Surface treated copper foil, laminate using the same, copper foil with carrier, printed wiring board, electronic device, and method for manufacturing printed wiring board

Patent metadata

Field	Value
Publication number	US-2018288867-A1
Application number	US-201815939818-A
Country	US
Kind code	A1
Filing date	Mar 29, 2018
Priority date	Mar 31, 2017
Publication date	Oct 4, 2018
Grant date	—

Abstract

The invention provides a surface treated copper foil with which transmission loss is favorably suppressed even if the surface treated copper foil is used for a high frequency circuit board.
A surface treated copper foil has a surface treated layer formed on at least one surface, the total deposition amount of Co, Ni, and Mo is 1000 μg/dm 2 or less in the surface treated layer, the surface treated layer includes a particle having three or more projections, the number of the particles per μm 2 in the surface treated layer is 0.4 or more, and the surface roughness Rz on a side of the surface treated layer measured by a contact type roughness meter is 1.3 μm or less.

First claim

1 . A surface treated copper foil, comprising:
a copper foil; and a surface treated layer formed on at least one surface of the copper foil, wherein a total deposition amount of Co, Ni, and Mo is 1000 μg/dm 2 or less in the surface treated layer, the surface treated layer includes a particle having three or more projections, a number of the particles per μm 2 in the surface treated layer being 0.4 or more, and the surface treated copper foil satisfies any one or more of items (1-1) to (1-7) below: (1-1) surface roughness Rz on a side of the surface treated layer measured by a contact type roughness meter is 1.3 μm or less; (1-2) surface roughness Rp on the side of the surface treated layer measured by a laser microscope is 1.59 μm or less; (1-3) surface roughness Rv on the side of the surface treated layer measured by a laser microscope is 1.75 μm or less; (1-4) surface roughness Rzjis on the side of the surface treated layer measured by a laser microscope is 3.3 μm or less; (1-5) surface roughness Rc on the side of the surface treated layer measured by a laser microscope is 1.0 μm or less; (1-6) surface roughness Ra on the side of the surface treated layer measured by a laser microscope is 0.4 μm or less; and (1-7) surface roughness Rq on the side of the surface treated layer measured by a laser microscope is 0.5 μm or less.

2 . The surface treated copper foil according to claim 1 ,
wherein the surface treated copper foil satisfies any one or more of items (2-1) to (2-7) below: (2-1) surface roughness Rz on the side of the surface treated layer measured by a contact type roughness meter is 0.89 μm or more; (2-2) surface roughness Rp on the side of the surface treated layer measured by a laser microscope is 0.80 μm or more; (2-3) surface roughness Rv on the side of the surface treated layer measured by a laser microscope is 0.98 μm or more; (2-4) surface roughness Rzjis on the side of the surface treated layer measured by a laser microscope is 1.70 μm or more; (2-5) surface roughness Rc on the side of the surface treated layer measured by a laser microscope is 0.60 μm or more; (2-6) surface roughness Ra on the side of the surface treated layer measured by a laser microscope is 0.21 μm or more; and (2-7) surface roughness Rq on the side of the surface treated layer measured by a laser microscope is 0.30 μm or more.

3 . The surface treated copper foil according to claim 2 ,
wherein the surface treated layer includes a particle having three or more projections, a number of the particles per μm 2 in the surface treated layer being 0.7 or more.

4 . The surface treated copper foil according to claim 3 ,
wherein the surface treated layer includes a particle having three or more projections, the number of the particles per μm 2 in the surface treated layer being 1.0 or more.

5 . The surface treated copper foil according to claim 1 ,
wherein the total deposition amount of Co, Ni, and Mo is 800 μg/dm 2 or less in the surface treated layer.

6 . The surface treated copper foil according to claim 1 ,
wherein the total deposition amount of Co, Ni, and Mo is 600 μg/dm 2 or less in the surface treated layer.

7 . The surface treated copper foil according to claim 2 ,
wherein the total deposition amount of Co, Ni, and Mo is 600 μg/dm 2 or less in the surface treated layer.

8 . The surface treated copper foil according to claim 4 ,
wherein the total deposition amount of Co, Ni, and Mo is 600 μg/dm 2 or less in the surface treated layer.

9 . The surface treated copper foil according to claim 1 ,
wherein a deposition amount of Co is 400 μg/dm 2 or less in the surface treated layer.

10 . The surface treated copper foil according to claim 9 ,
wherein the deposition amount of Co is 320 μg/dm 2 or less in the surface treated layer.

11 . The surface treated copper foil according to claim 10 ,
wherein the deposition amount of Co is 240 μg/dm 2 or less in the surface treated layer.

12 . The surface treated copper foil according to claim 1 ,
wherein a deposition amount of Ni is 600 μg/dm 2 or less in the surface treated layer.

13 . The surface treated copper foil according to claim 12 ,
wherein the deposition amount of Ni is 480 μg/dm 2 or less in the surface treated layer.

14 . The surface treated copper foil according to claim 13 ,
wherein the deposition amount of Ni is 360 μg/dm 2 or less in the surface treated layer.

15 . The surface treated copper foil according to claim 1 ,
wherein a deposition amount of Mo is 600 μg/dm 2 or less in the surface treated layer.

16 . The surface treated copper foil according to claim 15 ,
wherein the deposition amount of Mo is 480 μg/dm 2 or less in the surface treated layer.

17 . The surface treated copper foil according to claim 16 ,
wherein the deposition amount of Mo is 360 μg/dm 2 or less in the surface treated layer.

18 . The surface treated copper foil according to claim 1 ,
wherein the surface treated layer includes a roughened layer.

19 . The surface treated copper foil according to claim 1 ,
wherein a resin layer is provided on the surface treated layer.

20 . A method of use of a surface treated copper foil, comprising using the surface treated copper foil according to claim 1 for a circuit of a high frequency circuit board used under a condition that a signal frequency is 1 GHz or higher.

21 . A carrier-attached copper foil, comprising
a carrier; an intermediate layer; and an ultra-thin copper layer, wherein the ultra-thin copper layer is the surface treated copper foil according to claim 1 .

22 . A laminate, comprising:
a resin substrate; and any one of (22-1) and (22-2) below: (22-1) the surface treated copper foil according to claims 1 ; and (22-2) a carrier-attached copper foil having a carrier, an intermediate layer, and an ultra-thin copper layer, the ultra-thin copper layer being the surface treated copper foil according to claim 1 .

23 . A method for manufacturing a printed wiring board comprising
using any one of (23-1) and (23-2) below; (23-1) the surface treated copper foil according to claims 1 ; and (22-2) a carrier-attached copper foil having a carrier, an intermediate layer, and an ultra-thin copper layer, the ultra-thin copper layer being the surface treated copper foil according to claim 1 .

24 . A method for manufacturing an electronic device comprising using a printed wiring board manufactured by the method according to claim 23 .

25 . A method for manufacturing a printed wiring board, comprising:
preparing the carrier-attached copper foil according to claim 21 and an insulating substrate; laminating the carrier-attached copper foil and the insulating substrate; forming a copper-clad laminate by removing a carrier of the carrier-attached copper foil after the laminating the carrier-attached copper foil and the insulating substrate; and forming a circuit by means of any one selected from a semi-additive method, a subtractive method, a partly-additive method, and a modified semi-additive method.

26 . A method for manufacturing a printed wiring board, comprising:
forming a circuit on a surface on the ultra-thin copper layer side or a surface on the carrier side of the carrier-attached copper foil according to claim 21 ; forming a resin layer on the surface on the ultra-thin copper layer side or the sur

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Fukuchi Ryo

Classifications

• B32B17/02

  in the form of fibres or filaments · CPC title

• B32B17/04

  bonded with or embedded in a plastic substance · CPC title

• C25D3/12

  of nickel or cobalt · CPC title

• B32B27/42

  comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines · CPC title

• H05K2201/0355

  Metal foils · CPC title