Polyamide moulding composition and multi-layered structure made therefrom

Patent metadata

Field	Value
Publication number	US-2018112059-A1
Application number	US-201715789069-A
Country	US
Kind code	A1
Filing date	Oct 20, 2017
Priority date	Oct 21, 2016
Publication date	Apr 26, 2018
Grant date	—

Abstract

The present invention refers to a polyamide moulding composition having an excellent adhesion to metal surfaces. Moreover, the present invention refers to structural parts with a metal component directly bonded to a thermoplastic component (interconnected without using a bonding agent/layer). The present invention also relates to a method for manufacturing of such structural parts by an injection moulding or extrusion processes.

First claim

1 - 15 . (canceled)

16 . A polyamide moulding composition consisting of the following components:
(A) 25 to 99.3% by weight of at least one polyamide; (B) 0.5 to 15% by weight of at least one fluorene compound; (C) 0.2 to 3.0% by weight of at least one azine compound; (D) 0 to 70% by weight of at least one filler; and (E) 0 to 15.0% by weight of at least one additive, different from (B), (C) and (D); wherein the entirety of components (A) to (E) adds up to 100% by weight.

17 . The polyamide moulding composition according to claim 16 , in which each of the components (A) to (E) are present in the following weight proportions:
(A) 30.0 to 98.7% by weight of at least one polyamide; (B) 0.8 to 10.0% by weight of at least one fluorene compound; (C) 0.3 to 2.0% by weight of at least one azine compound; (D) 15.0 to 65.0% by weight of at least one filler; and (E) 0.2 to 10.0% by weight of at least one further additive, different from (B), (C) and (D).

18 . The polyamide moulding composition according to claim 16 , wherein the polyamide (A) is selected from the group consisting of
(A1) partially crystalline aliphatic polyamides selected from the group consisting of PA 46, PA 56, PA 6, PA 66, PA 6/66, PA 69, PA 610, PA 612, PA 614, PA 1010, PA 1012, PA 1014, PA 1212, PA 11, PA 12, PA 6/12, PA MXD6, PA MXD10 and copolymers and mixtures thereof; (A2) partially crystalline partially aromatic polyamides, selected from the group consisting of PA 4T/4I, PA 4T/6I, PA 5T/5I, PA 6T/6, PA 6T/6I, PA 6T/6I/6, PA 6T/6I/66, PA 6T/6I/610, PA 6T/6I/612, PA 6T/66, 6T/610, 6T/612, PA 6T/10T, PA 6T/10I, PA 9T, PA 9MT, PA 10T, PA 12T, PA 10T/10I, PA 10T/106, PA 10T/12, PA 10T/11, PA 6T/9T, PA 6T/12T, PA 6T/10T/6I, PA 6T/6I/6, PA 6T/6I/12, and mixtures thereof; (A3) cycloaliphatic polyamides, selected from the group consisting of MACM9, MACM10, MACM11, MACM12, MACM13, MACM14, MACM16, MACM18, PACM9, PACM10, PACM11, PACM12, PACM13, PACM14, PACM16, PACM18, TMDC9, TMDC10, TMDC11, TMDC12, TMDC13, TMDC14, TMDC15, TMDC16, TMDC17, TMDC18, MACMI/12, MACMT/12, MACMI/MACMT/12, 6I/6T/MACMI/MACMT/12, 3-6T, 6I/MACMI/MACMT, 6I/PACMI/PACMT, 6I/6T/MACMI, MACMI/MACM36, 12/PACMI or 12/MACMT, 6/PACMT, 6/IPDT or mixtures thereof, MACM9-18/P ACM9-18, MACM9-18/TMDC9-18, TMDC9-18/PACM9-18, and mixtures thereof; (A4) amorphous partially aromatic polyamides, selected from the group consisting of PA 5I, PA 6I, PA DI, PA 5I/5T, PA DI/DT, PA 6T/6I, PA5I/5T/6I/6T, PA 5I/5T/DI/DT, PA6I/6T/DI/DT, PA 6I/10I, PA 10I/10T, PA MXDI, MXD6/MXDI and copolymers and mixtures thereof; or mixtures of at least two the aforementioned types of polyamides (A1) to (A4), optionally with at least one of the polyamides (A3) and (A4), wherein “M” represents methyloctanediamine, “3-6” in 3-6T represents 3-6=trimethylhexa-methylene-1,6-diamine, and “D” in DI represents 2-methyl-1,5-pentandiamine.

19 . The polyamide moulding composition according to claim 16 , wherein the at least one fluorene compound (B) is selected from the compounds according to formula 1

wherein at least one of the substituents R1, R2, R3 and R4 is not hydrogen,
wherein
R1 and/or R2 are selected from the group consisting of hydroxyphenyls, phenoxyalkanols, C1-C4-alkyl hydroxyphenyls, dihydroxyphenyls, trihydroxyphenyls, monoglycidyloxyphenyls, diglycidyloxyphenyls, triglycidyloxyphenyls, glycidyloxyalkoxyphenyls, aminophenyls, and hydroxy, and
R3 and R4 are hydrogen.

20 . The polyamide moulding composition according to claim 16 , wherein the at least one fluorene compound (B) is selected from the group consisting of
9,9-bis (hydroxyphenyl)fluorenes, 9,9-bis (phenoxyalkanol) fluorenes, 9,9-bis (C1-C4-alkyl hydroxyphenyl) fluorenes, 9,9-bis (dihydroxyphenyl) fluorenes, 9,9-bis (trihydroxyphenyl) fluorenes, 9,9-bis (monoglycidyloxyphenyl) fluorenes, 9,9-bis (diglycidyloxyphenyl) fluorenes, 9,9-bis (triglycidyloxyphenyl) fluorenes, 9,9-bis (glycidyloxyalkoxyphenyl) fluorenes, 9,9-bis (4-aminophenyl) fluorenes, 9,9-bis hydroxy fluorine, and mixtures and combinations thereof.

21 . The polyamide moulding composition according to claim 16 , wherein the at least one azine compound is selected from the group consisting of nigrosines and indulines.

22 . The polyamide moulding compositions according to claim 16 , wherein the at least one azine compound is particulate with a volume average particle size X50 according to ISO 13320:2009 ranging from 5 to 20 microns.

23 . The polyamide moulding compositions according to claim 16 , wherein the at least one filler (D) is selected from the group consisting of (D1) fibers and (D2) particulate fillers.

24 . The polyamide moulding compositions according to claim 16 , wherein the at least one additive, different from (B), (C) and (D), is selected from the group consisting of
(E1) heat stabilizers and (E2) UV- and light-stabilizers, lubricants, processing aids, coloring- and marking materials, organic pigments, IR absorbers, antistatic agents, antiblocking agents, crystal-growth inhibitors, nucleation agents, condensation catalysts, chain extenders, defoamers, chain-lengthening additives, conductivity additives, such as carbon black, graphite, carbon nanotubes, graphene, mould-release agents, separating agents, flame retardants, non-halogen-containing flame retardants, anti-dripping-agents, impact modifiers, optical brighteners, photochromic additives, metallic pigments and mixtures and combinations thereof.

25 . The polyamide moulding composition according to claim 16 , consisting of the following components:
(A) 30.0 to 88.4% by weight of a partially crystalline aliphatic polyamide, (B) 1.0 to 10.0% by weight of at least one fluorene compound, (C) 0.4 to 1.5% by weight of at least one azine compound, (D) 10.0 to 68.4% by weight of the following fillers
(D1) 10 to 60% by weight of glass fibers and
(D2) 0 to 30% by weight of a at least one particulate filler,
(E) 0.2 to 10.0% by weight of at least one of the following additives
(E1) 0.2 to 2.0% by weight of at least one heat stabilizer
(E2) 0 to 8.0% by weight of at least one further additive,
wherein the entirety of components (A) to (E) adds up to 100% by weight.

26 . A multilayer structure comprising a substrate and at least one layer made of a thermoplastic component comprising the polyamide composition according to claim 16 which is in direct contact with the substrate.

27 . The multilayer structure according to claim 26 , wherein the substrate is a metal substrate.

28 . A method for the production of a multilayer structure according to claim 26 , comprising the following steps:
a) providing a substrate, b) introducing the substrate into an injection mold, c) injection moulding a thermoplastic component comprising the polyamide composition onto or around the substrate, wherein the metal component is at a temperature in the range of 80 to 200° C., and d) demolding the metal-thermoplastic component assembly after cooling.

29 . The method for the production of a multilayer structure according to claim 26 , comprising the following steps:
a) providing a substrate, b) providing at least one moulded part made of a polyamide moulding composition, c) heating the substrate and/or the at least one moulded part at least in the regions in which a permanent contact between the substrate and the at least one moulded part is to be established to a temperature at which the polyamide moulding composition becomes thermoelastic or thermoplastic, and d) co

Assignees

• Ems Patent Ag

Inventors

• Fujii Takamasa
• Sasaki Naoyuki

Classifications

• C08K3/013

  Fillers, pigments or reinforcing additives · CPC title

• C08K13/04

  Ingredients characterised by their shape and organic or inorganic ingredients · CPC title

• B29C45/0001

  characterised by the choice of material · CPC title

• C08L77/06 Primary

  Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title

• B32B15/088

  comprising polyamides · CPC title