Developer, pattern forming method, and electronic device manufacturing method

US2018186907A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018186907-A1
Application numberUS-201715849690-A
CountryUS
Kind codeA1
Filing dateDec 21, 2017
Priority dateJun 23, 2015
Publication dateJul 5, 2018
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided is a pattern forming method including the successive steps of: a resist film forming step of forming a resist film using an actinic ray-sensitive or radiation-sensitive composition; an exposure step of exposing the resist film; a step of developing the exposed resist film using a developer, and a step of rinsing the developed resist film using a rinsing liquid containing an organic solvent. The developer includes a ketone-based or ether-based solvent having a branched alkyl group. The organic solvent contained in the rinsing liquid includes an ether-based solvent having a branched alkyl group.

First claim

Opening claim text (preview).

What is claimed is: 1 . A pattern forming method comprising the successive steps of: a resist film forming step of forming a resist film using an actinic ray-sensitive or radiation-sensitive composition, an exposure step of exposing the resist film, a step of developing the exposed resist film using a developer, and a step of rinsing the developed resist film using a rinsing liquid containing an organic solvent, wherein the developer includes a ketone-based or ether-based solvent having a branched alkyl group, and the organic solvent contained in the rinsing liquid includes an ether-based solvent having a branched alkyl group. 2 . The pattern forming method according to claim 1 , wherein the ketone-based or ether-based solvent having a branched alkyl group included in the developer has 6 or more carbon atoms and 1 heteroatom. 3 . The pattern forming method according to claim 1 , wherein the actinic ray-sensitive or radiation-sensitive composition contains a resin containing a repeating unit represented by General Formula (1): in General Formula (1), A represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, or a cyano group, R represents a halogen atom, an alkyl group, a cycloalkyl group, an aryl group, an alkenyl group, an aralkyl group, an alkoxy group, an alkylcarbonyloxy group, an alkylsulfonyloxy group, an alkyloxycarbonyl group, or an aryloxycarbonyl group; in the case where there are a plurality of R′s, they may be the same or different; and in the case of having a plurality of R's, they may form a ring in cooperation with each other, a represents an integer of 1 to 3, and b represents an integer of 0 to (3-a). 4 . The pattern forming method according to claim 1 , wherein the exposure is carried out using electron beams or extreme ultraviolet rays. 5 . An electronic device manufacturing method, comprising: the pattern forming method according to claim 1 .

Assignees

Inventors

Classifications

  • Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography · CPC title

  • Oxygen · CPC title

  • containing two or more rings · CPC title

  • C08F212/24Primary

    Phenols or alcohols · CPC title

  • Oxygen · CPC title

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What does patent US2018186907A1 cover?
Provided is a pattern forming method including the successive steps of: a resist film forming step of forming a resist film using an actinic ray-sensitive or radiation-sensitive composition; an exposure step of exposing the resist film; a step of developing the exposed resist film using a developer, and a step of rinsing the developed resist film using a rinsing liquid containing an organic sol…
Who is the assignee on this patent?
Fujifilm Corp
What technology area does this patent fall under?
Primary CPC classification C08F212/24. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Jul 05 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).