Surface-mount inductor

Patent metadata

Field	Value
Publication number	US-2018174740-A1
Application number	US-201715845143-A
Country	US
Kind code	A1
Filing date	Dec 18, 2017
Priority date	Dec 21, 2016
Publication date	Jun 21, 2018
Grant date	—

Abstract

A surface-mount inductor includes a coil formed by winding a conductive wire, and a molded body made of a sealing material containing a metal magnetic material and a resin with the coil incorporated therein. The coil includes a winding part and a lead-out part with an end portion of the lead-out part disposed inside the molded body. The molded body has an external electrode disposed on a mounting surface. The surface-mount inductor includes a conductor connecting the external electrode and the lead-out part. The conductor is at least partially buried in the molded body.

First claim

What is claimed is:

1 . A surface-mount inductor comprising:
a coil, formed by winding a conductive wire, and including a winding part and a lead-out part with an end portion; a molded body made of a sealing material containing a metal magnetic material and a resin with the coil incorporated therein, the molded body having an external electrode disposed on a mounting surface, and the end portion of the lead-out part of the coil being disposed inside the molded body; and a conductor, at least partially buried in the molded body, and connecting the external electrode and the lead-out part.

2 . The surface-mount inductor according to claim 1 , wherein the conductor is entirely buried in the molded body.

3 . The surface-mount inductor according to claim 1 , wherein the conductor has a surface partially exposed from the molded body.

4 . The surface-mount inductor according to claim 1 , wherein the lead-out part has a connecting portion thinner than the conductive wire, and the connecting portion is connected to the conductor.

5 . The surface-mount inductor according to claim 2 , wherein the lead-out part has a connecting portion thinner than the conductive wire, and the connecting portion is connected to the conductor.

6 . The surface-mount inductor according to claim 3 , wherein the lead-out part has a connecting portion thinner than the conductive wire, and the connecting portion is connected to the conductor.

7 . The surface-mount inductor according to claim 1 , wherein a winding axis of the coil is orthogonal to the mounting surface.

8 . The surface-mount inductor according to claim 2 , wherein a winding axis of the coil is orthogonal to the mounting surface.

9 . The surface-mount inductor according to claim 3 , wherein a winding axis of the coil is orthogonal to the mounting surface.

10 . The surface-mount inductor according to claim 4 , wherein a winding axis of the coil is orthogonal to the mounting surface.

11 . The surface-mount inductor according to claim 5 , wherein a winding axis of the coil is orthogonal to the mounting surface.

12 . The surface-mount inductor according to claim 6 , wherein a winding axis of the coil is orthogonal to the mounting surface.

13 . The surface-mount inductor according to claim 1 , wherein the molded body defines a hole therein, and at least a portion of the conductor is disposed in the hole.

14 . The surface-mount inductor according to claim 13 , wherein the hole extends orthogonal to the mounting surface.

15 . The surface-mount inductor according to claim 13 , wherein the hole traverses the lead-out part.

16 . The surface-mount inductor according to claim 13 , wherein the hole extends from the mounting surface to a hole end inside the molded body, and the lead-out part is exposed to the hole at a location between the mounting surface and the hole end.

17 . The surface-mount inductor according to claim 13 , wherein the hole extends from the mounting surface to a hole end inside the molded body, and the lead-out part is exposed to the hole at the hole end.

18 . The surface-mount inductor according to claim 1 , wherein the molded body defines a groove therein extending along the mounting surface, and at least a portion of the conductor is disposed in the groove.

19 . The surface-mount inductor according to claim 18 , wherein the lead-out part is exposed to the groove.

20 . The surface-mount inductor according to claim 1 , wherein the conductor is disposed directly under the external electrode.

Assignees

• Murata Manufacturing Co

Inventors

• Muneuchi Keita

Classifications

• H01F27/327

  Encapsulating or impregnating (encapsulating coil and core H01F27/022) · CPC title

• H01F27/2828

  Construction of conductive connections, of leads · CPC title

• H01F27/306

  Fastening or mounting coils or windings on core, casing or other support · CPC title

• H01F27/292 Primary

  Surface mounted devices · CPC title

• H01F27/24

  Magnetic cores · CPC title