Resin composition, prepreg, metal-foil-clad laminate, resin sheet, and printed wiring board

Patent metadata

Field	Value
Publication number	US-2018092218-A1
Application number	US-201615564073-A
Country	US
Kind code	A1
Filing date	Apr 20, 2016
Priority date	Apr 28, 2015
Publication date	Mar 29, 2018
Grant date	—

Abstract

The present invention provides a resin composition comprising a cyanate compound (A); and an epoxy resin (B) represented by following general formula (1):

wherein m and n each independently represent an integer of 1 or more; and the epoxy resin (B) represented by general formula (1) may be a mixture of compounds in which m and n each independently represent a different integer.

First claim

1 . A resin composition comprising a cyanate compound (A); and an epoxy resin (B) represented by following general formula (1):

wherein m and n each independently represent an integer of 1 or more; and the epoxy resin (B) represented by the general formula (1) may be a mixture of compounds in which m and n each independently represent a different integer.

2 . The resin composition according to claim 1 , wherein a content of the epoxy resin (B) represented by the general formula (1) is 1 to 90 parts by mass based on a total amount (100 parts by mass) of resin solids in the resin composition.

3 . The resin composition according to claim 1 , further comprising a filler (C).

4 . The resin composition according to claim 1 , further comprising one or two or more selected from the group consisting of an epoxy resin other than the epoxy resin (B) represented by the general formula (1), a maleimide compound, a phenolic resin, an oxetane resin, a benzoxazine compound, and a compound having a polymerizable unsaturated group.

5 . The resin composition according to claim 3 , wherein a content of the filler (C) is 50 to 1600 parts by mass based on a total amount (100 parts by mass) of the resin solids in the resin composition.

6 . A prepreg comprising: a base material; and the resin composition according to claim 1 with which the base material is impregnated or coated.

7 . A metal foil-clad laminate comprising one of the prepreg according to claim 6 ; and metal foil laminate-molded on one surface or both surfaces of the prepreg.

8 . A resin sheet comprising a sheet base material; and the resin composition according to claim 1 with which one surface or both surfaces of the sheet base material is coated and which is dried.

9 . A printed wiring board comprising an insulating layer comprising the resin composition according to claim 1 ; and a conductor layer formed on one surface or both surfaces of the insulating layer.

10 . A metal foil-clad laminate comprising two or more of the prepregs according to claim 6 laminated; and metal foil laminate-molded on one surface or both surfaces of the prepreg.

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Kobayashi Takashi
• Takano Kentaro

Classifications

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• H05K3/0017 Primary

  Etching of the substrate by chemical or physical means · CPC title

• C08L2203/206

  use in coating or encapsulating of electronic parts · CPC title

• C08G59/22

  Di-epoxy compounds · CPC title

• C08K3/36

  Silica · CPC title