New metal plating compositinos

Patent metadata

Field	Value
Publication number	US-2018093957-A1
Application number	US-201515559542-A
Country	US
Kind code	A1
Filing date	Apr 28, 2015
Priority date	Apr 28, 2015
Publication date	Apr 5, 2018
Grant date	—

Abstract

Reaction products of primary and secondary diamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.

First claim

What is claimed is:

1 . A reaction product of one or more diamines comprising primary or secondary amine moieties and one or more compounds having formula:

where R is a linking group.

2 . The reaction product of claim 1 , wherein R comprises:

where R 1 , R 2 , R 3 and R 4 may be the same or different and comprise hydrogen, linear or branched (C 1 -C 4 )alkyl, hydroxyl, hydroxy(C 1 -C 3 )alkyl, carboxyl, carboxy(C 1 -C 3 )alkyl or (C 1 -C 3 )alkoxy; R 5 and R 6 may be the same or different and comprise hydrogen, carboxyl and carboxy(C 1 -C 3 )alkyl; R 7 , R 8 , R 9 and R 10 may be the same or different and comprise hydrogen, linear or branched (C 1 -C 5 )alkyl, linear or branched hydroxy(C 1 -C 5 )alkyl, carboxy(C 1 -C 3 )alkyl, linear or branched (C 1 -C 5 )alkoxy; R 11 and R 12 may be the same or different and comprise hydrogen or linear or branched (C 1 -C 5 )alkyl, Ar is an aryl group having 5 to 6 carbon atoms; n and m may be the same or different and are integers of 1 to 15; and q, r and t may be the same or different are integers of 1 to 10.

3 . The reaction product of claim 1 , wherein the one or more diamines comprises a formula:

where R′ is a linking group and R 13 and R 14 may be the same or different and comprise hydrogen, linear or branched (C 1 -C 12 )alkyl, alkyleneoxy or substituted or unsubstituted (C 6 -C 18 )aryl.

4 . The reaction product of claim 3 , wherein R′ comprises:

or
a substituted or unsubstituted (C 6 -C 18 )aryl; where R 15 -R 22 may be the same or different and comprise hydrogen, linear or branched (C 1 -C 5 )alkyl, linear or branched hydroxy(C 1 -C 5 )alkyl or linear or branched (C 1 -C 5 )alkoxy; and Z is a carbon atom or nitrogen atom; and p and s may be the same or different and are independently integers of one or greater, e is an integer of 0 to 3, and a, b, c and d may be the same or different and are numbers from 1 or greater.

5 . The reaction product of claim 1 , wherein the one or more diamines comprises a formula:

where R 23 and R 24 may be the same or different and are hydrogen or amino(C 1 -C 10 )alkyl, preferably R 23 and R 24 are hydrogen or amino(C 1 -C 3 )alkyl.

6 . A composition comprising one or more sources of metal ions, an electrolyte and a reaction product of one or more diamines comprising primary or secondary amine moieties and one or more compounds having formula:

where R is a linking group.

7 . A method comprising:
a) contacting a substrate to be metal plated with a composition comprising: one or more sources of metal ions, an electrolyte and a reaction product of one or more reaction products of one or more diamines comprising primary or secondary amine moieties and one or more compounds having formula:

where R is a linking group;
b) contacting the substrate with the composition;
c) applying a current to the substrate; and
d) plating a metal on the substrate.

8 . The method of claim 7 , wherein the one or more sources of metal ions of the electroplating composition is chosen from copper salts and tin salts.

9 . The method of claim 7 , wherein the substrate comprises a plurality of through-holes and vias.

Assignees

• Dow Global Technologies Llc
• Rohm & Haas Elect Mat

Inventors

• Duan Lingli
• Chen Chen
• Feng Shaoguang
• Niazimbetova Zukhra I
• Rzeznik Maria Anna

Classifications

• C25D3/32 Primary

  characterised by the organic bath constituents used · CPC title

• C25D3/38

  of copper · CPC title

• C09D179/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• C08G73/10

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• C25D7/123

  Semiconductors first coated with a seed layer or a conductive layer · CPC title