Method of forming two-dimensional and three-dimensional semiconductor chip arrays

Patent metadata

Field	Value
Publication number	US-2018337208-A1
Application number	US-201715596292-A
Country	US
Kind code	A1
Filing date	May 16, 2017
Priority date	May 16, 2017
Publication date	Nov 22, 2018
Grant date	—

Abstract

A sensor chip formed from a plurality of sensor chips fabricated on a wafer, the wafer including a top surface, a bottom surface opposite the top surface and a thickness between the top and bottom surfaces, the sensor chip including an active area formed on the top surface, a first sacrificial edge including a first fiducial and a second fiducial, and a first score line formed in a first portion of the thickness on the top surface between the first sacrificial edge and the active area.

First claim

1 . A method of fabricating an array of a plurality of sensor chips on a substrate, the method comprising:
forming a first sensor chip of the plurality of sensor chips, the first sensor chip comprising a first sacrificial edge and a second sacrificial edge, each of the first and second sacrificial edges comprises a first fiducial and a second fiducial; bonding the first sensor chip to the substrate; forming a second sensor chip of the plurality of sensor chips, the second sensor chip comprising a third sacrificial edge and a fourth sacrificial edge, each of the third and fourth sacrificial edges comprises a first fiducial and a second fiducial; performing at least one of the following steps of aligning:
aligning at least one of the first and second fiducials of the first sacrificial edge with at least one of the first second fiducials of the fourth sacrificial edge; and,
aligning at least one of the first and second fiducials of the second sacrificial edge with at least one of the first second fiducials of the third sacrificial edge; and,
bonding the second sensor chip to the substrate.

2 . The method of claim 1 further comprising:
forming a third sensor chip of the plurality of sensor chips, the third sensor chip comprising a fifth sacrificial edge and a sixth sacrificial edge, each of the fifth and sixth sacrificial edges comprises a first fiducial and a second fiducial;
performing at least one of the following steps of aligning:
aligning at least one of the first and second fiducials of the first sacrificial edge with at least one of the first second fiducials of the sixth sacrificial edge; and,
aligning at least one of the first and second fiducials of the second sacrificial edge with at least one of the first second fiducials of the fifth sacrificial edge; and,

bonding the third sensor chip to the substrate.

3 . The method of claim 2 further comprising:
forming a fourth sensor chip of the plurality of sensor chips, the fourth sensor chip comprising a seventh sacrificial edge and an eighth sacrificial edge, each of the seventh and eighth sacrificial edges comprises a first fiducial and a second fiducial;
performing at least one of the following steps of aligning:
aligning at least one of the first and second fiducials of the fourth sacrificial edge with at least one of the first second fiducials of the seventh sacrificial edge;
aligning at least one of the first and second fiducials of the third sacrificial edge with at least one of the first second fiducials of the eighth sacrificial edge;
aligning at least one of the first and second fiducials of the sixth sacrificial edge with at least one of the first second fiducials of the seventh sacrificial edge; and,
aligning at least one of the first and second fiducials of the fifth sacrificial edge with at least one of the first second fiducials of the eighth sacrificial edge; and,

bonding the fourth sensor chip to the substrate.

4 . The method of claim 3 further comprising:
removing the first and sixth sacrificial edges;
forming a fifth sensor chip of the plurality of sensor chips, the fifth sensor chip comprising a ninth sacrificial edge and a tenth sacrificial edge, each of the ninth and tenth sacrificial edges comprises a first fiducial and a second fiducial;
performing at least one of the following steps of aligning:
aligning at least one of the first and second fiducials of the second sacrificial edge with at least one of the first second fiducials of the tenth sacrificial edge;
aligning at least one of the first and second fiducials of the third sacrificial edge with at least one of the first second fiducials of the tenth sacrificial edge; and,
aligning at least one of the first and second fiducials of the fourth sacrificial edge with at least one of the first second fiducials of the tenth sacrificial edge; and,

bonding the fifth sensor chip to the substrate.

5 . The method of claim 4 further comprising:
forming a sixth sensor chip of the plurality of sensor chips, the sixth sensor chip comprising an eleventh sacrificial edge and a twelfth sacrificial edge, each of the eleventh and twelfth sacrificial edges comprises a first fiducial and a second fiducial;
performing at least one of the following steps of aligning:
aligning at least one of the first and second fiducials of the fifth sacrificial edge with at least one of the first second fiducials of the eleventh sacrificial edge;
aligning at least one of the first and second fiducials of the eighth sacrificial edge with at least one of the first second fiducials of the eleventh sacrificial edge;
aligning at least one of the first and second fiducials of the tenth sacrificial edge with at least one of the first second fiducials of the eleventh sacrificial edge;
aligning at least one of the first and second fiducials of the seventh sacrificial edge with at least one of the first second fiducials of the twelfth sacrificial edge; and,
aligning at least one of the first and second fiducials of the ninth sacrificial edge with at least one of the first second fiducials of the twelfth sacrificial edge; and,

bonding the sixth sensor chip to the substrate.

6 . The method of claim 5 further comprising:
removing the fifth, eighth and eleventh sacrificial edges;
forming a seventh sensor chip of the plurality of sensor chips, the seventh sensor chip comprising a thirteenth sacrificial edge and a fourteenth sacrificial edge, each of the thirteenth and fourteenth sacrificial edges comprises a first fiducial and a second fiducial;
performing at least one of the following steps of aligning:
aligning at least one of the first and second fiducials of the tenth sacrificial edge with at least one of the first second fiducials of the thirteenth sacrificial edge;
aligning at least one of the first and second fiducials of the ninth sacrificial edge with at least one of the first second fiducials of the fourteenth sacrificial edge; and,
aligning at least one of the first and second fiducials of the twelfth sacrificial edge with at least one of the first second fiducials of the fourteenth sacrificial edge; and,

bonding the seventh sensor chip to the substrate.

7 . The method of claim 6 further comprising:
forming a eighth sensor chip of the plurality of sensor chips, the eighth sensor chip comprising a fifteenth sacrificial edge comprising a first fiducial and a second fiducial;
performing at least one of the following steps of aligning:
aligning at least one of the first and second fiducials of the second sacrificial edge with at least one of the first second fiducials of the fifteenth sacrificial edge; and,
aligning at least one of the first and second fiducials of the thirteenth sacrificial edge with at least one of the first second fiducials of the fifteenth sacrificial edge; and,

bonding the eighth sensor chip to the substrate.

8 . The method of claim 7 further comprising:
forming a ninth sensor chip of the plurality of sensor chips, the ninth sensor chip comprising a sixteenth sacrificial edge and a seventeenth sacrificial edge, each of the sixteenth and seventeenth sacrificial edges comprises a first fiducial and a second fiducial;
performing at least one of the following steps of aligning:
aligning at least one of the first and second fiducials of the fourth sacrificial edge with at least one of the first second fiducials of the sixteenth sacrificial edge;
aligning at least one of the first and second fiducials of the seventh sacrificial edge with at least one of the first second fiducials of the sixteenth sacrificial edge;
aligning at least one of the first and second fiducials of the fourteenth sacrificial edge with at least one of the first second fiducials of the sixteenth sacrifi

Assignees

• Xerox Corp

Inventors

• Casey Joseph F
• Redding Gary D
• Zufelt Craig Alan
• Monahan Michael B

Classifications

• H10W46/301

  for alignment · CPC title

• H10W46/00

  Marks applied to devices, e.g. for alignment or identification · CPC title

• H01L23/544

  Electricity · mapped topic

• H01L27/14634

  Electricity · mapped topic

• H01L27/1469

  Electricity · mapped topic