF signal transmission lines ( 4 ) are interconnected with the RF signal transmission pads ( 11 ) by the metallized interconnection hole ( 12 ) on the sidewall of the ceramic ( 1 ).

3 . The parallel seam welding leadless ceramic package of claim 1 , wherein: an outer end portion of the grounding line ( 5 ), an outer end of the grounding terminal ( 10 ), and an outer end of the RF signal transmission pad ( 11 ) are located at an edge of the ceramic ( 1 ).

4 . The parallel seam welding leadless ceramic package of claim 1 , wherein the ceramic ( 1 ) is an alumina ceramic, an aluminum nitride ceramic, or a low temperature co-fired ceramic.

5 . The parallel seam welding leadless ceramic package of claim 1 , wherein the sealing ring ( 2 ) and the ceramic ( 1 ) are welded by a parallel seam welding process, and the metal cover plate and these a ling ring ( 2 ) are welded by the parallel seam welding process.

6 . The parallel seam welding leadless ceramic package of claim 1 , wherein the package as a whole is rectangular.

Assignees

• The 13Th Research Institute Of China Electronics Tech Group Corporation

Inventors

• Qiao Zhizhuang
• Liu Linjie
• Zheng Xin F

Classifications

• H10W76/134 Primary

  having other interconnections parallel to the conductive base · CPC title

• H10W44/251

  for monolithic microwave integrated circuits [MMIC] · CPC title

• H10W44/20

  at high-frequency [HF] or radio frequency [RF] · CPC title

• H10W70/657 Primary

  on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers · CPC title

• B23K9/02

  Seam welding; Backing means; Inserts · CPC title