Substrate alignment apparatus, substrate processing apparatus, substrate arrangement apparatus, substrate alignment method, substrate processing method, and substrate arrangement method

Patent metadata

Field	Value
Publication number	US-2018090360-A1
Application number	US-201715693708-A
Country	US
Kind code	A1
Filing date	Sep 1, 2017
Priority date	Sep 29, 2016
Publication date	Mar 29, 2018
Grant date	—

Abstract

In a substrate alignment apparatus, a motor sequentially rotates a plurality of substrates in a circumferential direction, the substrates being to be held in a vertical posture at a lower edge portion by a substrate holder. A controller controls the motor on the basis of warpage-and-notch-position information and input information that is input about a warped state of the substrates, to determine circumferential positions of the notches of the substrates. This reduces a distance in a thickness direction between a lower edge portion and an upper edge of each substrate that is held by the substrate holder. As a result, it is possible to facilitate handling of a plurality of substrates held by the substrate holder.

First claim

1 . A substrate alignment apparatus for aligning a plurality of substrates, each substrate having a notch in a peripheral portion, the apparatus comprising:
a rotor for rotating a plurality of substrates either sequentially or simultaneously in a circumferential direction, said plurality of substrates being to be held in a vertical posture at a lower edge portion by a substrate holder; a storage for storing warpage-and-notch-position information that includes a plurality of combinations of a warped state of said plurality of substrates and a notch position at which a substrate in said warped state is held in a proper posture by said substrate holder; and a controller for controlling said rotor, wherein said controller controls said rotor on the basis of said warpage-and-notch-position information and input information that is input about the warped state of said plurality of substrates, to rotate said plurality of substrates either sequentially or simultaneously in said circumferential direction and determine positions in said circumferential direction of said notches of said plurality of substrates and thereby to reduce a distance in a thickness direction between a lower edge portion and an upper edge of said each substrate that is held by said substrate holder.

2 . The substrate alignment apparatus according to claim 1 , wherein
said each substrate is curved in a first radial direction to one side in said thickness direction with a first curvature, and said each substrate is curved in a second radial direction orthogonal to said first radial direction to said one side in said thickness direction with a second curvature greater than said first curvature.

3 . The substrate alignment apparatus according to claim 1 , wherein
said each substrate is curved in a first radial direction to one side in said thickness direction, and said each substrate is curved in a second radial direction orthogonal to said first radial direction to the other side in said thickness direction.

4 . A substrate processing apparatus comprising:
the substrate alignment apparatus according to claim 1 ; said substrate holder for holding said plurality of substrates aligned by said substrate alignment apparatus; and a liquid processing part for retaining a processing liquid in which said plurality of substrates held by said substrate holder are to be immersed.

5 . A substrate arrangement apparatus comprising:
the substrate alignment apparatus according to claim 1 ; said substrate holder for holding said plurality of substrates aligned by said substrate alignment apparatus; and a substrate arrangement mechanism for disposing each of said plurality of substrates held by said substrate holder between each pair of another plurality of substrates that are held by another substrate holder.

6 . A substrate alignment apparatus for aligning a plurality of substrates, each substrate having a notch in a peripheral portion, the apparatus comprising:
a rotor for rotating a plurality of substrates either sequentially or simultaneously in a circumferential direction, said plurality of substrates being to be supported in a horizontal posture at a lower surface by a substrate holder; a storage for storing warpage-and-notch-position information that includes a plurality of combinations of a warped state of said plurality of substrates and a notch position at which a substrate in said warped state is held in a proper posture by said substrate holder; and a controller for controlling said rotor, wherein said controller controls said rotor on the basis of said warpage-and-notch-position information and input information that is input about the warped state of said plurality of substrates, to rotate said plurality of substrates either sequentially or simultaneously in said circumferential direction and determine positions in said circumferential direction of said notches of said plurality of substrates and thereby to reduce a distance in a thickness direction between a top of said each substrate that is held by said substrate holder and an area of contact of said peripheral portion of said each substrate with said substrate holder.

7 . The substrate alignment apparatus according to claim 6 , wherein
said each substrate is curved in a first radial direction to one side in said thickness direction with a first curvature, and said each substrate is curved in a second radial direction orthogonal to said first radial direction to said one side in said thickness direction with a second curvature greater than said first curvature.

8 . The substrate alignment apparatus according to claim 6 , wherein
said each substrate is curved in a first radial direction to one side in said thickness direction, and said each substrate is curved in a second radial direction orthogonal to said first radial direction to the other side in said thickness direction.

9 . A substrate alignment method for aligning a plurality of substrates, each substrate having a notch in a peripheral portion, the method comprising:
a) storing warpage-and-notch-position information that includes a plurality of combinations of a warped state of a plurality of substrates and a notch position, said plurality of substrates being to be held in a vertical posture at a lower edge portion by a substrate holder, and said notch position being a position at which a substrate in said warped state is held in a proper posture by said substrate holder; b) rotating said plurality of substrates either sequentially or simultaneously in a circumferential direction; and c) after said operation b), either sequentially or simultaneously determining positions in said circumferential direction of the notches of said plurality of substrates that have been aligned, wherein in said operation c), the position in said circumferential direction of said notch of said each substrate is determined on the basis of said warpage-and-notch-position information and input information that is input about the warped state of said plurality of substrates, to reduce a distance in a thickness direction between a lower edge portion and an upper edge of said each substrate that is held by said substrate holder.

10 . A substrate processing method comprising:
by using the substrate alignment method according to claim 9 , aligning said plurality of substrates; holding said plurality of substrates aligned by said substrate alignment method by said substrate holder; and immersing said plurality of substrates held by said substrate holder in a processing liquid.

11 . A substrate arrangement method comprising:
by using the substrate alignment method according to claim 9 , aligning said plurality of substrates; holding said plurality of substrates aligned by said substrate alignment method by said substrate holder; and disposing each of said plurality of substrates held by said substrate holder between each pair of another plurality of substrates that are held by another substrate holder.

12 . A substrate alignment method for aligning a plurality of substrates, each substrate having a notch in a peripheral portion, the method comprising:
a) storing warpage-and-notch-position information that includes a plurality of combinations of a warped state of a plurality of substrates and a notch position, said plurality of substrates being to be supported in a horizontal posture at a lower surface by a substrate holder, and said notch position being a position at which a substrate in said warped state is held in a proper posture by said substrate holder; b) rotating said plurality of substrates either sequentially or simultaneously in a circumferential direction; and c) after said operat

Assignees

• Screen Holdings Co Ltd

Inventors

• Miyamoto Yukiteru

Classifications

• H10P72/7621

  characterised by supporting two or more semiconductor substrates · CPC title

• H10P72/3412

  Batch transfer of wafers · CPC title

• H10P72/0616

  Monitoring of warpages, curvatures, damages, defects or the like · CPC title

• H10P72/0404

  for general liquid treatment, e.g. etching followed by cleaning · CPC title

• H10P70/20

  Cleaning during device manufacture · CPC title