Liquid ejecting head and method of manufacturing liquid ejecting head

Patent metadata

Field	Value
Publication number	US-2016263887-A1
Application number	US-201615006756-A
Country	US
Kind code	A1
Filing date	Jan 26, 2016
Priority date	Mar 10, 2015
Publication date	Sep 15, 2016
Grant date	—

Abstract

A liquid ejecting head and a method of manufacturing the liquid ejecting head are provided. The liquid ejecting head has a pressure chamber forming substrate that includes a plurality of piezoelectric elements and that is connected to a first surface of a sealing plate, a driver IC that outputs signals that drive the piezoelectric elements and that is provided on a second surface of the sealing plate that is on the opposite side to the first surface, and a power supply wire that supplies electrical power to the piezoelectric elements, that is formed in the second surface of the sealing plate, and that has at least one portion thereof embedded in the sealing plate and a surface thereof exposed on the second surface side.

First claim

What is claimed is:

1 . A liquid ejecting head comprising:
a wiring substrate having a first surface that is connected to a driver element forming substrate in which a plurality of driver elements are provided, and a second surface that is on the opposite side to the first surface and that is provided with a driver IC that outputs signals that drive the driver elements; wherein a wire that supplies electrical power to the driver elements is formed in the second surface of the wiring substrate, and at least one portion of the wire is embedded in the wiring substrate and a surface of the wire is exposed on the second surface side.

2 . The liquid ejecting head according to claim 1 , wherein the wire is formed of an embedded wire that is composed of a conductive material and that is embedded inside the wiring substrate and an outer layer wire that is composed of a conductive material that is different from the conductive material of the embedded wire, the outer layer wire covering the second surface side of the embedded wire.

3 . The liquid ejecting head according to claim 1 , wherein the driver IC has a plurality of circuit blocks that generate the signals that individually drive the driver elements and a plurality of bump electrodes that connect to the circuit blocks in a first direction, and
the wire that extends in the first direction and that is connected to the plurality of bump electrodes.

4 . A method of manufacturing a liquid ejecting head that has a wiring substrate having a first surface that is connected to a driver element forming substrate in which a plurality of driver elements are provided and a second surface that is on the opposite side to the first surface and that is provided with a driver IC that outputs signals that drive the driver elements, a wire in the second surface that supplies electrical power to the driver elements and a through wire that extends between the first surface and the second surface, the method comprising:
processing a wiring substrate so as to form a recessed portion that is recessed in the second surface of the wiring substrate in a thickness direction thereof and a through hole that penetrates through the wiring substrate, and forming the wire by filling a conductive material into the recessed portion and the through wire by filling the conductive material into the through hole.

5 . The method of manufacturing a liquid ejecting head according to claim 4 ,
wherein the forming of the wire involves forming the conductive material in the recessed portion and the through hole by electroplating.

6 . The method of manufacturing a liquid ejecting head according to claim 4 further comprising:
forming an outer layer wire that covers the second surface side of the wire embedded in the wiring substrate with a conductive material that is different from the conductive material of the wire embedded in the wiring substrate.

Assignees

• Seiko Epson Corp

Inventors

• Tanaka Shuichi

Classifications

• B41J2/1635

  dividing the wafer into individual chips · CPC title

• B41J2002/14362

  Assembling elements of heads · CPC title

• B41J2002/14491

  Electrical connection · CPC title

• B41J2202/18

  Electrical connection established using vias · CPC title

• B41J2/1628

  dry etching · CPC title