Light-emitting device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2018138378-A1
Application number	US-201715787811-A
Country	US
Kind code	A1
Filing date	Oct 19, 2017
Priority date	Oct 19, 2016
Publication date	May 17, 2018
Grant date	—

Abstract

A light-emitting device includes a substrate, a light-emitting component, a translucent layer, an adhesive layer, a reflective layer and translucent encapsulant. The light-emitting component is disposed on the substrate. The adhesive layer is formed between the light-emitting component and the translucent layer. The reflective layer is formed above the substrate and covering a lateral surface of the light-emitting component, a lateral surface of the adhesive layer and a lateral surface of the translucent layer. The translucent encapsulant is formed on the substrate and encapsulating the light-emitting component, the translucent layer and the reflective layer.

First claim

What is claimed is:

1 . A light-emitting device, comprises:
a substrate; a light-emitting component disposed on the substrate; a translucent layer; an adhesive layer formed between the light-emitting component and the translucent layer; a reflective layer formed above the substrate and covering a lateral surface of the light-emitting component, a lateral surface of the adhesive layer and a lateral surface of the translucent layer; and a translucent encapsulant formed on the substrate and encapsulating the light-emitting component, the translucent layer and the reflective layer.

2 . The light-emitting device according to claim 1 , wherein the translucent encapsulant encapsulates a lateral surface of an electrode of the light-emitting component.

3 . The light-emitting device according to claim 1 , wherein the translucent encapsulant has an arc light-emitting surface extending to the substrate.

4 . The light-emitting device according to claim 1 , wherein the translucent encapsulant has an arc light-emitting surface and a flat lateral surface connecting the arc light-emitting surface and a lateral surface of the substrate, and the flat lateral surface and the lateral surface of the substrate are substantially flush with each other.

5 . The light-emitting device according to claim 1 , wherein the reflective layer has a first lateral surface and a second lateral surface, the second lateral surface of the reflective layer is recessed with respect to the first lateral surface, the translucent encapsulant covers the second lateral surface, and a lateral surface of the translucent encapsulant, the first lateral surface of the reflective layer and a lateral surface of the substrate are substantially flush with each other.

6 . The light-emitting device according to claim 1 , wherein the reflective layer has a first lateral surface extending to the substrate, the translucent encapsulant covers the first lateral surface, and a lateral surface of the translucent encapsulant and the first lateral surface of the reflective layer are substantially flush with each other.

7 . The light-emitting device according to claim 1 , wherein the light-emitting component, the translucent layer and the reflective layer form a light-emitting chip, the light-emitting device comprises a plurality of the light-emitting chips and a plurality of the translucent encapsulants, the light-emitting chips are disposed on the substrate, and each translucent encapsulant encapsulates the corresponding light-emitting chip.

8 . The light-emitting device according to claim 1 , wherein the translucent layer is a wavelength conversion layer comprising a high-density phosphor layer and a low-density phosphor layer.

9 . The light-emitting device according to claim 1 , wherein the translucent layer is a glass layer.

10 . The light-emitting device according to claim 1 , wherein the reflective layer and the light-emitting component 120 each has a lower surface, the light-emitting component has an electrode disposed the lower surface of the light-emitting component, and the lower surface of the reflective layer and the lower surface of the light-emitting component are substantially flush with each other.

11 . A manufacturing method of a light-emitting device, comprises:
providing a substrate and a light-emitting component disposed on the substrate; providing a translucent layer; connecting the translucent layer with the light-emitting component by an adhesive layer; forming a reflective layer above the substrate, wherein the reflective layer covers a lateral surface of the light-emitting component, a lateral surface of the adhesive layer and a lateral surface of the translucent layer; and forming a translucent encapsulant on the substrate to encapsulate the light-emitting component, the translucent layer and the reflective layer.

12 . The manufacturing method according to claim 11 , wherein before the step of forming the reflective layer above the substrate, the manufacturing method further comprises:
forming a first singulation path passing through the translucent layer to form the lateral surface of the translucent layer; wherein after the step of forming the reflective layer above the substrate, the manufacturing method further comprises: forming a second singulation path passing through the reflective layer to form a light-emitting chip; disposing the light-emitting chip on the substrate; wherein in the step of forming the translucent encapsulant on the substrate to encapsulate the light-emitting component, the translucent layer and the reflective layer, the translucent encapsulant encapsulates the light-emitting chip.

13 . The manufacturing method according to claim 12 , wherein after the step of forming the translucent encapsulant on the substrate to encapsulate the light-emitting component, the translucent layer and the reflective layer, the manufacturing method further comprises:
forming a third singulation path passing through the substrate.

14 . The manufacturing method according to claim 12 , wherein after the step of forming the translucent encapsulant on the substrate to encapsulate the light-emitting component, the translucent layer and the reflective layer, the manufacturing method further comprises:
forming a third singulation path passing through the translucent encapsulant and the substrate, wherein the translucent encapsulant and the substrate each forms a lateral surface, and the lateral surface of the translucent encapsulant and the lateral surface of the substrate are substantially aligned or flush with each other.

15 . The manufacturing method according to claim 11 , wherein before the step of forming the reflective layer above the substrate, the manufacturing method further comprises:
forming a first singulation path passing through the reflective layer to form the lateral surface of the reflective layer; wherein after the step of forming the reflective layer above the substrate, the manufacturing method further comprises: forming a second singulation path passing through the reflective layer and the adhesive layer to form a light-emitting chip; disposing the light-emitting chip on the substrate; wherein in the step of forming the translucent encapsulant on the substrate to encapsulate the light-emitting component, the translucent layer and the reflective layer, the translucent encapsulant encapsulates the light-emitting chip.

16 . The manufacturing method according to claim 15 , wherein in the step of forming the second singulation path passing through the reflective layer and the adhesive layer to form the light-emitting chip and remove the adhesive layer formed on the lateral surface of the light-emitting component.

Assignees

• Genesis Photonics Inc

Inventors

• Hung Chin-Hua
• Hung Cheng-Wei
• Lin Yu-Feng
• Chen Cheng-Chuan

Classifications

• H10W90/00

  Package configurations · CPC title

• H10H29/857

  Interconnections (of active-matrix LED displays H10H29/49) · CPC title

• H10H29/8515

  not being in contact with the bodies · CPC title

• H10H20/8515

  not being in contact with the bodies · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title