Pad structure and display device having the same

Patent metadata

Field	Value
Publication number	US-2016100483-A1
Application number	US-201514869596-A
Country	US
Kind code	A1
Filing date	Sep 29, 2015
Priority date	Oct 2, 2014
Publication date	Apr 7, 2016
Grant date	—

Abstract

A display device includes a plurality of signal lines arranged in a display area of a substrate and a pad structure located at a non-active area and connected with the signal lines. The pad structure includes a plurality of metal layers and two or more insulating layers located between the metal layers and having one or more contact hole which makes two metal layers among the metal layers contacted with each other, and the contact holes respectively located in the insulating layers are not overlapped with each other.

First claim

What is claimed is:

1 . A pad structure, comprising:
a plurality of metal layers including a first metal layer, a second metal layer and a third metal layer, wherein the first metal layer and the second metal layer are connected with each other through a first contact hole located in a first insulating layer between the first metal layer and the second metal layer, the second metal layer and the third metal layer are connected with each other through a second contact hole located in a second insulating layer between the second metal layer and the third metal layer, and the first contact hole and the second contact hole are not overlapped with each other.

2 . The pad structure of claim 1 ,
wherein the first metal layer and the first contact hole are not overlapped with the third metal layer.

3 . The pad structure of claim 1 ,
wherein the first metal layer and the first contact hole overlap with the third metal layer.

4 . A display device, comprising:
a plurality of signal lines including a data line and a gate line arranged in a display area of a substrate; and a pad structure located at a non-active area and connected with the signal lines, wherein the pad structure further comprises: a plurality of metal layers including a first metal layer, a second metal layer and a third metal layer, wherein the first metal layer and the second metal layer are connected with each other through a first contact hole located in a first insulating layer between the first metal layer and the second metal layer, the second metal layer and the third metal layer are connected with each other through a second contact hole located in a second insulating layer between the second metal layer and the third metal layer, and the first contact hole and the second contact hole are not overlapped with each other.

5 . The display device of claim 4 ,
wherein the pad structure is a data pad structure which is connected with the data line among the plurality of the signal lines.

6 . The display device of claim 4 ,
wherein the first metal layer is a link line to electrically connect the second metal layer to the data line.

7 . The display device of claim 4 ,
wherein the third metal layer is electrically connected with the second metal layer, and the third metal layer is electrically connected to a data driving chip film located in the non-active area of the substrate by an adhesive part including a plurality of conductive balls.

8 . The display device of claim 4 ,
wherein the first contact hole is located at an area adjacent to the display area and the second contact hole is located at an area adjacent to one end side of the substrate.

9 . The display device of claim 4 , wherein the first metal layer is made of a same material as the gate line, the second metal layer is made of a same material as the data line, and the third metal layer is made of a same material as a pixel electrode.

10 . The pad structure of claim 1 , wherein the first contact hole, or the second contact hole, or both the first contact hole and the second contact hole are a plurality of contact holes.

11 . The pad structure of claim 10 ,
wherein the first contact hole and the second contact hole are alternately arranged along a line.

12 . The pad structure of claim 11 , wherein the first contact hole, or the second contact hole, or both the first contact hole and the second contact hole are offset from the line when the contact holes are viewed from above.

13 . The pad structure of claim 10 , wherein the first contact hole and the second contact hole are arranged in a zigzag manner.

14 . A method for forming a pad structure in a display device, the method comprising:
providing a plurality of metal layers on a substrate to form a plurality of signal lines in a display area of the substrate; and providing two or more insulating layers, each insulating layer being disposed between the metal layers and having one or more contact holes which make two metal layers among the plurality of metal layers contact each other, wherein the contact holes respectively disposed in each of the insulating layers are not overlapped with each other.

15 . The method of claim 14 , wherein the metal layers include a fist metal layer, a second metal layer and a third metal layer, and
wherein the first metal layer and the second metal layer are connected with each other through a first contact hole located in a first insulating layer between the first metal layer and the second metal layer, the second metal layer and the third metal layer are connected with each other through a second contact hole located in a second insulating layer between the second metal layer and the third metal layer, and a location of the first contact hole is different from that of the second contact hole.

16 . The method of claim 15 , wherein the first metal layer and the first contact hole are located at an area different from an area where the third metal layer is located.

17 . The method of claim 15 , wherein the first contact hole and the second contact hole are alternately arranged.

18 . The method of claim 15 , wherein the first contact hole and the second contact hole are arranged in a zigzag manner.

Assignees

• Lg Display Co Ltd

Inventors

• Hwang Soonjae
• Jeong Ilgi

Classifications

• H10W90/732

  between stacked chips · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/9223

  with redistribution layers [RDL] · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title