Laser device

Patent metadata

Field	Value
Publication number	US-2018013263-A1
Application number	US-201515539719-A
Country	US
Kind code	A1
Filing date	Feb 6, 2015
Priority date	Feb 6, 2015
Publication date	Jan 11, 2018
Grant date	—

Abstract

A laser device has a plurality of laser diodes; a plurality of optical elements installed corresponding to the plurality of the laser diodes; a plurality of units formed by fixing the laser diodes and the optical elements per each laser diode and installed corresponding to the plurality of the laser diodes; a converging element that converges laser beams emitted from the plurality of the laser diodes to a fiber; a housing element houses the plurality of the units and the converging element; and a thermal transfer plate performs heat dissipation of the plurality of the units. The heat resistance reducing element having a heat resistance value that is smaller than a predetermined value is installed between the thermal transfer plate and each unit or the processing for reducing the heat resistance is performed.

First claim

What is claimed is:

1 . A laser device, comprising:
a plurality of laser diodes; a plurality of optical elements installed corresponding to the plurality of the laser diodes; a plurality of units formed by fixing said laser diodes and optical elements per each laser diode and installed corresponding to said plurality of the laser diodes; a converging element that converges laser beams emitted from said plurality of the laser diodes to a fiber; a housing element that houses said plurality of the units and said converging element; and a thermal transfer plate that performs heat dissipation of said plurality of the units; wherein said laser device further comprises:
at least one a heat resistance reducing element having a heat resistance value that is smaller than a predetermined value, and is operative for a thermal resistance reducing processing for reducing the heat resistance, between said thermal transfer plate and each said unit.

2 . The laser device according to claim 1 , wherein:
said thermal resistance reducing element further comprising:
a spherical crown that is formed at an opposite side of the light emission direction of each unit and has a curvature center location coinciding with a curvature center location of each unit; and
wherein a spherical concave having a curvature center location coinciding with said curvature center location of each unit is formed in said thermal transfer plate.

3 . The laser device according to claim 1 , wherein:
said thermal resistance reducing processing is a cutting work processing for at least said thermal transfer plate and each unit.

4 . The laser device according to claim 1 , wherein:
said thermal resistance reducing processing is an addition machining processing using layer forming technology on at least said thermal transfer plate and each unit.

5 . The laser device according to claim 1 , wherein:
said thermal resistance reducing processing is an ablation processing for at least said thermal transfer plate and each unit.

6 . The laser device according to claim 1 , wherein:
said thermal resistance reducing element comprises a solder that solders between the said heat dissipation element and each unit.

7 . The laser device according to claim 1 , further comprising:
a cooling element for performing at least one of natural-cooling and forced-cooling of unit.

Assignees

• Shimadzu Corp

Inventors

• Sakamoto Junki
• Fukushi Ichiro
• Kadoya Akiyuki
• Watanabe Kazuma
• Ishigaki Naoya
• Saikawa Jiro
• Uno Shingo
• Hiroki Tomoyuki
• Tojo Koji

Classifications

• H01S5/02469

  Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC · CPC title

• H01S5/4012

  Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms · CPC title

• H01S5/02476 Primary

  Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements · CPC title

• G02B6/4206

  Optical features (G02B6/4207, G02B6/421 take precedence) · CPC title

• G02B6/4272

  with mounting substrates of high thermal conductivity · CPC title