Electrostatic Coating of Metal Thin Layers with Adjustable Film Properties

Patent metadata

Field	Value
Publication number	US-2018135184-A1
Application number	US-201715814260-A
Country	US
Kind code	A1
Filing date	Nov 15, 2017
Priority date	Nov 16, 2016
Publication date	May 17, 2018
Grant date	—

Abstract

Methods for forming thin, pinhole-free conformal metal layers on both conducting and non-conducting surfaces, where the morphology and properties of the metal layers are tuned to meet desired parameters by adjusting the concentration of ionic liquids during the deposition process. The formed metal films contain tunable properties for solar and electronic use and provide specific advantages for non-conducting surfaces, which are otherwise unsuitable for electroplating without the presence of the formed metal films. The disclosed methods do not require the presence of a voltage or external electric field but form the metal films through an electroless technique using electrostatic interactions between negatively charged nanoparticles. In addition, the disclosed methods are compatible with solution phase processing and eliminate the need to transfer the surfaces into a vacuum chamber for a chemical or physical vapor deposition to form a metal layer.

First claim

We claim:

1 . A method of forming a conformal metal layer on a surface of a substrate, the method comprising steps of:
contacting said surface with a nonaqueous solution; wherein said surface has a net positive charge; and wherein said nonaqueous solution comprises a nonaqueous polar solvent, a metal particle precursor and an ionic liquid; generating a plurality of metal nanoparticles in said nonaqueous solution in contact with said surface, wherein said metal nanoparticles have cross sectional dimensions less than 30 nm and are at least partially coated with a negatively charged outer layer comprising said ionic liquid or a reaction product thereof; and depositing said metal nanoparticles onto said surface, thereby forming said conformal metal layer, wherein said ionic liquid has a concentration in said nonaqueous solution between 0 mM and 5.0 mM.

2 . The method of claim 1 , wherein said ionic liquid has a concentration in said nonaqueous solution between 0.5 mM and 4.5 mM.

3 . The method of claim 1 , wherein said ionic liquid has a concentration in said nonaqueous solution between 2.0 mM and 2.5 mM.

4 . The method of claim 1 , wherein the conformal metal layer has a thickness between about 20 nm to 500 nm.

5 . The method of claim 1 , wherein the conformal metal layer has an electrical conductivity between 0.5 S/m*10 7 and 3.0 S/m*10 7 .

6 . The method of claim 1 , wherein the conformal metal layer has an electrical conductivity between 1.0 S/m*10 7 and 2.8 S/m*10 7 .

7 . The method of claim 1 , wherein the conformal metal layer has a light absorbance of 0.16 AU or greater for wavelengths from 400 nm to 800 nm.

8 . The method of claim 1 , wherein the conformal metal layer has a light absorbance of 0.12 AU or less for wavelengths from 500 nm to 800 nm.

9 . The method of claim 1 , wherein said ionic liquid comprises one or more of: 1-butyl-3-methylimidazolium tetrafluoroborate ([bmim][BF 4 ]), 1-butyl-3-methylimidazolium bromide ([bmim][Br]), 1-butyl-3-methylimidazolium chloride ([bmim][Cl]), 1-butyl-3-methylimidazolium hexafluorophosphate ([bmim][PF 6 ]), 1-ethyl-3-methylimidazolium tetrafluoroborate ([emim][BF 4 ]), 1-ethyl-3-methylimidazolium nitrate ([emim][NO 3 ]), 1-ethyl-3-methylimidazolium perchlorate ([emim][ClO 4 ]), 1-ethyl-3-methylimidazolium triflate ([emim][CF 3 SO 3 ]), 1-ethyl-3-methylimidazolium hexafluorophosphate ([emim][PF 6 ]), 1-(2-hydroxyethyl)-3-methylimidazolium tetrafluoroborate ([hydemim][BF 4 ]), 1-butylpyridinium chloride ([bpy][Cl]) and 1-butyl-3-methypyridinuim tetrafluoroborate ([bmpy][BF 4 ]).

10 . The method of claim 1 , wherein said ionic liquid comprises a cation and an anion;
wherein said cation is selected from the group consisting of 1-butyl-3-methylimidazolium ([bmim]), 1-ethyl-3-methylimidazolium ([emim]), 1-(2-hydroxyethyl)-3-methylimidazolium ([hydemim]), 1-butylpyridinium ([bpy]), 1-butyl-3-methypyridinuim ([bmpy]) and any combination of these; and wherein said anion is selected from the group consisting of tetrafluoroborate, bromide, chloride, hexafluorophosphate, nitrate, perchlorate, triflate and any combination of these.

11 . The method of claim 1 , wherein said metal particle precursor comprises metal ions or a source of metal ions.

12 . The method of claim 11 , wherein said metal ions are selected from the group consisting of copper ions, Cu 2+ ions, nickel ions, Ni 2+ ions, aluminum ions, Al 3+ ions, cobalt ions, Co 2+ ions, Au ions, Pt ions, Pd ions, Ru ions, Fe ions, Ti ions, Fe—Pt ions, Ir ions, Os ions, Re ions, W ions, Ta ions, Hf ions, and aggregates and clusters of these and any combination of these.

13 . The method of claim 11 , wherein said source of metal ions is dissolution of a metal salt in said nonaqueous polar solvent, wherein said metal salt is selected from the group consisting of CuCl 2 , CuBr 2 , NiCl 2 , NiBr 2 , AlCl 3 , AlBr 3 , CoCl 2 , CoBr 2 , PtCl 2 , PdCl 2 , RuCl 2 , FeCl 2 , and IrCl 2 and any combination of these.

14 . The method of claim 1 , wherein said metal nanoparticles are generated in situ within said nonaqueous solution.

15 . The method of claim 1 , wherein said step of depositing said metal nanoparticles is carried out in an absence of an applied electric field or an applied voltage.

16 . The method of claim 1 , wherein said nonaqueous solution is substantially free of dissolved oxygen.

17 . The method of claim 1 wherein said substrate comprises one or more materials selected from the group consisting of SiO 2 , silicon, glass, paper, ceramic, polymer, plastic, metal, metal oxide, dielectric, semiconductor, and biopolymers.

18 . The method of claim 1 , wherein said surface comprises a component of an integrated circuit or electronic device.

19 . The method of claim 1 , wherein said step of providing said substrate comprises functionalizing said surface so as to generate said surface having said net positive charge.

20 . The method of claim 1 , further comprising a step of stopping said step of depositing said metal nanoparticles onto said surface after formation of a conformal metal layer having a preselected thickness; wherein said stopping step comprises one or more of: decreasing a concentration of said ionic liquid in said nonaqueous solution; flushing said nonaqueous solution with a solvent; or removing said surface from said nonaqueous solution.

21 . The method of claim 1 , further comprising a step of sintering or annealing said conformal metal layer, thereby fusing at least a portion of said deposited metal nanoparticles.

22 . A method of tuning one or more optical properties or electrical properties of a conformal metal layer formed on a surface of a substrate, the method comprising steps of:
contacting said surface with a nonaqueous solution; wherein said surface has a net positive charge; and wherein said nonaqueous solution comprises a nonaqueous polar solvent, a metal particle precursor and an ionic liquid; generating a plurality of metal nanoparticles in said nonaqueous solution in contact with said surface, wherein said metal nanoparticles are at least partially coated with a negatively charged outer layer comprising said ionic liquid or a reaction product thereof; and depositing said metal nanoparticles onto said surface, thereby forming said conformal metal layer, wherein the one or more optical properties or electrical properties of the conformal metal layer are tuned to a desired level by adjusting the concentration of the ionic liquid in the nonaqueous solution during the generating step, deposition step, or both, to an ionic liquid concentration corresponding to the desired one or more optical properties or electrical properties.

23 . A device for forming a conformal nanoparticle metal layer on a surface of a substrate, said device comprising:
a) a chamber able to hold the substrate and contact a nonaqueous nanoparticle solution with the surface of the substrate; b) one or more reservoirs containing components of the nonaqueous nanoparticle solution; c) one or more inputs connecting the chamber with the one or more reservoirs for transporting the components of the nonaqueous nanoparticle solution into the chamber; and d) one or more outputs able to transport the nonaqueous nanoparticle solution out of the chamber,
wherein the components of the nonaqueous nanoparticle solution comprise at least a nonaqueous polar solvent, a metal particle precursor and an ionic liquid, and wherein the m

Assignees

• Univ Arizona
• Arizona Board Of Regents On Behalf Of The Univ Ty Of Arizona

Inventors

• Hubbard Lance R
• Muscat Anthony

Classifications

• H10P14/46

  using a liquid · CPC title

• H10W20/043

  for electroplating · CPC title

• H10W20/023

  the interconnections being through-semiconductor vias · CPC title

• H10W20/01

  Manufacture or treatment · CPC title

• C23C18/1637

  metallic substrate · CPC title