Film material and cold spray method

US2018355487A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018355487-A1
Application numberUS-201815952406-A
CountryUS
Kind codeA1
Filing dateApr 13, 2018
Priority dateJun 8, 2017
Publication dateDec 13, 2018
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Provided are: a film material for use in a cold spray device; and a cold spray method, each of the film material and the cold spray method enabling an improvement in rate of adhesion of a spray material to a base material. A film material for use in a cold spray device ( 100 ) and to be sprayed onto a base material ( 20 ) includes a spray material and flux powder.

First claim

Opening claim text (preview).

1 . A film material for use in a cold spray device and to be sprayed onto a base material, comprising: a spray material; and flux powder. 2 . The film material as set forth in claim 1 , wherein: the spray material is nickel; the flux powder is soldering flux powder; and the film material comprises the spray material and the flux powder in a volume ratio ranging from 1 : 3 to 3 : 1 . 3 . A cold spray method comprising the steps of: mixing a spray material and flux powder so as to produce a film material; and spraying the film material, together with a carrier gas, onto a base material so as to form a film on the base material. 4 . The cold spray method as set forth in claim 3 , wherein the carrier gas is set to a temperature of not less than 250° C. and not more than 340° C. 5 . The cold spray method as set forth in claim 3 , wherein the carrier gas is set to a pressure of not more than 1 Mpa.

Assignees

Inventors

Classifications

  • by application of heat or pressure and heat (C23C24/04 takes precedence) · CPC title

  • Selection of non-metallic compositions, e.g. coatings or fluxes (B23K35/34 takes precedence); Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest · CPC title

  • with organic compounds as principal constituents · CPC title

  • C23C24/04Primary

    Impact or kinetic deposition of particles · CPC title

  • without intermediate formation of a liquid in the layer · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2018355487A1 cover?
Provided are: a film material for use in a cold spray device; and a cold spray method, each of the film material and the cold spray method enabling an improvement in rate of adhesion of a spray material to a base material. A film material for use in a cold spray device ( 100 ) and to be sprayed onto a base material ( 20 ) includes a spray material and flux powder.
Who is the assignee on this patent?
Tatsuta Electric Wire & Cable Co Ltd
What technology area does this patent fall under?
Primary CPC classification C23C24/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Dec 13 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).