Pattern forming method, electron beam- or extreme ultraviolet-sensitive resin composition, resist film using the same, method of manufacturing electronic device, and electronic device
US-2015370170-A1 · Dec 24, 2015 · US
US2018186907A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2018186907-A1 |
| Application number | US-201715849690-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 21, 2017 |
| Priority date | Jun 23, 2015 |
| Publication date | Jul 5, 2018 |
| Grant date | — |
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Provided is a pattern forming method including the successive steps of: a resist film forming step of forming a resist film using an actinic ray-sensitive or radiation-sensitive composition; an exposure step of exposing the resist film; a step of developing the exposed resist film using a developer, and a step of rinsing the developed resist film using a rinsing liquid containing an organic solvent. The developer includes a ketone-based or ether-based solvent having a branched alkyl group. The organic solvent contained in the rinsing liquid includes an ether-based solvent having a branched alkyl group.
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What is claimed is: 1 . A pattern forming method comprising the successive steps of: a resist film forming step of forming a resist film using an actinic ray-sensitive or radiation-sensitive composition, an exposure step of exposing the resist film, a step of developing the exposed resist film using a developer, and a step of rinsing the developed resist film using a rinsing liquid containing an organic solvent, wherein the developer includes a ketone-based or ether-based solvent having a branched alkyl group, and the organic solvent contained in the rinsing liquid includes an ether-based solvent having a branched alkyl group. 2 . The pattern forming method according to claim 1 , wherein the ketone-based or ether-based solvent having a branched alkyl group included in the developer has 6 or more carbon atoms and 1 heteroatom. 3 . The pattern forming method according to claim 1 , wherein the actinic ray-sensitive or radiation-sensitive composition contains a resin containing a repeating unit represented by General Formula (1): in General Formula (1), A represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, or a cyano group, R represents a halogen atom, an alkyl group, a cycloalkyl group, an aryl group, an alkenyl group, an aralkyl group, an alkoxy group, an alkylcarbonyloxy group, an alkylsulfonyloxy group, an alkyloxycarbonyl group, or an aryloxycarbonyl group; in the case where there are a plurality of R′s, they may be the same or different; and in the case of having a plurality of R's, they may form a ring in cooperation with each other, a represents an integer of 1 to 3, and b represents an integer of 0 to (3-a). 4 . The pattern forming method according to claim 1 , wherein the exposure is carried out using electron beams or extreme ultraviolet rays. 5 . An electronic device manufacturing method, comprising: the pattern forming method according to claim 1 .
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