Electronic device including first substrate having first and second surfaces opposite from each other, second substrate facing first surface, and drive circuit facing second surface

Patent metadata

Field	Value
Publication number	US-2019103373-A1
Application number	US-201815996754-A
Country	US
Kind code	A1
Filing date	Jun 4, 2018
Priority date	Sep 29, 2017
Publication date	Apr 4, 2019
Grant date	—

Abstract

An electronic device includes: a first substrate having a first surface and a second surface opposite from the first surface; a second substrate facing the first surface; driven elements provided at the second substrate; a drive circuit facing the second surface; a first interconnect provided at the first surface; a second interconnect provided at the second surface; a through-substrate interconnection part penetrating the first substrate in a thickness direction thereof; a first bump part; and a second bump part. The drive circuit is capable of outputting drive signals for driving the driven elements. The through-substrate interconnection part electrically connects the first interconnect and the second interconnect. The first bump part electrically connects the first interconnect and the driven elements. The second bump part electrically connects the second interconnect and the drive circuit. The through-substrate interconnection part has an electrical resistance lower than an electrical resistance of the second bump part.

First claim

What is claimed is:

1 . An electronic device comprising:
a first substrate having a first surface and a second surface opposite from the first surface, the first substrate having a thickness defining a thickness direction; a second substrate facing the first surface; a plurality of driven elements provided at the second substrate and arrayed in a first direction orthogonal to the thickness direction; a drive circuit facing the second surface and capable of outputting drive signals for driving the plurality of driven elements; a first interconnect provided at the first surface and extending in the first direction; a second interconnect provided at the second surface and extending in the first direction, the second interconnect being electrically connectable to a first external terminal; a through-substrate interconnection part penetrating the first substrate in the thickness direction and electrically connecting the first interconnect and the second interconnect; a first bump part electrically connecting the first interconnect and the plurality of driven elements; and a second bump part electrically connecting the second interconnect and the drive circuit, wherein an electrical resistance of the through-substrate interconnection part is lower than an electrical resistance of the second bump part.

2 . The electronic device according to claim 1 , wherein the through-substrate interconnection part has a cross-sectional area orthogonal to the thickness direction, the cross-sectional area being greater than an electrical contact area between the second interconnect and the second bump part.

3 . The electronic device according to claim 1 , wherein the through-substrate interconnection part is a single through-substrate interconnect extending in the first direction.

4 . The electronic device according to claim 1 , wherein the through-substrate interconnection part comprises a plurality of through-substrate interconnects arrayed in the first direction, each of the plurality of through-substrate interconnects penetrating the first substrate in the thickness direction and electrically connecting the first interconnect and the second interconnect.

5 . The electronic device according to claim 4 , wherein the first bump part comprises a plurality of connection bumps electrically connecting the first interconnect and the plurality of driven elements,
wherein at least one of the plurality of connection bumps has a portion overlapped with one of the plurality of through-substrate interconnects as viewed in the thickness direction.

6 . The electronic device according to claim 4 , wherein at least one of the plurality of through-substrate interconnects has a portion overlapped with both the first interconnect and the second interconnect as viewed in the thickness direction.

7 . The electronic device according to claim 4 , wherein the second bump part comprises a plurality of connection bumps arrayed in the first direction, each of the plurality of connection bumps electrically connecting the second interconnect and the drive circuit.

8 . The electronic device according to claim 7 , wherein at least one of the plurality of through-substrate interconnects has a cross-sectional area orthogonal to the thickness direction, the cross-sectional area being greater than an electrical contact area between the second interconnect and one of the plurality of connection bumps.

9 . The electronic device according to claim 7 , wherein a number of the plurality of through-substrate interconnects is greater than or equal to a number of the plurality of connection bumps.

10 . The electronic device according to claim 7 , further comprising a third bump part electrically connected to the drive circuit, the drive circuit being capable of outputting the drive signals to the plurality of driven elements through the third bump part.

11 . The electronic device according to claim 10 , wherein the third bump part comprises a plurality of connection bumps arrayed in the first direction and electrically connected to the drive circuit, and
wherein a number of the plurality of connection bumps of the second bump part is greater than or equal to a number of the plurality of connection bumps of the third bump part.

12 . The electronic device according to claim 7 , further comprising:
a third interconnect provided at the second surface and extending in the first direction, the third interconnect being electrically connectable to a second external terminal; and a fourth bump part electrically connecting the third interconnect and the drive circuit.

13 . The electronic device according to claim 12 , wherein the fourth bump comprises a plurality of connection bumps arrayed in the first direction, the plurality of connection bumps of the fourth bump part electrically connecting the third interconnect and the drive circuit, and
wherein a number of the plurality of connection bumps of the second bump part is greater than or equal to a number of the plurality of connection bumps of the fourth bump part.

14 . The electronic device according to claim 7 , wherein each of the plurality of connection bumps comprises:
a core portion made of resin and protruding from the drive circuit toward the first substrate; and a cover portion covering the core portion, the cover portion being formed of electrically conductive material and electrically connecting the second interconnect and the drive circuit.

15 . The electronic device according to claim 14 , wherein the second bump part further comprises a plurality of core-connecting portion extending in the first direction and made of resin, and
wherein two core portions that neighbor in the first direction are integrally formed through one of the plurality of core-connecting portion.

16 . An electronic device comprising:
a first substrate having a first surface and a second surface opposite from the first surface, the first substrate having a thickness defining a thickness direction; a second substrate facing the first surface; a plurality of driven elements provided at the second substrate and arrayed in a first direction orthogonal to the thickness direction; a drive circuit facing the second surface and capable of outputting drive signals for driving the plurality of driven elements; a first interconnect provided at the first surface and extending in the first direction; a second interconnect provided at the second surface and extending in the first direction, the second interconnect being electrically connectable to an external terminal; a plurality of through-substrate interconnects penetrating the first substrate in the thickness direction and electrically connecting the first interconnect and the second interconnect; a plurality of first connection bumps electrically connecting the first interconnect and the plurality of driven elements; and a plurality of second connection bumps electrically connecting the second interconnect and the drive circuit, wherein a combined electrical resistance of the plurality of through-substrate interconnects is lower than a combined electrical resistance of the plurality of second connection bumps.

Assignees

• Brother Ind Ltd

Inventors

• Hirai Keita

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07254

  changes in dispositions · CPC title

• H10W72/248

  Top-view layouts, e.g. mirror arrays · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/635

  Through-vias · CPC title