Apparatus for treating substrate

US2019221455A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2019221455-A1
Application numberUS-201916245706-A
CountryUS
Kind codeA1
Filing dateJan 11, 2019
Priority dateJan 15, 2018
Publication dateJul 18, 2019
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An apparatus for treating a substrate are provided. The apparatus includes a chamber having a treatment space therein, a substrate support unit to support the substrate in the treatment space, and a heater unit to heat the substrate supported by the substrate support unit. The substrate support unit includes a support plate having a seating surface, a support protrusion provided to protrude from the seating plate and to directly support the substrate, and a sensor provided to the support protrusion to measure a temperature of the substrate.

First claim

Opening claim text (preview).

What is claimed is: 1 . An apparatus for treating a substrate, the apparatus comprising: a chamber having a treatment space therein; a substrate support unit to support the substrate in the treatment space; and a heater unit to heat the substrate supported by the substrate support unit, wherein the substrate support unit includes: a support plate having a seating surface; a support protrusion provided to protrude from the seating plate and to directly support the substrate; and a sensor provided to the support protrusion to measure a temperature of the substrate. 2 . The apparatus of claim 1 , further comprising: an elastic member to apply elastic force to the support protrusion in a direction that the support protrusion faces the substrate. 3 . The apparatus of claim 2 , wherein an insertion hole is formed in the seating surface, wherein the insertion hole includes a first hole extending downward from the seating surface and a second hole extending downward from the first hole, wherein the first hole has a width greater than a width of the second hole, wherein a protrusion region of the support protrusion protruding from the seating surface has a width greater than the width of the second hole, and wherein the elastic member is positioned in the first hole. 4 . The apparatus of claim 3 , wherein a plurality of insertion holes and a plurality of support protrusions are provided, and wherein the apparatus further includes: a pressure reducing unit to reduce pressure of space between the substrate and the seating surface. 5 . The apparatus of claim 4 , wherein some of the support protrusions are positioned in a first region of the seating surface, and others of the supporting protrusions are positioned in a second region of the seating surface, wherein the first region includes a central region of the seating surface, and wherein the second region includes an edge of the seating surface, which surrounds the first region. 6 . The apparatus of claim 2 , wherein the support protrusion includes a body to directly support the substrate, and wherein the sensor is positioned in the body, and positioned adjacent to an inner surface opposite to an outer surface of the body in contact with the substrate. 7 . The apparatus of claim 2 , wherein the support protrusion includes the body, and wherein the sensor is positioned through the body to directly support the substrate.

Assignees

Inventors

Classifications

  • characterised by a plurality of individual support members, e.g. support posts or protrusions · CPC title

  • Temperature monitoring · CPC title

  • comprising at least one lithography chamber · CPC title

  • vertical arrangement · CPC title

  • mainly by conduction · CPC title

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What does patent US2019221455A1 cover?
An apparatus for treating a substrate are provided. The apparatus includes a chamber having a treatment space therein, a substrate support unit to support the substrate in the treatment space, and a heater unit to heat the substrate supported by the substrate support unit. The substrate support unit includes a support plate having a seating surface, a support protrusion provided to protrude fro…
Who is the assignee on this patent?
Semes Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/0432. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Jul 18 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).