Flexible conductive film and process for producing the same

Patent metadata

Field	Value
Publication number	US-2018019038-A1
Application number	US-201515539579-A
Country	US
Kind code	A1
Filing date	Dec 25, 2015
Priority date	Dec 26, 2014
Publication date	Jan 18, 2018
Grant date	—

Abstract

A first object is to provide a conductive film which is flexible from the standpoint that bending in a bending test or the like does not largely change its electrical resistance. Provided is a process for producing a flexible conductive film including applying a solution or dispersion containing at least any one of metal organic compounds, metals, and metal oxides onto a base material and treating the resulting film by at least either one of a heating step at a temperature not deteriorating the base material or an irradiation step with ultraviolet light, microwaves, or plasma.

First claim

1 . A flexible conductive film formed on a base material, wherein the conductive film comprises a metal oxide.

2 . The flexible conductive film according to claim 1 , wherein the conductive film comprises, as a main component thereof, one or more components selected from ruthenium oxides, perovskite oxides, and tin oxides.

3 . The flexible conductive film according to claim 1 , wherein the conductive film has a laminated structure of a metal film and a metal oxide film.

4 . The flexible conductive film according to claim 1 , wherein the conductive film is a composite between metal fine particles and metal oxide fine particles.

5 . The flexible conductive film according to claim 1 , wherein the conductive film is a composite between a metal selected from silver, palladium, copper and nickel, and metal oxide fine particles.

6 . The flexible conductive film according to claim 1 , wherein the conductive film is a metal oxide film having an amorphous phase and a crystal phase.

7 . The flexible conductive film according to claim 1 , wherein the conductive film is a metal oxide film prepared by at least either one of irradiation with ultraviolet light or irradiation with plasma.

8 . The flexible conductive film according to claim 1 , obtained by applying a solution or a dispersion containing at least one of metal organic compounds, metals, and metal oxides onto a base material and treating the resulting film by at least either one of a heating step at a temperature not deteriorating the base material and an irradiation step with ultraviolet light, microwaves, or plasma.

9 . The flexible conductive film according to claim 1 obtained by applying a dispersion obtained by mixing metal oxide particles having amorphous or crystallinity with a metal organic compound onto a base material and treating the resulting film by at least either one of a heating step at a temperature not deteriorating the base material or an irradiation step with ultraviolet light, microwaves, or plasma.

10 . The flexible conductive film according to claim 8 , wherein the metal organic compound comprises at least one of metal acetylacetonates, metal organic acid salts, and metal alkoxides.

11 . The flexible conductive film according to claim 1 , obtained by applying a solution containing amorphous metal oxide particles and any of metal acetylacetonates, metal organic acid salts, and metal alkoxides to a base material, followed by irradiation with ultraviolet light or plasma.

12 . The flexible conductive film according to claim 1 , wherein the base material has, as a main component thereof, one or more of polyimides, acrylic resins, polyesters, polyacrylonitrile, aramid resins, liquid crystal polymers (LCP), polyether imides (PEI), and polycarbonates.

13 . The flexible conductive film according to laim 1 , wherein the conductive film has carbon formed by a photo reaction of the precursor raw material and/or the resin caused by ultraviolet irradiation.

14 . The flexible conductive film according to claim 1 , wherein the conductive film has a sheet resistance of 300 Ω/□ or less at room temperature when the film has a thickness of 500 nm or less.

15 . The flexible conductive film according to claim 1 , wherein a change in resistance that occurs from room temperature to 300° C. is within 5%.

16 . A process for producing the flexible conductive film as claimed in claim 1 , wherein the process comprises a step of applying, onto a base material, a solution or dispersion containing at least any one of metal organic compounds, metals, and metal oxides and treating the resulting film by at least either one of a heating step at a temperature not deteriorating the base material or an irradiation step with ultraviolet light, microwaves, or plasma.

Assignees

• Aist

Inventors

• Tsuchiya Tetsuo
• UZAWA Yuuko
• Nakajima Tomohiko

Classifications

• H05K1/0259

  Electrostatic discharge [ESD] protection · CPC title

• H01B5/14

  comprising conductive layers or films on insulating-supports · CPC title

• H05K2201/0715

  provided by an outer layer of PCB · CPC title

• H05K2201/0154

  Polyimide · CPC title

• H01B13/0016

  for heat treatment · CPC title