Liquid jet head and method for manufacturing liquid jet head

Patent metadata

Field	Value
Publication number	US-2018015717-A1
Application number	US-201615546997-A
Country	US
Kind code	A1
Filing date	Mar 11, 2016
Priority date	Mar 17, 2015
Publication date	Jan 18, 2018
Grant date	—

Abstract

Provided are a liquid jet head with which the size-reduction can be achieved, while the resistance of wiring formed on a wiring plate such as a sealing plate is lowered, and a method for manufacturing the liquid jet head. The liquid jet head includes: a sealing plate 33 having a first surface 41 to which a pressure chamber-forming plate 29 including multiple piezoelectric elements 32 is joined and a second surface 42 which is on a side opposite from the first surface 41 and to which a drive IC 34 that outputs signals for driving the piezoelectric elements 32 is joined, wherein a lower surface-side embedded wire 51 connected to a common wire 38 common to the driving elements 32 are formed on the first surface 41 of the sealing plate 33, and the lower surface-side embedded wire 51 is at least partially embedded in the sealing plate 33 .

First claim

1 . A liquid jet head, comprising a wiring plate having a first surface to which a driving element-forming plate including a plurality of driving elements is connected and a second surface which is on a side opposite from the first surface and on which a drive IC that outputs signals for driving the driving elements is provided, wherein
wiring connected to a common electrode common to the driving elements is formed on the first surface of the wiring plate, and the wiring is at least partially embedded in the wiring plate.

2 . The liquid jet head according to claim 1 , wherein the wiring is at least partially covered with a metal layer.

3 . The liquid jet head according to claim 1 , wherein the wiring and the common electrode are connected to each other by bump electrodes.

4 . The liquid jet head according to claim 3 , wherein each of the bump electrodes includes a resin having elasticity and a conductive layer covering at least part of a surface of the resin.

5 . The liquid jet head according to claim 4 , wherein the resin is formed on a surface of the wiring, and
the conductive layer is connected to the wiring at a position offset from the resin.

6 . The liquid jet head according to claim 4 , wherein
the wiring is formed in two rows, the resin is formed between the two rows of the wiring, and the conductive layer is connected to at least one of the two rows of the wiring at a position offset from the resin.

7 . The liquid jet head according to claim 4 , wherein
the resin is formed at a position facing the wiring, and the conductive layer is the common electrode.

8 . The liquid jet head according to claim 1 , wherein
the wiring plate includes a penetrating wire made of a conductor and formed inside a through-hole penetrating the wiring plate, and the wiring is connected to the penetrating wire on the first surface.

9 . A method for manufacturing a liquid jet head including a wiring plate having a first surface to which a driving element-forming plate including a plurality of driving elements is joined and a second surface which is on a side opposite from the first surface and to which a drive IC that outputs signals for driving the driving elements is joined, the wiring plate including wiring connected to a common electrode common to the driving elements and a penetrating wire which provides connection between the first surface and the second surface, the method comprising:
wiring plate processing of forming a recessed portion recessed in a plate thickness direction on the first surface of the wiring plate and forming a through-hole penetrating the wiring plate; and wiring formation of forming the wiring by embedding a conductive material in the recessed portion and forming the penetrating wire by embedding the conductive material in the through-hole.

10 . The method for manufacturing a liquid jet head according to claim 9 , wherein
the wiring formation includes forming the conductive material in the recessed portion and the through-hole by an electrolytic plating method.

11 . The method for manufacturing a liquid jet head according to claim 9 , wherein
the wiring formation includes forming the conductive material in the recessed portion and the through-hole by printing.

12 . The method for manufacturing a liquid jet head according to claim 11 , wherein
the conductive material is an electrically conductive paste, and the wiring formation includes hardening the conductive material.

Assignees

• Seiko Epson Corp

Inventors

• Tanaka Shuichi

Classifications

• B41J2/161

  of film type, deformed by bending and disposed on a diaphragm · CPC title

• B41J2/14233 Primary

  of film type, deformed by bending and disposed on a diaphragm · CPC title

• B41J2202/18

  Electrical connection established using vias · CPC title

• B41J2002/14491

  Electrical connection · CPC title

• B41J2/04541 Primary

  Specific driving circuit · CPC title