Shielded semiconductor devices and methods for fabricating shielded semiconductor devices
US-2018351078-A1 · Dec 6, 2018 · US
Multilayer frame packages for integrated circuits having a magnetic shield integrated therein, and methods therefor
US2019051613A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2019051613-A1 |
| Application number | US-201816055470-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 6, 2018 |
| Priority date | Aug 8, 2017 |
| Publication date | Feb 14, 2019 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An integrated circuit package may comprise a multilayer frame package including: a bottom layer; and a magnetic shield layer, including a sub-frame and a magnetic shield disposed within a periphery of the sub-frame; and an integrated circuit die provided on or above the magnetic shield layer of the multilayer frame package.
First claim
Opening claim text (preview).
What is claimed is: 1 . An integrated circuit package comprising: a multilayer frame package including: a bottom layer; and a magnetic shield layer, including a sub-frame and a magnetic shield disposed within a periphery of the sub-frame; and an integrated circuit die provided on or above the magnetic shield layer of the multilayer frame package. 2 . The integrated circuit package of claim 1 , wherein the bottom layer and the sub-frame are made of the same material. 3 . The integrated circuit package of claim 1 , further comprising interconnects routed through the bottom layer and the sub-frame. 4 . The integrated circuit package of claim 1 , wherein the magnetic shield includes a film or a foil, wherein the film or foil includes a thickness between 50 and 150 micrometers. 5 . The integrated circuit package of claim 1 , wherein the magnetic shield is fixed to an inner perimeter of the sub-frame. 6 . The integrated circuit package of claim 1 , wherein the magnetic shield is fixed to an inner perimeter of the sub-frame, and wherein the inner perimeter of the sub-frame is rectangular-shaped. 7 . The integrated circuit package of claim 1 , wherein the magnetic shield is fixed to an inner perimeter of the sub-frame, and wherein the inner perimeter of the sub-frame is oval-shaped. 8 . The integrated circuit package of claim 1 , wherein the multilayer frame package includes a plurality of magnetic shields. 9 . The integrated circuit package of claim 8 , wherein the multilayer frame package includes a plurality of magnetic shield layers, wherein each of the plurality of magnetic shield layers includes a sub-frame and a magnetic shield. 10 . The integrated circuit package of claim 1 , wherein a width of the magnetic shield is similar to a width of an active area of the integrated circuit die. 11 . The integrated circuit package of claim 1 , wherein the integrated circuit die includes a magnetoresistive device. 12 . A multilayer frame package including: a bottom layer; and a magnetic shield layer, including a sub-frame and a magnetic shield disposed within a periphery of the sub-frame. 13 . The multilayer frame package of claim 12 , wherein the bottom layer and the sub-frame are made of the same material. 14 . The multilayer frame package of claim 12 , further comprising interconnects routed through the bottom layer and the sub-frame. 15 . The multilayer frame package of claim 12 , wherein the magnetic shield includes a film or a foil, wherein the film or foil includes a thickness of approximately 50 to approximately 150 micrometers. 16 . The multilayer frame package of claim 12 , wherein the magnetic shield is fixed to an inner perimeter of the sub-frame. 17 . The multilayer frame package of claim 12 , wherein the magnetic shield is fixed to an inner perimeter of the sub-frame, and wherein the inner perimeter of the sub-frame is rectangular-shaped. 18 . The multilayer frame package of claim 12 , wherein the multilayer frame package includes a plurality of magnetic shields. 19 . The multilayer frame package of claim 18 , wherein the multilayer frame package includes a plurality of magnetic shield layers, wherein each of the plurality of magnetic shield layers includes a sub-frame and a magnetic shield. 20 . The multilayer frame package of claim 12 , wherein the multilayer frame package further includes: a top layer, wherein the sub-frame is disposed in between the bottom layer and the top layer
Assignees
Inventors
Classifications
materials for magnetic shielding, e.g. ferromagnetic materials · CPC title
shielding resins · CPC title
Die-attach connectors and bond wires · CPC title
Die-attach connectors and bond wires · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
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Frequently asked questions
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- What does patent US2019051613A1 cover?
- An integrated circuit package may comprise a multilayer frame package including: a bottom layer; and a magnetic shield layer, including a sub-frame and a magnetic shield disposed within a periphery of the sub-frame; and an integrated circuit die provided on or above the magnetic shield layer of the multilayer frame package.
- Who is the assignee on this patent?
- Everspin Technologies Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W42/20. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Feb 14 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).