Chip-bonding system and method

Patent metadata

Field	Value
Publication number	US-2018366353-A1
Application number	US-201616062435-A
Country	US
Kind code	A1
Filing date	Dec 15, 2016
Priority date	Dec 15, 2015
Publication date	Dec 20, 2018
Grant date	—

Abstract

A die bonding system and a die bonding method are disclosed, in which dies ( 10 ) fed from a first motion stage ( 100 ) serving as a die source are re-arranged on a transfer tray ( 20 ) carried on a second motion stage ( 200 ) and bonded to a substrate ( 30 ) carried on a third motion stage ( 300 ). Pickup and transfer of the dies ( 10 ) between the three motion stages are accomplished by two motion mechanisms ( 010, 020 ) in such a manner that the dies ( 10 ) picked up from the first motion stage ( 100 ) are placed on the second motion stage ( 200 ) in an arrangement based upon a required final arrangement of them on the substrate ( 30 ). In other words, the dies ( 10 ) are re-arranged according to the required arrangement on the substrate ( 30 ). In this way, the need for re-arranging the dies after the transfer tray ( 20 ) is flipped and before they are bonded to the substrate is eliminated. Therefore, with the die bonding system, multiple dies 10 are allowed to be transferred simultaneously to the substrate based on the process requirements by flipping the mechanism for flipping the dies only once, which results in enhanced production efficiency and time savings and addresses the requirements for mass production.

First claim

1 . A die bonding system, comprising: a first motion stage for feeding dies, a second motion stage for carrying a transfer tray and a third motion stage for supporting a substrate onto which the dies are to be bonded that are arranged in sequence; a first motion mechanism for picking up the dies from the first motion stage and placing the dies on the second motion stage; a second motion mechanism for picking up the transfer tray from the second motion stage and placing the transfer tray on the third motion stage; and a host system for controlling the die bonding system, wherein: the transfer tray is able to retain the dies; the second motion mechanism is able to flip the transfer tray; and the dies are ultimately bonded to the substrate.

2 . The die bonding system of claim 1 , further comprising detection systems each configured to detect a position of an object on a corresponding one of the first, second and third motion stages.

3 . The die bonding system of claim 2 , wherein the detection systems comprise a first alignment sub-system for aligning the first motion mechanism with the dies, a second alignment sub-system for causing the first motion mechanism to align the dies with the transfer tray and a third alignment sub-system for causing the second motion mechanism to align the transfer tray with the substrate, each of the first, second and third alignment sub-systems signal-connected to the host system.

4 . The die bonding system of claim 1 , further comprising a first motion stage control sub-system for controlling movement of the first motion stage, a second motion stage control sub-system for controlling movement of the second motion stage and a third motion stage control sub-system for controlling movement of the third motion stage, the first, second and third motion stage control sub-systems respectively signal-connected to the host system.

5 . The die bonding system of claim 1 , further comprising a first motion control sub-system for controlling the first motion mechanism and a second motion control sub-system for controlling the second motion mechanism, both the first and second motion control sub-systems signal-connected to the host system.

6 . The die bonding system of claim 1 , wherein the dies are adhesively retained on the first motion stage.

7 . The die bonding system of claim 1 , wherein the dies are retained on the transfer tray by electrostatic suction, vacuum suction or an organic adhesive.

8 . The die bonding system of claim 1 , wherein the substrate is fabricated from a metallic material, a semiconductor material or an organic material.

9 . The die bonding system of claim 1 , wherein the dies are bonded to the substrate adhesively or by thermal-press bonding.

10 . The die bonding system of claim 1 , wherein the transfer tray is provided with alignment marks serving as a reference for re-arrangement of the dies.

11 . The die bonding system of claim 10 , wherein the substrate is provided with arrangement marks corresponding to the alignment marks of the transfer tray, and wherein during the bonding of the dies on the transfer tray to the substrate, the alignment marks of the transfer tray and the arrangement marks of the substrate facilitate an alignment of the dies with the substrate.

12 . A die bonding method using the die bonding system as defined in claim 1 , comprising the steps of:
1) retention of dies on the first motion stage and pickup of the dies by the first motion mechanism from the first motion stage; 2) placement and re-arrangement of the dies on the transfer tray on the second motion stage by the first motion mechanism; 3) pickup of the transfer tray from the second motion stage by the second motion mechanism; 4) flipping of the transfer tray by the second motion mechanism and bonding of the re-arranged dies on the transfer tray to the substrate; and 5) taking away the transfer tray by the second motion mechanism, which results in detachment of the dies from the transfer tray.

13 . The die bonding method of claim 12 , wherein the re-arrangement of the dies on the transfer tray is accomplished by rotating or moving the transfer tray by the second motion stage under a control of the host system each time when the first motion mechanism picks up one of the dies from the first motion stage, followed by placement of the picked die on a location of the transfer tray corresponding to the die by the first motion mechanism.

Assignees

• Shanghai Micro Electronics Equipment Group Co Ltd

Inventors

• Chen Yonghui
• Tang Shiyi
• Li Huili

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W72/07173

  Means for moving chips, wafers or other parts, e.g. conveyor belts · CPC title

• H10W46/607

  Located on parts of packages, e.g. on encapsulations or on package substrates · CPC title

• H10W46/301

  for alignment · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title