Laminate and method of manufacturing laminate

Patent metadata

Field	Value
Publication number	US-2018315680-A1
Application number	US-201615774087-A
Country	US
Kind code	A1
Filing date	Nov 10, 2016
Priority date	Nov 11, 2015
Publication date	Nov 1, 2018
Grant date	—

Abstract

A laminate includes: an insulating substrate; an intermediate layer formed on a surface of the substrate and containing a metal or an alloy as a main component; and a metal film formed of a copper powder having a hydrogen content of 0.002% by mass or less and laminated on the intermediate layer. An interface between the intermediate layer and the metal film is plastically deformed.

First claim

1 - 12 . (canceled)

13 . A laminate comprising:
an insulating substrate; an intermediate layer formed on a surface of the substrate and containing a metal or an alloy as a main component; and a metal film formed of a copper powder having a hydrogen content of 0.002% by mass or less and laminated on the intermediate layer, wherein an interface between the intermediate layer and the metal film is plastically deformed.

14 . The laminate according to claim 13 , wherein the copper powder has an oxygen content of 0.03% by mass or more and 0.15% by mass or less.

15 . The laminate according to claim 13 , wherein the copper powder has a phosphorus content of 0.002% by mass or more and 0.028% by mass or less.

16 . A laminate comprising:
a substrate made of a metal or an alloy; and a metal film formed of a copper powder having a hydrogen content of 0.002% by mass or less and laminated on the substrate, wherein an interface between the substrate and the metal film is plastically deformed.

17 . The laminate according to claim 16 , wherein the copper powder has an oxygen content of 0.03% by mass or more and 0.15% by mass or less.

18 . The laminate according to claim 17 , wherein the copper powder has a phosphorus content of 0.002% by mass or more and 0.028% by mass or less.

19 . A method of manufacturing a laminate, comprising a film formation step of forming a metal film layer on a surface of an insulating substrate having an intermediate layer containing a metal or an alloy as a main component by accelerating a copper powder having a hydrogen content of 0.002% by mass or less together with a gas, and spraying and depositing the copper powder onto a surface of the intermediate layer in a solid phase state.

20 . The method of manufacturing a laminate according to claim 19 , wherein the copper powder has an oxygen content of 0.03% by mass or more and 0.07% by mass or less.

21 . The method of manufacturing a laminate according to claim 19 , comprising a copper powder formation step of forming a copper powder by adding phosphorus or a phosphorus copper base metal to molten copper in an amount of 0.002% by mass or more and 0.028% by mass or less, and atomizing the resulting mixture.

22 . The method of manufacturing a laminate according to claim 21 , wherein the copper powder formation step does not include reduction heat treatment of a copper powder in a hydrogen atmosphere.

23 . The method of manufacturing a laminate according to claim 21 , wherein a copper powder is formed by a water atomizing method in the copper powder formation step.

24 . The method of manufacturing a laminate according to claim 21 , wherein a powderized copper powder is subjected to heat treatment in a vacuum atmosphere in the copper powder formation step.

25 . The method of manufacturing a laminate according to claim 19 , wherein the intermediate layer is formed by brazing a plate-shaped metal or alloy member to the substrate.

26 . A method of manufacturing a laminate, comprising a film formation step of forming a metal film layer on a surface of a substrate made of a metal or an alloy by accelerating a copper powder having a hydrogen content of 0.002% by mass or less together with a gas, and spraying and depositing the copper powder onto a surface of the substrate in a solid phase state.

27 . The method of manufacturing a laminate according to claim 26 , wherein the copper powder has an oxygen content of 0.03% by mass or more and 0.07% by mass or less.

28 . The method of manufacturing a laminate according to claim 26 , comprising a copper powder formation step of forming a copper powder by adding phosphorus or a phosphorus copper base metal to molten copper in an amount of 0.002% by mass or more and 0.028% by mass or less, and atomizing the resulting mixture.

29 . The method of manufacturing a laminate according to claim 28 , wherein the copper powder formation step does not include reduction heat treatment of a copper powder in a hydrogen atmosphere.

30 . The method of manufacturing a laminate according to claim 28 , wherein a copper powder is formed by a water atomizing method in the copper powder formation step.

31 . The method of manufacturing a laminate according to claim 28 , wherein a powderized copper powder is subjected to heat treatment in a vacuum atmosphere in the copper powder formation step.

Assignees

• Nhk Spring Co Ltd

Inventors

• Aikawa Naoya
• Hirano Satoshi
• Yamauchi Yuichiro

Classifications

• B22F2009/0828

  with water · CPC title

• B22F2007/042

  characterised by the layer forming method · CPC title

• B22F2999/00

  Aspects linked to processes or compositions used in powder metallurgy · CPC title

• C23C28/021

  including at least one metal alloy layer · CPC title

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title