Polishing table and polishing apparatus having the same

US2018345447A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018345447-A1
Application numberUS-201815996988-A
CountryUS
Kind codeA1
Filing dateJun 4, 2018
Priority dateJun 6, 2017
Publication dateDec 6, 2018
Grant date

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An object of the present invention is to provide a polishing table capable of preventing peeling or detachment of a coating of the polishing table, thereby to enable an operation for replacement of a polishing pad to be easily conducted. One embodiment of the present invention provides a polishing table having a support surface configured to support a polishing pad, the polishing pad being adapted to be used for polishing a substrate, the polishing table comprising: a stacked body comprising a stack of a porous layer and a non-porous layer, the porous layer including open pores formed in a surface thereof disposed to face a polishing pad; and a resin-based coating material disposed in the open pores so as to form at least a part of the support surface of the polishing table.

First claim

Opening claim text (preview).

What is claimed is: 1 . A polishing table for a polishing apparatus configured to polish a substrate, having a support surface configured to support a polishing pad, said polishing pad being adapted to be used for polishing a substrate, said polishing table comprising: a stacked body comprising a stack of a porous layer and a non-porous layer, said porous layer including open pores formed in a surface thereof disposed to face a polishing pad; and a resin-based coating material disposed in said open pores so as to form at least a part of said support surface of said polishing table. 2 . A polishing table according to claim 1 , wherein said resin-based coating material is disposed such that said surface of the porous layer disposed to face the polishing pad is entirely covered by said resin-based coating material. 3 . A polishing table according to claim 1 , wherein said surface of the porous layer disposed to face the polishing pad is exposed outside said open pores, and said support surface of the polishing table is formed by said exposed surface of the porous layer and said resin-based coating material in said open pores. 4 . A polishing table according to claim 1 , wherein said porous layer comprises a ceramic material. 5 . A polishing table according to claim 2 , wherein said porous layer comprises a ceramic material. 6 . A polishing table according to claim 3 , wherein said porous layer comprises a ceramic material. 7 . A polishing table according to claim 1 , wherein said non-porous layer includes a flow passage formed therein, which allows a cooling fluid to flow through the polishing table, said flow passage being formed in a position remote from a connection between said porous layer and said non-porous layer. 8 . A polishing table according to claim 2 , wherein said non-porous layer includes a flow passage formed therein, which allows a cooling fluid to flow through the polishing table, said flow passage being formed in a position remote from a connection between said porous layer and said non-porous layer. 9 . A polishing table according to claim 3 , wherein said non-porous layer includes a flow passage formed therein, which allows a cooling fluid to flow through the polishing table, said flow passage being formed in a position remote from a connection between said porous layer and said non-porous layer. 10 . A polishing table according to claim 4 , wherein said non-porous layer includes a flow passage formed therein, which allows a cooling fluid to flow through the polishing table, said flow passage being formed in a position remote from a connection between said porous layer and said non-porous layer. 11 . A polishing table according to claim 5 , wherein said non-porous layer includes a flow passage formed therein, which allows a cooling fluid to flow through the polishing table, said flow passage being formed in a position remote from a connection between said porous layer and said non-porous layer. 12 . A polishing table according to claim 6 , wherein said non-porous layer includes a flow passage formed therein, which allows a cooling fluid to flow through the polishing table, said flow passage being formed in a position remote from a connection between said porous layer and said non-porous layer.

Assignees

Inventors

Classifications

  • for porous or cellular structure · CPC title

  • B24B37/22Primary

    characterised by a multi-layered structure · CPC title

  • characterised by the composition or properties of the pad materials · CPC title

  • characterised by the shape of the lapping plate surface, e.g. grooved · CPC title

  • Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant (cooling or lubricating during dressing operation B24B53/095; incorporated in grinding wheels B24D) · CPC title

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Frequently asked questions

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What does patent US2018345447A1 cover?
An object of the present invention is to provide a polishing table capable of preventing peeling or detachment of a coating of the polishing table, thereby to enable an operation for replacement of a polishing pad to be easily conducted. One embodiment of the present invention provides a polishing table having a support surface configured to support a polishing pad, the polishing pad being adap…
Who is the assignee on this patent?
Ebara Corp
What technology area does this patent fall under?
Primary CPC classification B24B37/22. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Dec 06 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).