High-frequency component

Patent metadata

Field	Value
Publication number	US-2019215993-A1
Application number	US-201916299328-A
Country	US
Kind code	A1
Filing date	Mar 12, 2019
Priority date	Sep 21, 2016
Publication date	Jul 11, 2019
Grant date	—

Abstract

A high-frequency component includes a wiring substrate, a component mounted on an upper surface of the wiring substrate, a columnar member formed of a conductive resin and standing on the upper surface of the wiring substrate in a state of a lower end portion of the columnar member being fixed to the upper surface of the wiring substrate, and a shield case covering the component and the columnar member. The shield case has a lid plate disposed so as to face the upper surface of the wiring substrate and a side plate extending from an edge of the lid plate toward the upper surface of the wiring substrate, and an upper end portion of the columnar member is fixed to each of four corner portions of the lid plate, when viewed in a direction perpendicular to the upper surface of the wiring substrate.

First claim

1 . A high-frequency component, comprising:
a wiring substrate; a component mounted on a main surface of the wiring substrate; a columnar member including a conductive resin and standing on the main surface of the wiring substrate in a state where one end of the columnar member is fixed to the main surface of the wiring substrate; and a shield case covering the component and the columnar member, wherein the shield case has a lid plate and a side plate, wherein the lid plate is disposed so as to face to the main surface of the wiring substrate, and the side plate extends from an edge of the lid plate toward the main surface of the wiring substrate, another end of the columnar member is fixed to an end edge portion of the lid plate when viewed in a direction perpendicular to the main surface of the wiring substrate, and the other end of the columnar member has a shape that is larger than a cross section of other portions of the columnar member.

2 . The high-frequency component according to claim 1 , wherein
the lid plate has a bent portion on a peripheral line of the lid plate when viewed in a direction perpendicular to the main surface of the wiring substrate, and the other end of the columnar member is fixed to a predetermined region including the bent portion of the end edge portion of the lid plate.

3 . The high-frequency component according to claim 1 , further comprising:
a connecting member disposed between the component and the lid plate to connect the component and the lid plate to each other, wherein the connecting member includes a resin of the same type as the conductive resin included in the columnar member.

4 . The high-frequency component according to claim 2 , further comprising:
a connecting member disposed between the component and the lid plate to connect the component and the lid plate to each other, wherein the connecting member includes a resin of the same type as the conductive resin included in the columnar member.

5 . The high-frequency component according to claim 1 , wherein the main surface of the wiring substrate and the lid plate of the shield case each has a rectangular shape.

6 . The high-frequency component according to claim 1 , wherein the main surface of the wiring substrate and the lid plate of the shield case each has a shape in which a portion of one of four corners of a rectangular shape is cut out.

Assignees

• Murata Manufacturing Co

Inventors

• Yagi Yoshikazu
• Sato Kazushige
• Hara Akihiro
• Morioka Noboru
• Amachi Nobumitsu

Classifications

• H10W76/10

  Containers or parts thereof · CPC title

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W76/17

  characterised by their materials · CPC title