Plasma scalpel for selective removal of microbes and microbial biofilms

US2018303538A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018303538-A1
Application numberUS-201815956895-A
CountryUS
Kind codeA1
Filing dateApr 19, 2018
Priority dateApr 20, 2017
Publication dateOct 25, 2018
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The disclosure relates to the medical device field. In particular, the disclosure relates to a dynamically controlled plasma scalpel in combination with an imaging system to selectively remove biofilm while minimizing damage to healthy tissue. Systems and apparatuses according to the disclosure include: (1) dynamically controlled plasma scalpel, (2) biofilm imaging system, (3) computer control system, (4) three-dimensional scalpel positioning stage, and (5) biofilm detritus removal system.

First claim

Opening claim text (preview).

What is claimed is: 1 . A plasma scalpel system comprising: at least one dynamically controlled plasma scalpel; a biofilm imaging system; a computer control system; a three-dimensional scalpel positioning stage; and a biofilm detritus removal system. 2 . The system of claim 1 , wherein the plasma scalpel comprises a discharge formed using at least two insulated electrodes spaced horizontally apart. 3 . The system of claim 1 , further comprising at least one additional dynamically controlled plasma scalpel. 4 . The system of claim 1 , further comprising an array of dynamically controlled plasma scalpels. 5 . The system of claim 1 , wherein the biofilm imaging system comprises: staining a biofilm and/or necrotic tissue; flushing the wound where the biofilm is located to remove excess stain; and illuminating the wound with visible light and a camera or fiber optic system. 6 . The system of claim 1 , wherein the biofilm imaging system comprises scanning laser tomography. 7 . The system of claim 1 , wherein the computer control system applies control features of electrode spacing, DC electrode area, channel diameter, gas ratio, gas flow rate, capacitive discharge power, DC electrode voltage, scalpel to wound distance, relative bias, angle of incidence, three-dimensional positioning stage, multidimensional positioning stage, and/or combinations thereof. 8 . The system of claim 1 , wherein the plasma source is dynamically controlled in real-time with a response time less than 500 milliseconds. 9 . The system of claim 1 , wherein the three-dimensional scalpel positioning stage will position the scalpel from about 0.01 mm to about 20 mm above the biofilm and move the scalpel as needed to debride the wound. 10 . The system of claim 1 , wherein the three-dimensional scalpel positioning stage will position the scalpel at less than 5 mm above the biofilm and move the scalpel as needed to debride the wound. 11 . The system of claim 1 , wherein the three-dimensional scalpel positioning stage rasters the scalpel to remove the biofilm. 12 . The system of claim 1 , wherein the removal system comprises a slightly negative pressure and/or vacuum tube adjacent to the plasma source. 13 . The system of claim 1 , wherein the removal system comprises a flexible chamber with cushions that rest against the body to provide a limited seal around the wound area. 14 . A method of treating wounds comprising: providing the plasma scalpel system according to claim 1 ; and debriding the wound using the plasma scalpel system. 15 . The method of claim 14 , wherein treatment time is less than about 60 minutes. 16 . The method of claim 14 , wherein treatment time is less than about 30 minutes. 17 . A method of selectively removing biofilm comprising: identifying and staining the biofilm; employing the plasma scalpel system according to claim 1 ; and removing the biofilm. 18 . The method according to claim 16 , wherein the treatment time is less than about 60 minutes. 19 . The method according to claim 16 , wherein the treatment time is less than about 30 minutes. 20 . The method according to claim 16 , wherein the biofilm is removed via a slightly negative pressure and/or vacuum tube.

Assignees

Inventors

Classifications

  • using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes · CPC title

  • Skin treatments, e.g. disinfection or wound treatment · CPC title

  • using an arc (H05H1/26 takes precedence) · CPC title

  • Plasma, i.e. ionised gases · CPC title

  • Details, e.g. electrodes, nozzles · CPC title

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What does patent US2018303538A1 cover?
The disclosure relates to the medical device field. In particular, the disclosure relates to a dynamically controlled plasma scalpel in combination with an imaging system to selectively remove biofilm while minimizing damage to healthy tissue. Systems and apparatuses according to the disclosure include: (1) dynamically controlled plasma scalpel, (2) biofilm imaging system, (3) computer control …
Who is the assignee on this patent?
Univ Boise State
What technology area does this patent fall under?
Primary CPC classification A61B18/042. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Thu Oct 25 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).