Anisotropic conductive film and connected structure

Patent metadata

Field	Value
Publication number	US-10522502-B2
Application number	US-201415030509-A
Country	US
Kind code	B2
Filing date	Nov 18, 2014
Priority date	Nov 19, 2013
Publication date	Dec 31, 2019
Grant date	Dec 31, 2019

Abstract

Anisotropic conductive films, each including an insulating adhesive layer and conductive particles insulating adhesive layer in a lattice-like manner. Among center distances between an arbitrary conductive particle and conductive particles adjacent to the conductive particle, the shortest distance to the conductive particle is a first center distance; the next shortest distance is a second center distance. These center distances are 1.5 to 5 times the conductive particles' diameter. The arbitrary conductive particle, conductive particle spaced apart from the conductive particle by the first center distance, conductive particle spaced apart from the conductive particle by first center distance or second center distance form an acute triangle. Regarding this acute triangle, an acute angle formed between a straight line orthogonal to a first array direction passing through the conductive particles and second array direction passing through conductive particles being 18 to 35° . These anisotropic conductive films have stable connection reliability in COG connection.

First claim

The invention claimed is:

1. An anisotropic conductive film comprising an insulating adhesive layer and conductive particles arranged in the insulating adhesive layer in a lattice-like manner, wherein when among center distances between an arbitrary conductive particle and conductive particles adjacent to the conductive particle, a shortest distance to the arbitrary conductive particle is defined as a first center distance, and a next shortest distance is defined as a second center distance, the first center distance and the second center distance are each 1.5 to 5 times a particle diameter of the conductive particles, and the difference between the first center distance and the second center distance is less than 1.5 times the particle diameter of the conductive particles.

2. The anisotropic conductive film according to claim 1 , wherein, regarding an acute triangle formed by an arbitrary conductive particle P 0 , a conductive particle P 1 spaced apart from the arbitrary conductive particle P 0 by the first center distance, and a conductive particle P 2 spaced apart from the arbitrary conductive particle P 0 by the first center distance or the second center distance, an acute angle is formed between a straight line orthogonal to a direction (hereinafter, referred to as a first array direction) of a straight line passing through the conductive particles P 0 and P 1 and a direction (hereinafter, referred to as a second array direction) of a straight line passing through the conductive particles P 1 and P 2 .

3. The anisotropic conductive film according to claim 2 , wherein, the acute angle a formed between the straight line orthogonal to the first array direction and the second array direction is 18 to 35°.

4. The anisotropic conductive film according to claim 2 , wherein the first array direction is substantially parallel to a longitudinal direction of the anisotropic conductive film.

5. The anisotropic conductive film according to claim 2 , wherein, when a direction passing through the conductive particles P 0 and P 2 is defined as a third array direction, the first array direction, the second array direction, and the third array direction are tilted with respect to the longitudinal direction of the anisotropic conductive film.

6. The anisotropic conductive film according to claim 5 , wherein an angle β formed between the first array direction and the longitudinal direction of the anisotropic conductive film is 5 to 25° .

7. The anisotropic conductive film according to claim 1 , wherein a density of the conductive particles is 2000 to 250000 particles/mm 2 .

8. A connecting method of connecting a connection terminal of a first electronic component and a connection terminal of a second electronic component with the anisotropic conductive film according to claim 2 , wherein a longitudinal direction of a connection terminal of the anisotropic conductive film is made coincident with a widthwise direction of the connection terminal of the first electronic component or the second electronic component.

9. The connecting method according to claim 8 , wherein a direction substantially orthogonal to the first array direction of the anisotropic conductive film is made coincident with a longitudinal direction of the connection terminal of the first electronic component or the second electronic component.

10. The connecting method according to claim 8 , wherein the first electronic component is a glass substrate having a connection terminal formed from a transparent electrode, and the second electronic component is an IC chip.

11. The connecting method according to claim 8 , wherein a size of a connection surface of the connection terminal is 8 to 60 m in width and 400 μm or less in length.

12. A connected structure in which a first electronic component and a second electronic component are connected through anisotropic conductive connection by the anisotropic conductive film according to claim 1 .

13. A method for manufacturing a connected structure, comprising connecting a first electronic component to a second electronic component through anisotropic conductive connection by the anisotropic conductive film according to claim 1 .

14. The anisotropic conductive film according to claim 1 , wherein the first center distance and the second center distance are each 1.8 to 4.5 times the particle diameter of the conductive particles.

15. The anisotropic conductive film according to claim 1 , wherein the first center distance and the second center distance are each 2 to 4 times the particle diameter of the conductive particles.

16. The anisotropic conductive film according to claim 1 , wherein the difference between the first center distance and the second center distance is the same as or less than the particle diameter of the conductive particles.

17. The anisotropic conductive film according to claim 1 , wherein the difference between the first center distance and the second center distance is the same as or less than the particle diameter of the conductive particles.

18. The anisotropic conductive film according to claim 1 , wherein the insulating adhesive layer includes a plurality of resin layers.

19. An anisotropic conductive film comprising an insulating adhesive layer and conductive particles arranged in the insulating adhesive layer in a lattice-like manner,
wherein when among center distances between an arbitrary conductive particle and conductive particles adjacent to the conductive particle, a shortest distance to the arbitrary conductive particle is defined as a first center distance, and a next shortest distance is defined as a second center distance, and
the first center distance and the second center distance are each 1.5 to 5 times a particle diameter of the conductive particles,
wherein, regarding an acute triangle formed by an arbitrary conductive particle P 0 , a conductive particle P 1 spaced apart from the arbitrary conductive particle P 0 by the first center distance, and a conductive particle P 2 spaced apart from the arbitrary conductive particle P 0 by the first center distance or the second center distance, an acute angle is formed between a straight line orthogonal to a direction (hereinafter, referred to as a first array direction) of a straight line passing through the conductive particles P 0 and P 1 and a direction (hereinafter, referred to as a second array direction) of a straight line passing through the conductive particles P 1 and P 2 ,
wherein a number of continuously lacked conductive particles is 6 or less in each of the first array direction and the second array direction.

20. The anisotropic conductive film according to claim 1 , wherein a number of continuously lacked conductive particles is 6 or less in each of the first array direction and the second array direction.

21. The anisotropic conductive film according to claim 19 , wherein the insulating adhesive layer includes a plurality of resin layers.

22. The anisotropic conductive film according to claim 19 , wherein a difference between the first center distance and the second center distance is less than 2 times the particle diameter of the conductive particles.

23. The anisotropic conductive film according to claim 19 , wherein, regarding an acute triangle formed by an arbitrary conductive particle P 0 , a conductive particle P 1 spaced apart from the arbitrary conductive particle P 0 by the first center distance, and a conductive particle P 2 spaced apart from the arbitrary

Assignees

• Dexerials Corp

Inventors

• Shinohara Seiichiro

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/353

  not comprising solid metals or solid metalloids, e.g. ceramics · CPC title