Fixing structure and fixing method

Patent metadata

Field	Value
Publication number	US-2018097294-A1
Application number	US-201715821886-A
Country	US
Kind code	A1
Filing date	Nov 24, 2017
Priority date	Oct 20, 2015
Publication date	Apr 5, 2018
Grant date	—

Abstract

A fixing method for fixing a terminal to a conductive pattern with a brazing filler metal disposed therebetween includes: a first step of disposing the brazing filler metal on the conductive pattern; a second step of bringing the terminal into contact with the brazing filler metal; and a third step of forming a penetrating hole in the terminal by irradiating a laser beam onto the terminal. In the third step, the laser beam is irradiated onto the terminal in such a manner that the penetrating hole is filled with the brazing filler metal melted by the irradiation of the laser beam.

First claim

What is claimed is:

1 . A fixing structure comprising:
a substrate; a conductive pattern formed on the substrate; an adhesive layer formed of a brazing filler metal; and a terminal, the terminal being fixed to the conductive pattern by the adhesive layer, wherein a penetrating hole is formed in the terminal, the penetrating hole being gradually widened in a direction apart from the substrate, and the penetrating hole is filled with the brazing filler metal.

2 . The fixing structure according to claim 1 , wherein the brazing filler metal spreads over an upper surface of the terminal.

3 . The fixing structure according to claim 1 , wherein a boundary between the penetrating hole and the brazing filler metal is curved.

4 . The fixing structure according to claim 1 , wherein a boundary between the penetrating hole and the brazing filler metal is curved to be convex inward.

5 . The fixing structure according to claim 1 , wherein the conductive pattern and the adhesive layer are fixed to each other by wetting phenomena.

6 . A fixing structure comprising:
a wire including a conductor; a brazing filler metal wetting the conductor; and a terminal, the terminal being fixed to the conductor by the brazing filler metal, wherein a penetrating hole is formed in the terminal, the penetrating hole being gradually widened in a direction apart from a central axis of the conductor, and the penetrating hole is filled with the brazing filler metal.

7 . The fixing structure according to claim 6 , wherein the brazing filler metal spreads over an upper surface of the terminal.

8 . The fixing structure according to claim 6 , wherein a boundary between the penetrating hole and the brazing filler metal is curved.

9 . The fixing structure according to claim 6 , wherein a boundary between the penetrating hole and the brazing filler metal is curved to be convex inward.

10 . The fixing structure according to claim 6 , wherein the conductor and the brazing filler metal are fixed to each other by wetting phenomena.

11 . The fixing structure according to claim 6 , further comprising a fixing structure body including a wire holding body configured to hold the wire and a terminal holding body configured to hold the terminal,
wherein the wire holding body and the terminal holding body are mated together.

12 . The fixing structure according to claim 11 , wherein the terminal is supported by the fixing structure body at two locations sandwiching a portion of the terminal, the two locations comprising the portion being connected and fixed to the conductor.

13 . The fixing structure according to claim 11 , wherein a mating surface of the terminal holding body with respect to the wire holding body is inclined with respect to a fixed surface of the terminal in such a manner that the brazing filler metal is pressed against the fixed surface of the terminal when the wire holding body and the terminal holding body are mated together.

14 . The fixing structure according to claim 1 , wherein
the terminal is a Cu-based or Au-based metal, and the brazing filler metal is a solder.

Assignees

• Japan Aviation Electronics Ind Ltd

Inventors

• Yoshida Takushi
• Akimoto Hiroshi
• Seki Yosuke

Classifications

• H01R43/0221

  Laser welding (H01R43/0228 takes precedence) · CPC title

• H05K2203/043

  Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste · CPC title

• B23K1/0056

  soldering by means of beams, e.g. lasers, electron beams [EB] · CPC title

• H01R43/0235

  for applying solder (H01R43/0228 takes precedence) · CPC title

• H01R4/024 Primary

  comprising preapplied solder · CPC title