Capacitor component and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2018233286-A1
Application number	US-201715696765-A
Country	US
Kind code	A1
Filing date	Sep 6, 2017
Priority date	Feb 15, 2017
Publication date	Aug 16, 2018
Grant date	—

Abstract

A capacitor component includes a body including a structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween, reinforcing layers formed on surfaces of the body to which the internal electrodes are exposed to thus cover portions of the internal electrodes, and external electrodes connected to the internal electrodes while covering the internal electrodes and the reinforcing layers.

First claim

What is claimed is:

1 . A capacitor component comprising:
a body including a stacked plurality of dielectric layers and a stacked plurality of internal electrodes with respective dielectric layers interposed therebetween; reinforcing layers on surfaces of the body on which the internal electrodes are exposed, and thereby the reinforcing layers covering portions of the internal electrodes; and external electrodes connected to the internal electrodes and covering the internal electrodes and the reinforcing layers.

2 . The capacitor component of claim 1 , wherein a pair of reinforcing layers are on each surface of the body on which the internal electrodes are exposed.

3 . The capacitor component of claim 2 , wherein the pair of reinforcing layers are on edges of the surfaces of the body and the pair of reinforcing layers are spaced apart from each other.

4 . The capacitor component of claim 2 , wherein the pair of reinforcing layers covers distal ends of the internal electrodes.

5 . The capacitor component of claim 4 , wherein at least one reinforcing layer of the pair of reinforcing layers includes a portion having a width different from rest of the at least one reinforcing layer.

6 . The capacitor component of claim 5 , wherein a width of a central portion of the at least one reinforcing layer is smaller than rest of the at least one reinforcing layer.

7 . The capacitor component of claim 5 , wherein each reinforcing layer of the pair of reinforcing layers has an inner edge that is curved.

8 . The capacitor component of claim 1 , wherein the reinforcing layers cover portions of the internal electrodes and expose remaining portions of the internal electrodes.

9 . The capacitor component of claim 8 , wherein the external electrodes are connected to the internal electrodes via the exposed portions thereof.

10 . The capacitor component of claim 1 , wherein the reinforcing layer includes an electrical insulating material.

11 . The capacitor component of claim 10 , wherein the reinforcing layer and the dielectric layer include a same material.

12 . The capacitor component of claim 11 , wherein the reinforcing layer and the dielectric layer include a sintered ceramic.

13 . The capacitor component of claim 1 , wherein at least one external electrode has a multilayer structure.

14 . The capacitor component of claim 13 , wherein the at least one external electrode includes a first layer that is a sintered electrode and a second layer that covers the first layer and is a plating electrode.

15 . A method of manufacturing a capacitor component, comprising:
forming a body by alternately stacking a plurality of dielectric layers and internal electrodes; forming reinforcing layers on surfaces of the body from which the internal electrodes are exposed, and thereby covering portions of the internal electrodes; and forming external electrodes connected to the internal electrodes and covering the reinforcing layers.

16 . The method of claim 15 , wherein the forming the reinforcing layers includes transferring the reinforcing layer to the body.

17 . The method of claim 15 , further comprising co-sintering the body and the reinforcing layers.

Assignees

• Samsung Electro Mech

Inventors

• Yu Il Hwan
• Hong Ki Pyo
• Lee Jong Ho

Classifications

• H01G4/236

  leading through the housing, i.e. lead-through · CPC title

• H01G9/048

  characterised by their structure (H01G11/22 takes precedence) · CPC title

• H01G9/07

  Dielectric layers · CPC title

• H05K2201/09763

  Printed component having superposed conductors, but integrated in one circuit layer · CPC title

• H01G4/232 Primary

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title