Film growing method
US-2015368779-A1 · Dec 24, 2015 · US
US2018355487A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2018355487-A1 |
| Application number | US-201815952406-A |
| Country | US |
| Kind code | A1 |
| Filing date | Apr 13, 2018 |
| Priority date | Jun 8, 2017 |
| Publication date | Dec 13, 2018 |
| Grant date | — |
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Provided are: a film material for use in a cold spray device; and a cold spray method, each of the film material and the cold spray method enabling an improvement in rate of adhesion of a spray material to a base material. A film material for use in a cold spray device ( 100 ) and to be sprayed onto a base material ( 20 ) includes a spray material and flux powder.
Opening claim text (preview).
1 . A film material for use in a cold spray device and to be sprayed onto a base material, comprising: a spray material; and flux powder. 2 . The film material as set forth in claim 1 , wherein: the spray material is nickel; the flux powder is soldering flux powder; and the film material comprises the spray material and the flux powder in a volume ratio ranging from 1 : 3 to 3 : 1 . 3 . A cold spray method comprising the steps of: mixing a spray material and flux powder so as to produce a film material; and spraying the film material, together with a carrier gas, onto a base material so as to form a film on the base material. 4 . The cold spray method as set forth in claim 3 , wherein the carrier gas is set to a temperature of not less than 250° C. and not more than 340° C. 5 . The cold spray method as set forth in claim 3 , wherein the carrier gas is set to a pressure of not more than 1 Mpa.
by application of heat or pressure and heat (C23C24/04 takes precedence) · CPC title
Selection of non-metallic compositions, e.g. coatings or fluxes (B23K35/34 takes precedence); Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest · CPC title
with organic compounds as principal constituents · CPC title
Impact or kinetic deposition of particles · CPC title
without intermediate formation of a liquid in the layer · CPC title
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