Polyamide moulding composition and multi-layered structure made therefrom
US-10577478-B2 · Mar 3, 2020 · US
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Patent family 57209217
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 57209217 |
| Family type | — |
| Earliest priority | Oct 21, 2016 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10577478B2 — Polyamide moulding composition and multi-layered structure made therefrom |
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US10577478B2 — Polyamide moulding composition and multi-layered structure made therefrom (published Mar 3, 2020)
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