Electronic panel, display device, and method for manufacturing the display device

Patent metadata

Field	Value
Publication number	US-2019096979-A1
Application number	US-201816108584-A
Country	US
Kind code	A1
Filing date	Aug 22, 2018
Priority date	Sep 26, 2017
Publication date	Mar 28, 2019
Grant date	—

Abstract

A display device includes a substrate including a display area and a non-display area, driving elements disposed in the display area, a plurality of pads disposed in the non-display area and electrically connected to the driving elements, an insulating layer partially disposed on the pads to partially expose the pads, a plurality of signal pads disposed on the pads exposed by the insulating layer and electrically connected to the pads, respectively, and an electronic component including a plurality of driving bumps disposed on the signal pads and electrically connected to the signal pads, respectively. A first portion of a first driving bump of the driving bumps is in direct contact with a first signal pad of the signal pads, and a second portion of the first driving bump is in direct contact with a portion of the insulating layer not overlapping with the first signal pad.

First claim

What is claimed is:

1 . A display device comprising:
a substrate comprising a display area and a non-display area; driving elements disposed in the display area; a plurality of pads disposed in the non-display area and electrically connected to the driving elements; an insulating layer disposed on the pads, wherein each of the pads is partially exposed through the insulating layer; a plurality of signal pads disposed on the pads, respectively, wherein each of the signal pads is electrically connected to a corresponding pad among the pads; and an electronic component comprising a plurality of driving bumps disposed on the signal pads and electrically connected to the signal pads, respectively, wherein a first portion of a first driving bump of the driving bumps is in direct contact with a first signal pad of the signal pads, and wherein a second portion of the first driving bump is in direct contact with a portion of the insulating layer not overlapping with the first signal pad.

2 . The display device of claim 1 , wherein the first driving bump is aligned with the first signal pad in such a way that an area of the first driving bump not overlapping the first signal pad is in a range from about 10% to about 90% of a total area of the first driving bump in a plan view.

3 . The display device of claim 1 , wherein the first driving bump is aligned with a first pad of the pads in such a way that an area of the first driving bump not overlapping with the first pad is in a range from about 10% to about 90% of a total area of the first driving bump in a plan view.

4 . The display device of claim 1 , further comprising;
another insulating layer disposed between the pads and the substrate.

5 . The display device of claim 1 , further comprising:
another insulating layer disposed between a first pad of the pads and a second pad of the pads.

6 . The display device of claim 1 , wherein a structure of each of the signal pads is the same as a structure of the first signal pad.

7 . The display device of claim 1 , wherein the signal pads further comprise: a second signal pad in direct contact with both a first portion and a second portion of a second driving bump of the driving bumps.

8 . The display device of claim 7 , wherein
the signal pads further comprise: a third signal pad and a fourth signal pad, the first to fourth signal pads are sequentially arranged, a structure of the third signal pad is the same as a structure of the first signal pad, and a structure of the fourth signal pad is the same as a structure of the second signal pad.

9 . The display device of claim 1 , wherein a first pad of the pads overlaps with the first portion of the first driving bump and does not overlap with the second portion of the first driving bump.

10 . The display device of claim 1 , wherein
the pads comprise a first pad and a second pad, the first pad overlaps with the first portion of the first driving bump and does not overlap with the second portion of the first driving bump, and the second pad comprises:
a first pad part overlapping with a first portion of a second driving bump of the driving bumps; and
a second pad part overlapping with a second portion of the second driving bump.

11 . The display device of claim 10 , wherein
the second pad part is covered by the insulating layer, and an opening is defined in at least an area of the second pad part.

12 . The display device of claim 1 , wherein
the driving elements comprise a plurality of pixels which displays an image, and the display device further comprises:
a plurality of signal lines disposed on the substrate and connected between the pads to the pixels.

13 . The display device of claim 12 , wherein the electronic component comprises a data driving chip disposed on the non-display area.

14 . The display device of claim 12 , wherein the electronic component comprises a printed circuit board partially disposed on the non-display area.

15 . The display device of claim 1 , wherein
the driving elements comprise a plurality of input sensing electrodes, and the display device further comprises:
a plurality of signal lines disposed on the substrate and connected between the pads to the input sensing electrodes.

16 . The display device of claim 15 , wherein the electronic component comprises an input sensing driving chip disposed on the non-display area.

17 . The display device of claim 15 , wherein the electronic component comprises a flexible printed circuit board partially disposed on the non-display area.

18 . A method for manufacturing a display device, the method comprising:
providing a display panel comprising a signal pad; aligning a bump, which has a greater planar area than the signal pad, of an electronic component with the signal pad of the display panel in such a way that an area of the bump not overlapping the signal pad is in a range from about 10% to about 90% of a total area of the bump in a plan view; contacting the bump with the signal pad; and applying ultrasonic vibration to the bump and the signal pad.

19 . The method of claim 18 , wherein the applying the ultrasonic vibration comprises:
applying the ultrasonic vibration to an interface between the bump and the signal pad.

20 . An electronic panel comprising:
a substrate comprising a pad area; a signal line, a portion of which is disposed in the pad area; an insulating layer disposed on the substrate to expose the portion of the signal line which overlaps with the pad area; a signal pad disposed on the insulating layer and electrically connected to the portion of the signal line; and an electronic component comprising a driving bump disposed on the signal pad and electrically connected to the signal pad, wherein a first portion of the driving bump is in direct contact with the signal pad, and wherein a second portion of the driving bump is in direct contact with a portion of the insulating layer not overlapping with the signal pad.

Assignees

• Samsung Display Co Ltd

Inventors

• Jo Jungyun
• Kim Byoungyong
• Ryu Seung-Soo

Classifications

• H10W72/072

  of bump connectors · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W90/701 Primary

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• G09G3/3275

  Details of drivers for data electrodes · CPC title

• H01L27/3276 Primary

  Electricity · mapped topic