Anisotropic conductive film

Patent metadata

Field	Value
Publication number	US-2018002575-A1
Application number	US-201615541881-A
Country	US
Kind code	A1
Filing date	Jan 13, 2016
Priority date	Jan 13, 2015
Publication date	Jan 4, 2018
Grant date	—

Abstract

An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

First claim

1 . An anisotropic conductive film comprising an insulating adhesive layer and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view, wherein the conductive particle has a conductive particle diameter of 10 μm or more, the film has a thickness of 1 or more times and 3.5 or less times the conductive particle diameter, and positions of the conductive particles are varied in a thickness direction of the film within a variation range of less than 10% of the conductive particle diameter.

2 . The anisotropic conductive film according to claim 1 , wherein the thickness of the anisotropic conductive film is 1 or more times and 2.5 or less times the conductive particle diameter.

3 . The anisotropic conductive film according to claim 1 , wherein a distance between one surface of the anisotropic conductive film and each conductive particle is 10% or more of the conductive particle diameter.

4 . The anisotropic conductive film according to claim 1 , wherein a difference between maximum and minimum values of particle densities, as viewed in a plan view, measured at ten regions which each have an area of 1 mm×1 mm and are extracted in a longitudinal direction of the anisotropic conductive film is less than 20% of an average of the particle densities at the respective region.

5 . The anisotropic conductive film according to claim 1 , wherein a particle density of the conductive particles is 20 to 2,000 particles/mm 2 .

6 . The anisotropic conductive film according to claim 1 , wherein an alignment mark for an electronic component to be anisotropically, conductively connected is formed by an arrangement of particles for an alignment mark.

7 . A connection structure wherein a first electronic component and a second electronic component are anisotropically, conductively connected by the anisotropic conductive film according to claim 1 .

8 . The connection structure according to claim 7 , wherein the first electronic component is a wiring substrate and the second electronic component is a camera module.

Assignees

• Dexerials Corp

Inventors

• Sato Daisuke
• Akutsu Yasushi
• Odaka Ryousuke
• Tanaka Yusuke

Classifications

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• G03B17/02

  Bodies · CPC title

• H01B5/16

  comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber (H01B1/14, H01B1/20 take precedence; insulating bodies with conductive admixtures H01B17/64; conductive paints C09D5/24) · CPC title

• H01R11/01

  characterised by the form or arrangement of the conductive interconnection between the connecting locations · CPC title

• H01B1/22

  the conductive material comprising metals or alloys · CPC title