Memeber, electric/electronic component, electric/electronic device, and member-manufacturing method

Patent metadata

Field	Value
Publication number	US-2019047257-A1
Application number	US-201816159975-A
Country	US
Kind code	A1
Filing date	Oct 15, 2018
Priority date	Apr 15, 2016
Publication date	Feb 14, 2019
Grant date	—

Abstract

A member includes a base material and an electroless plating layer. The base material includes an elastic section that includes a sulfur-containing elastic body. The electroless plating layer is provided on the elastic section of the base material. The base material includes the elastic section, and the electroless plating layer is positioned on one surface of the elastic section. The elastic section has a portion that is elastically deformable together with the electroless plating layer.

First claim

What is claimed is:

1 . A member comprising:
a base material that includes an elastic section that includes a sulfur-containing elastic body; and an electroless plating layer provided on the elastic section of the base material, wherein the elastic section has a portion that is elastically deformable together with the electroless plating layer.

2 . The member according to claim 1 ,
wherein the sulfur-containing elastic body includes vulcanized rubber.

3 . The member according to claim 1 ,
wherein the electroless plating layer includes at least one element selected from the group consisting of Au, Ag and Cu.

4 . An electric/electronic component comprising:
a member comprising:
a base material that includes an elastic section that includes a sulfur-containing elastic body; and
an electroless plating layer provided on the elastic section of the base material,
wherein the elastic section has a portion that is elastically deformable together with the electroless plating layer; and
an electric contact; wherein at least part of the electric contact includes the electroless plating layer included in the member.

5 . The electric/electronic component according to claim 4 , further comprising:
at least one of a deformable portion and a slidable portion, wherein the elastic section included in the member is deformed during use.

6 . An electric/electronic component comprising:
the member according to claim 4 ; and at least one of a deformable portion and a slidable portion, wherein the elastic section included in the member is deformed during use.

7 . A member-manufacturing method for manufacturing a member comprising: a base material that includes an elastic section that includes a sulfur-containing elastic body; and an electroless plating layer provided on the elastic section of the base material, wherein the elastic section has a portion that is elastically deformable together with the electroless plating layer, the method comprising:
performing an oxidizing treatment in which the oxidizing treatment increases oxygen concentration near a surface of the elastic section of the base material; and performing an electroless plating treatment on the surface of the elastic section on which the oxidizing treatment has been performed.

8 . The method according to claim 7 ,
wherein the oxidizing treatment includes ultraviolet radiation treatment in which ionizing radiation including an ultraviolet ray is radiated to the surface of the elastic section.

9 . The method according to claim 8 ,
wherein the ultraviolet radiation treatment is performed using an excimer light source.

10 . The method according to claim 7 ,
wherein sulfur in the sulfur-containing elastic body included in the elastic section is oxidized in the oxidizing treatment.

11 . The method according to claim 8 ,
wherein sulfur in the sulfur-containing elastic body included in the elastic section is oxidized in the oxidizing treatment.

12 . The method according to claim 10 ,
wherein a spectrum obtained by measuring by using an X-ray photoelectron spectroscopy the surface of the elastic section of the base material having undergone the step of oxidizing has a plurality of peaks based on S2p, and wherein a proportion of one peak of the plurality of peaks attributed to SO 2 in a sum of another peak of the plurality of peaks attributed to S and the one peak attributed to SO 2 is 0.45 or larger in area.

13 . The method according to claim 11 ,
wherein a spectrum obtained by measuring by using an X-ray photoelectron spectroscopy the surface of the elastic section of the base material having undergone the step of oxidizing has a plurality of peaks based on S2p, and wherein a proportion of one peak of the plurality of peaks attributed to SO 2 in a sum of another peak of the plurality of peaks attributed to S and the one peak attributed to SO 2 is 0.45 or larger in area.

14 . The method according to claim 12 ,
wherein the proportion is 1 or larger.

15 . The method according to claim 13 ,
wherein the proportion is 1 or larger.

16 . The method according to claim 10 ,
wherein, when the surface of the elastic section of the base material having undergone the oxidizing treatment is etched by argon sputtering by 5 nm calculated based on SiO 2 sputter time and a composition analysis is performed on the obtained surface by an X-ray photoelectron spectroscopy, O content is 20 atomic % or larger.

17 . The method according to claim 16 ,
wherein, when the surface of the elastic section of the base material having undergone the oxidizing treatment is etched by the argon sputtering by 25 nm calculated based on the SiO 2 sputter time and the composition analysis is performed on the obtained surface by the X-ray photoelectron spectroscopy, the O content is 20 atomic % or larger.

18 . The method according to claim 11 ,
wherein, when the surface of the elastic section of the base material having undergone the oxidizing treatment is etched by argon sputtering by 5 nm calculated based on SiO 2 sputter time and a composition analysis is performed on the obtained surface by an X-ray photoelectron spectroscopy, O content is 20 atomic % or larger.

19 . The method according to claim 18 ,
wherein, when the surface of the elastic section of the base material having undergone the oxidizing treatment is etched by the argon sputtering by 25 nm calculated based on the SiO 2 sputter time and the composition analysis is performed on the obtained surface by the X-ray photoelectron spectroscopy, the O content is 20 atomic % or larger.

Assignees

• Alps Electric Co Ltd

Inventors

• Kanno Hiroyuki

Classifications

• C23C18/38 Primary

  Coating with copper · CPC title

• C23C18/1641 Primary

  Organic substrates, e.g. resin, plastic · CPC title

• C23C18/42

  Coating with noble metals · CPC title

• C23C18/204

  Radiation, e.g. UV, laser · CPC title

• B32B2311/08

  Silver · CPC title