Nanowire and microwire fabrication technique and product

Patent metadata

Field	Value
Publication number	US-2018155844-A1
Application number	US-201815872913-A
Country	US
Kind code	A1
Filing date	Jan 16, 2018
Priority date	Jul 24, 2012
Publication date	Jun 7, 2018
Grant date	—

Abstract

A continuous or semi-continuous process for fabricating nanowires or microwires makes use of the substantially planar template that may be moved through electrochemical solution to grow nanowires or microwires on exposed conductive edges on the surface of that template. The planar template allows fabrication of the template using standard equipment and techniques. Adhesive transfer may be used to remove the wires from the template and in one embodiment to draw a continuous wire from the template to be wound around the drum.

First claim

1 .- 13 . (canceled)

14 . A method of fabricating wire comprising the steps of:
moving a template through a chamber of electrochemical solution; interacting an electrically conductive edge of the template with the electrochemical solution; applying an electrical power source between the electrochemical solution in the chamber and the electrically conductive edge of the structure; forming a wire on the electrically conductive edge interacting with the electrochemical solution; and removing the formed wires with a transfer element.

15 . The method of claim 14 wherein the electrically conductive edge defines at least one substantially continuous circle on the planar template centered about an axis and wherein a first portion of the electrically conductive edge interacts with the electrochemical solution while a second portion of electrically conductive edge does not interact with the electrochemical solution such that the removal of the formed wire with the transfer element is from the second portion to by transfer to a spool.

16 . The method of claim 15 wherein the template is mounted for rotation about a first axis perpendicular to the surface of the template and further including a disk having an edge contacting the surface of the template and following an annular track on the surface of the template concentric about the first axis on the template with mutual rotation of the transfer element and template, and wherein the spool is a drum and wherein the step of transferring the wire formed on the electrically conductive edge, first transfers the continuous wire from the template to the disk and second transfers the continuous wire from the disk to the drum to spool wire received from the transfer element in a helical coil along a surface of the drum.

17 . The method of claim 16 wherein the disk and the drum are coated with adhesive and wherein the adhesive on the drum has a greater adhesion to the wire than the adhesive on the disk.

18 . The method of claim 17 including the step of passing the disk through a releasing liquid with rotation of the disk about the second axis.

19 . The method of claim 14 wherein the transfer element is a flexible tape having an adhesive surface and pressed against a surface of the template by a guide to follow an annular track on the surface of the template concentric about an axis of rotation of the template with rotation of the template.

20 . The method of claim 14 further including the step of using an electronic computer executing a stored program to control a parameter selected from the group consisting of:
(a) a rate of rotation of the template through the electrochemical solution;
(b) an applied voltage across the electrodes; and
(c) the composition of the electrochemical solution.

21 . A template for growing nanowires or microwires comprising:
an insulating layer providing a substrate; a pattern of conductor positioned over the insulating layer providing edges at desired locations of wires; and a second insulating layer covering the pattern of conductor except at the edges and without overhang of the edges of the conductor by the insulating layer along a direction normal to a surface of the substrate at the edges; and wherein the insulating layers and conductor are selected to permit physical detachment of wires grown thereon by cohesive forces without substantial damage to the insulating layers and conductor; wherein the edges of the pattern conductor form an obtuse angle with respect to a surface of the substrate.

22 . A method of fabricating wire comprising the steps of:
moving a template through a chamber of electrochemical solution, the substantially planar template having a surface and a conductive layer with an electrically conductive ultranano crystalline diamond edge formed in a predefined pattern, the template mounted for rotation about a first axis perpendicular to the surface; immersing at least a portion of the electrically conductive edge of the template in the electrochemical solution; applying an electrical power source between the electrochemical solution in the chamber and the electrically conductive edge of the structure; forming a wire on the electrically conductive edge interacting with the electrochemical solution; and removing the formed wires with a transfer element.

23 . The method of claim 22 , wherein the template is substantially planar.

24 . The method of claim 22 , wherein removing the formed wires comprises,
interacting a chamfered edge of the transfer element with the surface; parallel to the surface, the chamfered edge having an adhesive surface and mounted for movement with respect to the template and contact with the template; and removing from the template at least a portion of the wire grown by electrochemical action on the structure of the template.

25 . The method of claim 23 , wherein the chamfered edge and the surface are parallel when interacted

26 . The method of claim 22 , further comprising rotating the transfer element about a second axis angled with respect to the first axis, wherein the chamfered edge contacts the surface of the template and following an annular track on the surface of the template concentric about the first axis on the template with mutual rotation of the transfer element and template.

27 . The method of claim 26 , further comprising rotating a drum about a third axis and contacting a drum adhesive surface and the chamfered edge to pull wires off of the transfer element with rotating contact between the drum and transfer element.

28 . The method of claim 27 , further comprising spooling a wire received from the transfer element into a helical coil along a surface of the drum.

29 . The method of claim 28 , further comprising immersing at least a portion of the transfer element chamfered edge in a second chamber having a releasing liquid.

Assignees

• Uchicago Argonne Llc

Inventors

• Sumant Anirudha V
• Zach Michael
• Marten Alan David

Classifications

• C25D1/04 Primary

  Wires; Strips; Foils · CPC title

• C25D1/10 Primary

  Moulds; Masks; Masterforms · CPC title

• C25D1/006

  Nanostructures, e.g. using aluminium anodic oxidation templates [AAO] · CPC title

• C25D1/00

  Electroforming · CPC title