Led package structure and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-2019044036-A1
Application number	US-201816054987-A
Country	US
Kind code	A1
Filing date	Aug 3, 2018
Priority date	Aug 4, 2017
Publication date	Feb 7, 2019
Grant date	—

Abstract

The present disclosure provides an LED package structure and a method for manufacturing the LED package structure. The LED package structure includes: a chip scale package (CSP) light emitting element and a shading layer, where the CSP light emitting element includes a light emitting chip, and the light emitting chip includes an electrode group located on a bottom surface of the light emitting chip, the shading layer is disposed on a bottom surface and/or a side surface of the CSP light emitting element. An LED package structure according to the present disclosure solves a problem that the blue light leaking from the bottom surface of the LED chip interferes with the emission color of the CSP emitting device, and reduces the luminous efficiency of the emitting device.

First claim

What is claimed is:

1 . A Light Emitting Diode (LED) package structure, comprising:
a chip scale package (CSP) light emitting element, wherein the CSP light emitting element comprises a light emitting chip, the light emitting chip comprises an electrode group located on a bottom surface of the light emitting chip; and a shading layer, wherein the shading layer is disposed on a bottom surface or a side surface of the CSP light emitting element, or the shading layer is disposed on the bottom surface and the side surface of the CSP light emitting element.

2 . The LED package structure according to claim 1 , wherein the CSP light emitting element further comprises:
a surrounding structure enclosing the side surface of the light emitting chip; and a wavelength conversion layer being disposed on an upper surface of the light emitting chip and the surrounding structure, wherein an arc-shaped structure is formed on an interface between the wavelength conversion layer and the surrounding structure.

3 . The LED package structure according to claim 2 , wherein one end of the arc-shaped structure is substantially coplanar with a top surface of the wavelength conversion layer, and the other end extends to an outer edge of the upper surface of the light emitting chip.

4 . The LED package structure according to claim 2 , wherein one end of the arc-shaped structure is substantially coplanar with a top surface of the wavelength conversion layer, and the other end extends to the side surface of the light emitting chip.

5 . The LED package structure according to claim 2 , wherein the arc-shaped structure is a convex surface curved upward, or
the arc-shaped structure is a concave surface curved downward.

6 . The LED package structure according to claim 2 , further comprising:
a transparent package layer being disposed on the wavelength conversion layer, wherein a contact surface between the wavelength conversion layer and the transparent package layer is an arc-shaped surface protruding upwardly or recessing downwardly.

7 . The LED package structure according to claim 6 , wherein diffuser are dispersed in the transparent package layer.

8 . The LED package structure according to claim 1 , wherein the shading layer is disposed on the bottom surface of the light emitting chip.

9 . The LED package structure according to claim 1 , wherein the shading layer is disposed on the electrode group.

10 . The LED package structure according to claim 1 , wherein the CSP light emitting element comprises a surrounding structure enclosing the side surface of the light emitting chip, wherein the shading layer is disposed on the bottom surface or at least a portion of the side surface of the surrounding structure, or the shading layer is disposed on the bottom surface and at least a portion of the side surface of the surrounding structure.

11 . The LED package structure according to claim 1 , wherein the CSP light emitting element comprises a wavelength conversion layer, a side surface of the shading layer and a side surface of the wavelength conversion layer are substantially coplanar.

12 . The LED package structure according to claim 1 , wherein the CSP light emitting element comprises a wavelength conversion layer, the shading layer is disposed on a side surface of the wavelength conversion layer.

13 . The LED package structure according to claim 1 , wherein the CSP light emitting element comprises:
a surrounding structure enclosing the side surface of the light emitting chip; and a wavelength conversion layer, wherein the shading layer is disposed on a side surface of the wavelength conversion layer, and a side surface and a bottom surface of the surrounding structure.

14 . A Light Emitting Diode (LED) package structure, comprising:
a light emitting chip having a side surface, an upper surface and a bottom surface, wherein the bottom surface is disposed with an electrode group; a surrounding structure enclosing the side surface of the light emitting chip; and a wavelength conversion layer being disposed on the upper surface of the light emitting chip and the surrounding structure, wherein an arc-shaped structure is formed on an interface between the wavelength conversion layer and the surrounding structure.

15 . The LED package structure according to claim 14 , wherein one end of the arc-shaped structure is substantially coplanar with a top surface of the wavelength conversion layer, and the other end extends to an outer edge of the upper surface of the light emitting chip.

16 . The LED package structure according to claim 14 , wherein one end of the arc-shaped structure is substantially coplanar with a top surface of the wavelength conversion layer, and the other end extends to the side surface of the light emitting chip.

17 . The LED package structure according to claim 14 , wherein the arc-shaped structure is a convex surface curved upward, or
the arc-shaped structure is a concave surface curved downward.

18 . The LED package structure according to claim 14 , further comprising:
a shading layer being disposed on a bottom surface or a side surface of the LED package structure, or disposed on the bottom surface and the side surface of the LED package structure.

19 . The LED package structure according to claim 14 , further comprising:
a shading layer being disposed on the bottom surface of the light emitting chip.

20 . The LED package structure according to claim 14 , further comprising:
a shading layer being disposed on the electrode group.

21 . The LED package structure according to claim 14 , further comprising:
a shading layer, wherein the shading layer is disposed on a bottom surface or at least a portion of a side surface of the surrounding structure, or the shading layer is disposed on a bottom surface and at least a portion of a side surface of the surrounding structure.

22 . The LED package structure according to claim 14 , further comprising:
a shading layer, wherein a side surface of the shading layer is substantially coplanar with a side surface of the wavelength conversion layer.

23 . The LED package structure according to claim 14 , further comprising:
a shading layer being disposed on a side surface of the wavelength conversion layer.

24 . The LED package structure according to claim 14 , further comprising:
a shading layer being disposed on a side surface of the wavelength conversion layer, and a side surface and a bottom surface of the surrounding structure.

25 . The LED package structure according to claim 14 , further comprising:
a transparent package layer being disposed on a top surface of the wavelength conversion layer, wherein a contact surface between the wavelength conversion layer and the transparent package layer is an arc-shaped surface protruding upwardly or recessing downwardly.

26 . The LED package structure according to claim 25 , wherein diffuser are dispersed in the transparent package layer.

27 . A Light Emitting Diode (LED) package structure, comprising:
a light emitting chip having a side surface, an upper surface and a bottom surface, wherein the bottom surface is disposed with an electrode group; a wavelength conversion layer being disposed on the side surface and the upper surface of the light emitting chip; and a transparent package layer being disposed on a top surface of the wavel

Assignees

• Everlight Electronics Co Ltd

Inventors

• Pan ke-hao
• Chou Sheng-Wei
• Lan yi-sheng
• Chou Chia-Fong
• Hsieh Chung-Chuan
• Pan Jen-Hao
• Yang Hao-Yu
• Kang Chieh-Yu
• Tseng Tzu-Lun

Classifications

• G02B5/0278

  used in transmission · CPC title

• H01L2933/0033

  Electricity · mapped topic

• H01L33/52

  Electricity · mapped topic

• H01L33/36

  Electricity · mapped topic

• H01L33/505 Primary

  Electricity · mapped topic