Electrical contact member and inspection connection device
US-2015301081-A1 · Oct 22, 2015 · US
US2018237293A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2018237293-A1 |
| Application number | US-201715687618-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 28, 2017 |
| Priority date | Feb 21, 2017 |
| Publication date | Aug 23, 2018 |
| Grant date | — |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A probe card fits in a system for testing a micro-electro-mechanical device having an element sensitive to a magnetic field. The probe card is formed by a PCB having a through-opening and probe tips for electrically contacting the micro-electro-mechanical device. A housing structure is received within the through-opening. The housing structure includes a planar peripheral region surrounding seats that protrude and extend at least partly into the through-opening. Magnetic elements are arranged in the seats, with the magnetic elements configured to generate a test magnetic field for testing operation of the micro-electro-mechanical device.
Opening claim text (preview).
1 . A probe card for use in a system for testing a magnetically-actuable device, comprising: an integrated circuit board having a first through-opening at probe tips of said probe card; a housing structure including a planar region which surrounds at least one seat protruding from the planar region and extending at least partly through the first through-opening; and a magnetic element arranged in each seat of the housing structure, the included magnetic elements configured to generate a test magnetic field for magnetically actuating the magnetically-actuable device during a test phase of the magnetically-actuable device. 2 . The probe card according to claim 1 , wherein said at least one seat comprises at least three seats, wherein the at least three seats extend one next to each other, and wherein each seat houses a respective magnetic element, the included magnetic elements being mutually arranged so as to generate a magnetic field having a first intensity in a direction of the magnetically-actuable device and a second intensity, lower than the first intensity, in an opposite direction. 3 . The probe card according to claim 2 , wherein said included magnetic elements are mutually arranged to form a Halbach array. 4 . The probe card according to claim 1 , further comprising a cover of ferromagnetic material arranged on the at least one seat and on the magnetic element within said at least one seat. 5 . The probe card according to claim 1 , further comprising: a cover of non-magnetic material arranged on said at least one seat and on the magnetic element within said at least one seat; and a shielding layer, of μ-metal, extending above the cover. 6 . The probe card according to claim 1 , further comprising: a support structure exhibiting a second through-opening and side walls surrounding at least in part said second through-opening, the side walls being provided with respective first guides; and a first slide configured to slide in said first guides, wherein said one or more seats extend through the second through-opening. 7 . The probe card according to claim 6 , wherein the support structure has a bottom side surrounded by the side walls, and wherein the planar region of the housing structure is extended between the bottom side and the first slide, the second through-opening being extended through the bottom side. 8 . The probe card according to claim 6 , wherein said first guides are formed by respective recesses in the side walls, said first slide having tapered peripheral regions configured to slide in said recesses. 9 . The probe card according to claim 1 , wherein the housing structure includes: second guides which protrude from said planar region in a direction opposite to the direction in which said at least one seat extends; and a second slide configured to slide in said second guides so as to cover and, alternatively, uncover said at least one seat. 10 . The probe card according to claim 9 , wherein said at least one seat comprises at least nine seats mutually arranged one next to another to form a 3×3 matrix structure, said second slide being molded in such a way as to cover, during the closure operation, each of said at least nine seats one at a time. 11 . The probe card according to claim 1 , wherein said magnetically-actuable device includes a magnetically-actuable suspended structure that is movable about a first and a second axis of rotation, and wherein the at least one seat is a plurality of seats, said magnetically-actuable device, said integrated circuit board and said housing structure being mutually arranged in such a way that the test magnetic field is oriented at around 45° with respect to the first and second axes of rotation of the suspended structure of the magnetically-actuable device. 12 . A test system, comprising: a chuck configured to support a wafer of semiconductor material including a magnetically-actuable device, a probe card; a wafer prober mechanically coupled to the probe card, configured to move the chuck in order to electrically couple selective portions of said magnetically-actuable device with respective probe tips of the probe card; and a data processing circuit electrically coupled to the probe card, configured to feed electrical test signals to the magnetically-actuable device by means of the probe card and to process response signals received, via the probe card, from the device during the magnetic actuation of the magnetically-actuable device; wherein the probe card comprises: an integrated circuit board having a first through-opening at probe tips of said probe card; a housing structure, including a planar region which surrounds at least one seat protruding from the planar region and extending at least partly through the first through-opening; and a magnetic elements included within each seat, the included magnetic elements configured to generate a test magnetic field for magnetically actuating the magnetically-actuable device during a test phase of the magnetically-actuable device. 13 . The test system according to claim 12 , wherein the probe card is spatially arranged between the wafer and the data processing circuit. 14 . A probe card for use in a system for testing a magnetically-actuable device, comprising: an integrated circuit board having a through-opening extending between a first surface and a second surface; probe tips extending from a first surface of the integrated circuit board and configured to make electrical connection with pads of the magnetically-actuable device; a housing structure including a portion inserted the through-opening from the second surface, said portion of the housing structure including a plurality of seats; and a plurality of magnetic elements, each magnetic element arranged in a respective seat of the housing structure, the plurality of magnetic elements oriented in said seats to generate a magnetic field having a first intensity in a direction of the magnetically-actuable device and a second intensity, lower than the first intensity, in an opposite direction, said magnetic field configured to magnetically actuate the magnetically-actuable device during a test phase of the magnetically-actuable device. 15 . The probe card according to claim 14 , wherein said plurality of magnetic elements are mutually arranged to form a Halbach array.
Testing of reflective surfaces, e.g. mirrors · CPC title
Interfaces, e.g. between probe and tester (G01R31/31905 and G01R1/07364 take precedence) · CPC title
Measuring probes · CPC title
Test apparatus · CPC title
Features relating to contacting the IC under test, e.g. probe heads; chucks (G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06) · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.