Photosensitive resin composition, dry film using same, printed wiring board, and method for manufacturing printed wiring board

Patent metadata

Field	Value
Publication number	US-2019031790-A1
Application number	US-201716069234-A
Country	US
Kind code	A1
Filing date	Jan 12, 2017
Priority date	Jan 12, 2016
Publication date	Jan 31, 2019
Grant date	—

Abstract

Provided is a photosensitive resin composition: which has basic performance such as electrical insulation, soldering heat resistance, thermal shock resistance, solvent resistance, acid resistance, and alkali resistance required in a photosensitive resin composition used to produce a printed wiring board; which may form a resist shape having excellent linearity in the contours of the resist pattern because it is difficult to generate undercutting in which the bottom part is washed away or defects in the upper part of a resist; and which has excellent adhesion to a copper substrate and excellent fluidity. Also provided are a dry film prepared by using the photosensitive resin composition, a printed wiring board, and a method for producing the printed wiring board. The photosensitive resin composition contains (A) an acid-modified vinyl group-containing epoxy resin, (B) a photopolymerization initiator, (C) an ion scavenger having at least one selected from the group consisting of Zr, Bi, Mg, and Al, and (D) a photopolymerizable compound.

First claim

1 . A photosensitive resin composition comprising:
(A) an acid-modified vinyl group-containing epoxy resin; (B) a photopolymerization initiator; and (C) an ion scavenger having at least one selected from the group consisting of Zr, Bi, Mg, and Al; and (D) a photopolymerizable compound.

2 . The photosensitive resin composition according to claim 1 , wherein the component (A) contains (Al) at least one acid-modified vinyl group-containing epoxy resin obtained by using a bisphenol novolac type epoxy resin (a1), and (A2) at least one acid-modified vinyl group-containing epoxy resin obtained by using an epoxy resin (a2) different from the epoxy resin (a1).

3 . The photosensitive resin composition according to claim 2 , wherein the epoxy resin (a2) is at least one selected from the group consisting of a novolac type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, and a triphenol methane type epoxy resin.

4 . The photosensitive resin composition according to claim 2 , wherein the acid-modified vinyl group-containing epoxy resins (A1) and (A2) are resins obtained by allowing a saturated or unsaturated group-containing polybasic acid anhydride (c) to react with resins (A1′) and (A2′) obtained by allowing a vinyl group-containing monocarboxylic acid (b) to react with the epoxy resins (a1) and (a2), respectively.

5 . The photosensitive resin composition according to claim 2 , wherein the bisphenol novolac type epoxy resin (a1) has a structural unit represented by the following general formula (I) or (II):

wherein R 11 represents a hydrogen atom or a methyl group, and Y 1 and Y 2 each independently represent a hydrogen atom or a glycidyl group, provided that plural R 11 's are the same or different and at least one of Y 1 and Y 2 represents a glycidyl group:

wherein R 12 represents a hydrogen atom or a methyl group, and Y 3 and Y 4 each independently represent a hydrogen atom or a glycidyl group, provided that plural R 12 's are the same or different and at least one of Y 3 and Y 4 represents a glycidyl group.

6 . The photosensitive resin composition according to claim 2 , wherein the bisphenol novolac type epoxy resin (a1) has the structural unit represented by general formula (I), and the epoxy resin (a2) is a bisphenol A type epoxy resin or a bisphenol F type epoxy resin, which contains a structural unit represented by the following general formula (IV):

wherein R 14 represents a hydrogen atom or a methyl group, Y 6 represents a hydrogen atom or a glycidyl group, and plural R 14 's are the same or different.

7 . The photosensitive resin composition according to claim 1 , wherein the component (A) contains at least one acid-modified vinyl group-containing epoxy resin (A2) obtained by using an epoxy resin (a2) different from a bisphenol novolac type epoxy resin (a1).

8 . The photosensitive resin composition according to claim 7 , wherein the acid-modified vinyl group-containing epoxy resin (A2) is a resin obtained by allowing a saturated or unsaturated group-containing polybasic acid anhydride (c) to react with a resin (A2′) obtained by allowing a vinyl group-containing monocarboxylic acid (b) to react with the epoxy resin (a2).

9 . The photosensitive resin composition according to claim 7 , wherein the epoxy resin (a2) is a novolac type epoxy resin having a structural unit represented by general formula (III):

wherein R 13 represents a hydrogen atom or a methyl group, and Y 5 represents a hydrogen atom or a glycidyl group.

10 . The photosensitive resin composition according to claim 1 , wherein the photopolymerization initiator (B) is at least one selected from the group consisting of an alkylphenone-based photopolymerization initiator, a compound having a thioxanthone skeleton (thioxanthone-based photopolymerization initiator), and an acylphosphine oxide-based photopolymerization initiator.

11 . The photosensitive resin composition according to claim 1 , wherein the ion scavenger (C) is at least one selected from the group consisting of an inorganic ion exchanger that captures cations, an inorganic ion exchanger that captures anions, and an inorganic ion exchanger that captures cations and anions.

12 . The photosensitive resin composition according to claim 1 , wherein the photopolymerizable compound (D) is a compound containing a (meth)acryloyl group.

13 . The photosensitive resin composition according to claim 1 , further comprising (E) a pigment.

14 . The photosensitive resin composition according to claim 1 , further comprising (F) an inorganic filler.

15 . The photosensitive resin composition according to claim 1 , wherein the contents of the acid-modified vinyl group-containing epoxy resin (A), the photopolymerization initiator (B), the ion scavenger (C), and the photopolymerizable compound (D) are from 20 to 80% by mass, from 0.2 to 15% by mass, from 0.1 to 10% by mass, and from 0.1 to 10% by mass, respectively, based on a total solid content in the photosensitive resin composition.

16 . A dry film comprising a carrier film and a photosensitive layer prepared by using the photosensitive resin composition according to claim 1 .

17 . A printed wiring board comprising a permanent mask resist formed by the photosensitive resin composition according to claim 1 .

18 . The printed wiring board according to claim 17 , wherein the permanent mask resist has a thickness of 10 μm or more.

19 . A method for producing a printed wiring board, the method comprising, in the following order:
providing a photosensitive layer by using the photosensitive resin composition according to claim 1 ; forming a resist pattern by using the photosensitive layer; and curing the resist pattern to thereby form a permanent mask resist.

20 . A method for producing a printed wiring board, the method comprising, in the following order:
providing a photosensitive layer by using the photosensitive resin composition according to the dry film according to claim 16 ; forming a resist pattern by using the photosensitive layer; and curing the resist pattern to thereby form a permanent mask resist.

Assignees

• Hitachi Chemical Co Ltd

Inventors

• Komuro Nobuhito
• Daijima Yuta

Classifications

• C08F290/06

  Polymers provided for in subclass C08G · CPC title

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• G03F7/027

  Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence) · CPC title

• C08F2/48 Primary

  by ultraviolet or visible light · CPC title

• C08F290/062 Primary

  Polyethers · CPC title