Adhesive bonding composition and method of use

Patent metadata

Field	Value
Publication number	US-2019100680-A1
Application number	US-201816121043-A
Country	US
Kind code	A1
Filing date	Sep 4, 2018
Priority date	Mar 18, 2014
Publication date	Apr 4, 2019
Grant date	—

Abstract

A method of and system for adhesive bonding. The method and system a) treat a surface of an element to be bonded to provide an adherent structure including one or more rubber compounds on the surface; b) place a polymerizable adhesive composition, including at least one photoinitiator and at least one energy converting material, in contact with the adherent structure and two or more components to be bonded to form an assembly, c) irradiated the assembly with radiation at a first wavelength, capable of conversion by the at least one energy converting material, to a second wavelength capable of activating the at least one photoinitiator to produce from the polymerizable adhesive composition a cured adhesive composition; and d) adhesively join the two or more components by way of the adherent structure and the cured adhesive composition.

First claim

1 . A curable polymer system comprising:
an adherent structure attached to a low energy surface of an element to be bonded, said surface having a surface energy less than 50 mJ/m 2 ; at least one polymerizable adhesive composition for adhesive attachment to the adherent structure; at least one photoinitiator responsive to a selected wavelength of light; and at least one energy converting material selected to emit said wavelength of light when exposed to an imparted radiation.

2 . The curable polymer system of claim 1 , wherein said at least one energy converting material is a downconverting material.

3 . The curable polymer system of claim 2 , wherein said downconverting material comprises inorganic particulates selected from the group consisting of: metal oxides; metal sulfides; doped metal oxides; and mixed metal chalcogenides.

4 . The curable polymer system of claim 2 , wherein said downconverting material comprises at least one of Y 2 O 3 , Y 2 O 2 S, NaYF 4 , NaYbF 4 , YAG, YAP, Nd 2 O 3 , LaF 3 , LaCl 3 , La 2 O 3 , TiO 2 , LuPO 4 , YVO 4 , YbF 3 , YF 3 , Na-doped YbF 3 , ZnS; ZnSe; MgS; CaS; ZnSe x S y ; ZnSe x S y :Cu, Ag, Ce, Tb; and alkali lead silicate including compositions of SiO 2 , B 2 O 3 , Na 2 O, K 2 O, PbO, MgO, or Ag, and combinations or alloys or layers thereof.

5 . The curable polymer system of claim 4 , wherein the downconverting material comprises a dopant including at least one of Er, Eu, Yb, Tm, Nd, Mn Tb, Ce, Y, U, Pr, La, Gd and other rare-earth species or a combination thereof.

6 . The curable polymer system of claim 2 , wherein the downconverting material comprises at least one of CaS, ZnSeS, and iron sulfate.

7 . The curable polymer system of claim 1 , wherein said at least one energy converting material comprises an upconverting material.

8 . The curable polymer system of claim 7 , wherein said upconverting material comprises at least one of Y 2 O 3 , Y 2 O 2 S, NaYF 4 , NaYbF 4 , YAG, YAP, Nd 2 O 3 , LaF 3 , LaCl 3 , La 2 O 3 , TiO 2 , LuPO 4 , YVO 4 , YbF 3 , YF 3 , Na-doped YbF 3 , or SiO 2 or alloys or layers thereof.

9 . The curable polymer system of claim 1 , wherein said polymerizable adhesive composition comprises a monomer forming a thermoset resin.

10 . The curable polymer system of claim 9 , further comprising a peroxide included in the polymerizable adhesive composition.

11 . The curable polymer system of claim 1 , wherein said at least one photoinitiator is selected from the group consisting of: benzoin ethers, benzil ketals, α-dialkoxyacetophenones, α-aminoalkylphenones, acylphosphine oxides, benzophenones/amines, thioxanthones/amines, and titanocenes.

12 . The curable polymer system of claim 1 , wherein said polymerizable adhesive composition further comprises inorganic particulates selected from the group consisting of: metals and metal alloys, ceramics and dielectrics, and metal-coated polymers.

13 . The curable polymer system of claim 11 , wherein said polymerizable adhesive composition further comprises an organic component selected from the group consisting of: solvents, viscosity modifiers, surfactants, dispersants, and plasticizers.

14 . The curable polymer system of claim 1 , wherein the adherent structure comprises:
a polymerized natural or synthetic rubber compound.

15 . The curable polymer system of claim 1 , wherein the surface of the element to be bonded comprises a low energy material having a surface energy of less than 50 mJ/m 2 .

16 . The curable polymer system of claim 1 , wherein the surface of the element to be bonded comprises a low energy material having a surface energy of less than 40 mJ/m 2 .

17 . The curable polymer system of claim 1 , wherein the surface of the element to be bonded comprises a low energy material having a surface energy of less than 30 mJ/m 2 .

18 . The curable polymer system of claim 1 , wherein the surface of the element to be bonded comprises at least one of a polytetrafluoroethylene, a poly(perfluoroalkylacrylate), a polystyrene, a polyacrylate, a poly(methyl methacrylate), a poly(dimethylsiloxane), a polyethylene, a polychlorotrifluoroethylene, a polypropylene, a polyvinyl chloride, a polyvinyl fluoride, a polyvinylidenedichloride, a polyvinylidenedifluoride, a polyacrylamide, a polyethylene terephthalate, a poly(6-aminocoproicacid), and a poly(11-aminoundecaroicacid).

19 . The curable polymer system of claim 1 , wherein the surface of the element to be bonded comprises at least one of a silicone and a poly (dimethyl siloxane).

20 . The curable polymer system of claim 1 , further comprising a primer for application to said surface of the element to be bonded.

21 . The curable polymer system of claim 20 , wherein the primer comprises a two-component urethane-based primer.

22 . The curable polymer system of claim 20 , wherein the two-component urethane-based primer comprises a moisture activated primer.

23 . The curable polymer system of claim 1 , wherein said at least one energy converting material comprises an organic phosphor.

24 . The curable polymer system of claim 23 , wherein the at least one photoinitiator is configured to be activated by emitted light from one or more of organic phosphors.

25 . The curable polymer system of claim 23 , wherein the organic phosphor comprises at least one of include anthracene, sulfoflavine, fluorescein, eosin, polyvinyltoluene, styrene, fluors, and rhodamine.

26 . The curable polymer system of claim 23 , wherein the organic phosphor is linked to the at least one photoinitiator.

27 . An inkjet cartridge, comprising a printhead and a cartridge body, wherein the printhead and cartridge body are held together by the curable polymer system of claim 1 .

28 . A wafer to wafer bonded assembly, comprising a plurality of semiconductor wafers bonded together the curable polymer system of claim 1 .

29 . An encapsulated semiconductor component, comprising a semiconductor assembly having the curable polymer system of claim 1 .

30 . An integrated circuit assembly comprising a plurality of electrically connected material layers, wherein the plurality of electrically connected material layers are held together by the curable polymer system of claim 1 .

31 . An adhesive transfer member comprising:
a release substrate; one or more rubber compounds disposed on a surface of the release element; and an energy converting material intermixed with said one or rubber compounds in the surface of the release element.

32 . The adhesive transfer member of claim 31 , wherein said energy converting material is a downconverting material.

33 . The adhesive transfer member of statement 32 , wherein said downconverting material comprises inorganic particulates selected from the group consisting of: metal oxides; metal sulfides; doped metal oxides; and mixed metal chalcogenides.

34 . The adhesive transfer member of statement 32 , wherein said downconverting material comprises at least one of Y 2 O 3 , Y 2 O 2 S, NaYF 4 , NaYbF 4 , YAG, YAP, Nd 2 O 3 , LaF 3 , LaCl 3 , La 2 O 3 , TiO 2 , LuPO 4 , YVO 4 , YbF 3 , YF 3 , Na-doped YbF 3 , ZnS; ZnSe; MgS; CaS; ZnSe x S y ; ZnSe x S y :Cu, Ag, Ce, Tb; and alkali lead silicate including compositions of SiO 2 , B 2 O 3 , Na 2 O, K 2 O, PbO, MgO, o

Assignees

• Immunolight Llc

Inventors

• Fathi Zakaryae
• Bourke Jr Frederic A
• Walder Harold

Classifications

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• B32B2307/50

  having particular mechanical properties · CPC title

• C09J7/10

  without carriers · CPC title