High electron mobility transistors and methods for fabricating the same

US2018374944A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018374944-A1
Application numberUS-201816017833-A
CountryUS
Kind codeA1
Filing dateJun 25, 2018
Priority dateJun 23, 2017
Publication dateDec 27, 2018
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A high electron mobility transistor (HEMT) and method of producing the same are provided. The HEMT includes a barrier layer formed on a GaN layer. The HEMT also includes a ZrO2 gate dielectric layer formed by either a ZTB precursor, a TDMA-Zr precursor, or both. The HEMT may also include a recess in the barrier layer in the gate region of the HEMT. The HEMTs may operate in an enhancement mode.

First claim

Opening claim text (preview).

What is claimed is: 1 . A high electron mobility transistor, comprising: a source; a drain; a GaN layer; a barrier layer disposed on the GaN layer; a gate metal; and a zirconium oxide dielectric layer at least partially surrounding the gate metal, wherein the zirconium oxide dielectric layer is formed from a zirconium (IV) tert-butoxide precursor. 2 . The transistor according to claim 1 , further comprising: a recess in the barrier layer in the a region of the gate metal, wherein the zirconium oxide dielectric layer is disposed in the recess in the barrier layer. 3 . The transistor according to claim 2 , wherein the recess in the barrier layer extends to the GaN layer. 4 . The transistor according to claim 2 , wherein a current conducting channel is formed in the GaN layer when a threshold voltage is applied to the gate metal. 5 . The transistor according to claim 4 , wherein the current conducting channel is a two-dimensional electron gas. 6 . A method forming a high electron mobility transistor, comprising: forming a barrier layer on a GaN substrate; forming a source and a drain; removing a portion of the barrier layer; forming a zirconium oxide dielectric in a region corresponding to the removed portion of the barrier layer, wherein the zirconium oxide dielectric is formed from a zirconium (IV) tert-butoxide precursor; and forming a gate metal, wherein the gate metal is at least partially surrounded by the zirconium oxide dielectric.

Assignees

Inventors

Classifications

  • in the presence of a plasma [PECVD] · CPC title

  • the material containing zirconium, e.g. ZrO2 · CPC title

  • deposition by cyclic CVD, e.g. ALD, ALE or pulsed CVD · CPC title

  • Nitrides · CPC title

  • the materials being characterised by the deposition precursor materials · CPC title

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What does patent US2018374944A1 cover?
A high electron mobility transistor (HEMT) and method of producing the same are provided. The HEMT includes a barrier layer formed on a GaN layer. The HEMT also includes a ZrO2 gate dielectric layer formed by either a ZTB precursor, a TDMA-Zr precursor, or both. The HEMT may also include a recess in the barrier layer in the gate region of the HEMT. The HEMTs may operate in an enhancement mode.
Who is the assignee on this patent?
Us Gov Sec Navy
What technology area does this patent fall under?
Primary CPC classification H01L29/7787. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Dec 27 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).