Novel compound, photopolymerization initiator comprising said compound, and photosensitive resin composition containing said photopolymerization initiator

Patent metadata

Field	Value
Publication number	US-2018370908-A1
Application number	US-201615781623-A
Country	US
Kind code	A1
Filing date	Dec 7, 2016
Priority date	Dec 9, 2015
Publication date	Dec 27, 2018
Grant date	—

Abstract

The purpose of the present invention is to provide: a novel compound which can generate a base and radical upon the irradiation with an active energy ray; a photopolymerization initiator which comprises the novel compound; and a photosensitive resin composition which contains the photopolymerization initiator, has high sensitivity and excellent storage stability, and can be formed into a cured article that does not have a metal-corrosive property. The novel compound is represented by formula (1):

(wherein R 1 to R 6 independently represent a hydrogen atom, a hydroxy group, an alkoxy group, an organic group other than the aforementioned substituents, or the like; X represents a residue having a structure such that n hydrogen atoms are removed from a saturated hydrocarbon containing a ring structure; and n represents an integer of 1 to 6).

First claim

1 - 9 . (canceled)

10 . A compound represented by the following formula (1):

wherein in formula (1), R 1 represents a hydrogen atom, a hydroxyl group, an alkoxy group or an organic group other than the aforementioned substituents, when there are a plurality of R 1 , each R 1 may be the same or different from each other, R 2 , R 3 , R 5 and R 6 each independently represent a hydrogen atom, a halogen atom, a hydroxyl group, an alkoxy group, mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a cyano group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, an amino group, an ammonio group or an organic group other than the aforementioned substituents; R 2 and R 3 on the same benzene ring may be connected to form a ring structure; R 5 and R 6 on the same benzene ring may be connected to form a ring structure; R 4 each independently an organic group containing a thioether bond; X represents a residue being a saturated hydrocarbon including a ring structure from which n hydrogen atoms are removed; and n represents an integer of 1 to 6.

11 . The compound according to claim 10 , wherein the organic group of R 4 is an alkyl group or an aryl group.

12 . The compound according to claim 10 , represented by formula (2):

wherein in formula (2), R 1 to R 6 represent the same meanings as R 1 to R 6 in formula (1) described in claim 10 ; A represents a cycloalkylene group; and D represents an alkylene group.

13 . The compound according to claim 12 , represented by formula (3):

wherein in formula (3), R 1 to R 6 represent the same meanings as R 1 to R 6 in formula (2) described in claim 12 .

14 . The compound according to claim 10 , wherein R 1 is a hydroxyl group.

15 . A photopolymerization initiator comprising the compound according to claim 10 .

16 . A photosensitive resin composition comprising a polymer precursor capable of being polymerized by irradiation or by both of irradiation and heating in the presence of a photopolymerization initiator, and the photopolymerization initiator according to claim 15 .

17 . The photosensitive resin composition according to claim 16 , wherein the polymer precursor comprises at least one selected from the group consisting of a compound having a substituent selected from the group consisting of an epoxy group, an isocyanate group, an oxetane group, an acryloyl group, a methacryloyl group, a maleimide group and a thiirane group; a polysiloxane precursor, a polyimide precursor, and a polybenzoxazole precursor.

18 . The photosensitive resin composition according to claim 17 , wherein the polymer precursor comprises a compound having an epoxy group.

19 . A method for forming a pattern comprising:
changing solubility of an irradiation area by irradiation to a coat, a film or a formed body of the photosensitive resin composition according to claim 16 in a predefined pattern, followed by heating or on heating; and removing a non-irradiated area by performing development.

Assignees

• Univ Tokyo Science Found
• Nippon Kayaku Kk

Inventors

• TERADA Kiwamu
• Yamamoto Kazuyoshi
• Arimitsu Koji

Classifications

• C08F2/50

  with sensitising agents · CPC title

• G03F7/0385

  using epoxidised novolak resin · CPC title

• G03F7/0045

  with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

• G03F7/0387

  Polyamides or polyimides · CPC title

• G03F7/038

  Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title