Semiconductor light emitting device

Patent metadata

Field	Value
Publication number	US-2019020174-A1
Application number	US-201616069601-A
Country	US
Kind code	A1
Filing date	Dec 15, 2016
Priority date	Jan 28, 2016
Publication date	Jan 17, 2019
Grant date	—

Abstract

A semiconductor light emitting device includes a substrate a semiconductor light emitting element that is disposed on the substrate and that emits light along a direction substantially parallel to a main surface of the substrate a wavelength conversion element that is disposed on a light emitting side of the semiconductor light emitting element, that absorbs a portion of the light emitted from the semiconductor light emitting element, and that emits light having a wavelength different from that of the absorbed light; and a holding member that is disposed on the substrate and holds the wavelength conversion element.

First claim

1 . A semiconductor light emitting device, comprising:
a substrate; a semiconductor light emitting element that is disposed on the substrate and that emits light along a direction substantially parallel to a main surface of the substrate; a wavelength conversion element that is disposed on light emitting side of the semiconductor light emitting element, that absorbs a portion of the light emitted from the semiconductor light emitting element, and that emits light having a wavelength different from that of the absorbed light; and a holding member that is disposed on the substrate and holds the wavelength conversion element.

2 . The semiconductor light emitting device according to claim 1 , wherein
the holding member is disposed in at least a portion of a region around the semiconductor light emitting element on the substrate.

3 . The semiconductor light emitting device according to claim 2 , wherein
the holding member is disposed to surround the semiconductor light emitting element and has an opening facing a light emitting face of the semiconductor light emitting element, and the wavelength conversion element is coupled to an edge of the opening of the holding member.

4 . The semiconductor light emitting device according to claim 1 , wherein
the holding member includes a material having thermal conductivity lower than that of the substrate.

5 . The semiconductor light emitting device according to claim 4 , wherein
the substrate includes a metal, and the holding member includes a nonmetal.

6 . The semiconductor light emitting device according to claim 1 , wherein
a gap is provided between the wavelength conversion element and the substrate.

7 . The semiconductor light emitting device according to claim 1 , wherein
the wavelength conversion element is coupled to the substrate.

8 . The semiconductor light emitting device according to claim 7 , wherein
the substrate has one or a plurality of recesses between a portion facing the semiconductor light emitting element and a portion coupled to the wavelength conversion element.

9 . The semiconductor light emitting device according to claim 7 , wherein
the substrate has one or a plurality of openings between a portion facing the semiconductor light emitting element and a portion coupled to the wavelength conversion element.

10 . The semiconductor light emitting device according to claim 1 , further comprising
a first heat dissipation member coupled to the substrate and disposed to face the semiconductor light emitting element, with the substrate being provided therebetween.

11 . The semiconductor light emitting device according to claim 1 , further comprising
a second heat dissipation member disposed to face the wavelength conversion element.

12 . The semiconductor light emitting device according to claim 1 , further comprising
a sealing member provided to cover the semiconductor light emitting element.

13 . The semiconductor light emitting device according to claim 1 , further comprising
a lens between the semiconductor light emitting element and the wavelength conversion element.

14 . The semiconductor light emitting device according to claim 1 , further comprising:
a sealing member provided to cover the semiconductor light emitting element, wherein a portion of the sealing member facing the light emitting face of the semiconductor light emitting element has a lens shape.

15 . The semiconductor light emitting device according to claim 1 , wherein
the wavelength conversion element has a base material that carries a wavelength conversion material, and one or both of faces of a light incident side and a light emitting side of the base material have a lens shape.

16 . The semiconductor light emitting device according to claim 1 , wherein
the semiconductor light emitting element comprises a semiconductor laser.

17 . The semiconductor light emitting device according to claim 1 , wherein
radiation angles of light emitted from the semiconductor light emitting element are different in a direction parallel to the substrate and a direction perpendicular to the substrate.

18 . The semiconductor light emitting device according to claim 1 , wherein
a surface shape of the substrate is rectangular, and the holding member is disposed along a periphery of the substrate.

19 . The semiconductor light emitting device according to claim 18 , further comprising:
a pair of electrodes with one end of each electrode being electrically coupled to the semiconductor light emitting element and another end of each electrode serving as a terminal used for external coupling, wherein the pair of electrodes penetrates a portion of the holding member and projects to outside toward a direction opposite to a light emitting direction of the semiconductor light emitting element.

20 . The semiconductor light emitting device according to claim 1 , wherein
the semiconductor light emitting element emits blue light, and the wavelength conversion element includes phosphor that emits yellow light or phosphor that emits red light and green light, using the blue light as excitation light.

Assignees

• Sony Corp

Inventors

• Kawanishi Hidekazu
• Murayama Masahiro

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H01S5/02212

  Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis · CPC title

• H01S5/0609

  acting on an absorbing region, e.g. wavelength convertors · CPC title

• H01L33/50

  Electricity · mapped topic